A method of manufacturing a metal structure for an optical semiconductor device, including a treatment step (1) of immersing in and/or applying the solution containing a polyallylamine polymer a base body, the base body including an outermost layer at a portion or entire surfaces of the base body, the outermost layer including a plating of at least one selected from the group consisting of gold, silver, a gold alloy, and a silver alloy, so as to manufacture the metal structure for an optical semiconductor device having an increased adhesion to a resin material.

An object of the present invention is to provide an adhesive having sufficient adhesion strength during heat-curing when a lens holder and a substrate on which an imaging element is fixed are bonded in camera module assembly, and also having excellent adhesion strength and position accuracy after a high-temperature and high-humidity durability test after curing. The present invention relates to a resin composition comprises (a) a (meth)acrylate group-containing resin, (b) a specific polyfunctional thiol, and (c) a latent curing agent.

An object of the present invention is to provide an adhesive having sufficient adhesion strength during heat-curing when a lens holder and a substrate on which an imaging element is fixed are bonded in camera module assembly, and also having excellent adhesion strength and position accuracy after a high-temperature and high-humidity durability test after curing. The present invention relates to a resin composition comprises (a) a (meth)acrylate group-containing resin, (b) a specific polyfunctional thiol, and (c) a latent curing agent.

The present disclosure is directed to systems and methods for providing a dielectric layer on a semiconductor substrate capable of supporting very high density interconnects (i.e., ≥100 IO/mm). The dielectric layer includes a maleimide polymer in which a thiol-terminated functional group crosslinks with an epoxy resin. The resultant dielectric material provides a dielectric constant of less than 3 and a dissipation factor of less than 0.001. Additionally, the thiol functional group forms coordination complexes with noble metals present in the conductive structures, thus by controlling the stoichiometry of epoxy to polyimide, the thiol-polyimide may beneficially provide an adhesion enhancer between the dielectric and noble metal conductive structures.

The present invention provides a rubber composition obtained by kneading a rubber component, a vulcanization accelerator, silica, and a compound represented by the following formula (I): ##STR00001##
wherein the groups are as defined in the DESCRIPTION.

The present invention provides a rubber composition obtained by kneading a rubber component, a vulcanization accelerator, silica, and a compound represented by the following formula (I): ##STR00001##
wherein the groups are as defined in the DESCRIPTION.

Provided are methods of controlling disassociation of cells from a carrier, compositions, and methods of collecting cells. The methods of controlling disassociation of cells from a carrier may include contacting a polymeric carrier with one or more digesting agents to disassociate at least a portion of a plurality of cells from the polymeric carrier. The polymeric carrier may be crosslinked with a crosslinker including at least one of a redox sensitive moiety, a UV light sensitive moiety, a pH sensitive moiety, and a temperature sensitive moiety.

In a golf ball having a core, a cover and at least one intermediate layer between the core and the cover, the core is made of a material molded under heat from a rubber composition that includes (a) a base rubber, (b) a co-crosslinking agent which is an α,β-unsaturated carboxylic acid and/or a metal salt thereof, (c) an organic peroxide, (d) water, and (e) an antioxidant which is a benzimidazole of a specific formula and/or a metal salt thereof. The core and ball have compressive deformations within specific respective ranges when subjected to given loading conditions. This golf ball exhibits a low spin rate on shots, enabling the flight performance of the ball to be improved.

A flame-retardant antimicrobial agent is a polymer microsphere with the surface grafted thereof with a guanidine salt. The polymer microsphere has a cross-linked structure composed of a structural unit A derived from maleic anhydride, a structural unit B derived from a monomer M, and a structural unit C derived from a cross-linking agent. The monomer M is selected from a C.sub.4-C.sub.9 aliphatic olefin or a mixture thereof, and the guanidine salt comprises at least one guanidine salt having the property of flame resistance. The flame-retardant antimicrobial agent has both a good antimicrobial effect and a good flame-retardant effect. A flame-retardant antimicrobial thermoplastic resin composition containing the flame-retardant antimicrobial agent also has a good flame-retardant and antimicrobial performance and a good overall performance.

A flame-retardant antimicrobial agent is a polymer microsphere with the surface grafted thereof with a guanidine salt. The polymer microsphere has a cross-linked structure composed of a structural unit A derived from maleic anhydride, a structural unit B derived from a monomer M, and a structural unit C derived from a cross-linking agent. The monomer M is selected from a C.sub.4-C.sub.9 aliphatic olefin or a mixture thereof, and the guanidine salt comprises at least one guanidine salt having the property of flame resistance. The flame-retardant antimicrobial agent has both a good antimicrobial effect and a good flame-retardant effect. A flame-retardant antimicrobial thermoplastic resin composition containing the flame-retardant antimicrobial agent also has a good flame-retardant and antimicrobial performance and a good overall performance.