Patent classifications
C08K7/14
POLYCARBONATE/POLYORGANOSILOXANE COPOLYMER AND RESIN COMPOSITION INCLUDING SAID COPOLYMER
Provided is a polycarbonate-polyorganosiloxane copolymer, which is produced by using a diol monomer (a1) and a polyorganosiloxane (a2) satisfying the following condition, including: a polyorganosiloxane block (A-1) including a specific repeating unit; and a polycarbonate block (A-2) formed of a specific repeating unit: a mixture, which is obtained by bringing the diol monomer (a1), the polyorganosiloxane (a2), a carbonic acid diester, and a basic catalyst present at the same amount ratio as that at a time of production of the polycarbonate-polyorganosiloxane copolymer into contact with each other at from 100° C. to 250° C. for from 0.5 hour to 5 hours, has a haze value of 30 or less measured under conditions of 23° C. and an optical path length of 10 mm in conformity with ISO 14782:1999.
POLYCARBONATE/POLYORGANOSILOXANE COPOLYMER AND RESIN COMPOSITION INCLUDING SAID COPOLYMER
Provided is a polycarbonate-polyorganosiloxane copolymer, which is produced by using a diol monomer (a1) and a polyorganosiloxane (a2) satisfying the following condition, including: a polyorganosiloxane block (A-1) including a specific repeating unit; and a polycarbonate block (A-2) formed of a specific repeating unit: a mixture, which is obtained by bringing the diol monomer (a1), the polyorganosiloxane (a2), a carbonic acid diester, and a basic catalyst present at the same amount ratio as that at a time of production of the polycarbonate-polyorganosiloxane copolymer into contact with each other at from 100° C. to 250° C. for from 0.5 hour to 5 hours, has a haze value of 30 or less measured under conditions of 23° C. and an optical path length of 10 mm in conformity with ISO 14782:1999.
THERMOSETTING THERMALLY CONDUCTIVE DIELECTRIC COMPOSITE
In an aspect, a dielectric composite comprises a thermoset epoxy resin; a reinforcing layer; greater than or equal 40 volume percent of a hexagonal boron nitride based on the total volume of the dielectric composite minus the reinforcing layer; 3 to 7.5 volume percent of a fused silica based on the total volume of the dielectric composite minus the reinforcing layer; an epoxy silane; an accelerator; and a de-aerator. The hexagonal boron nitride can comprise a plurality of hexagonal boron nitride platelets and a plurality of hexagonal boron nitride agglomerates. A volume ratio of the hexagonal boron nitride agglomerates to the hexagonal boron nitride platelets can be 1:1.5 to 4:1.
THERMOSETTING THERMALLY CONDUCTIVE DIELECTRIC COMPOSITE
In an aspect, a dielectric composite comprises a thermoset epoxy resin; a reinforcing layer; greater than or equal 40 volume percent of a hexagonal boron nitride based on the total volume of the dielectric composite minus the reinforcing layer; 3 to 7.5 volume percent of a fused silica based on the total volume of the dielectric composite minus the reinforcing layer; an epoxy silane; an accelerator; and a de-aerator. The hexagonal boron nitride can comprise a plurality of hexagonal boron nitride platelets and a plurality of hexagonal boron nitride agglomerates. A volume ratio of the hexagonal boron nitride agglomerates to the hexagonal boron nitride platelets can be 1:1.5 to 4:1.
POLYCARBONATE/POLYORGANOSILOXANE COPOLYMER AND RESIN COMPOSITION INCLUDING SAID COPOLYMER
Provided is a polycarbonate-polyorganosiloxane copolymer, including: a polyorganosiloxane block (A-1) including a specific structural unit; and a polycarbonate block (A-2) formed of a specific repeating unit, wherein the polycarbonate-polyorganosiloxane copolymer satisfies the following condition (A) or (B): condition (A): a hexane extraction amount of the polycarbonate-polyorganosiloxane copolymer is 150 ppm or less; and condition (B): average weights of polyorganosiloxane blocks in polycarbonate-polyorganosiloxane copolymers obtained by separating the polycarbonate-polyorganosiloxane copolymer with a gel permeation chromatograph satisfy a specific expression.
POLYCARBONATE/POLYORGANOSILOXANE COPOLYMER AND RESIN COMPOSITION INCLUDING SAID COPOLYMER
Provided is a polycarbonate-polyorganosiloxane copolymer, including: a polyorganosiloxane block (A-1) including a specific structural unit; and a polycarbonate block (A-2) formed of a specific repeating unit, wherein the polycarbonate-polyorganosiloxane copolymer satisfies the following condition (A) or (B): condition (A): a hexane extraction amount of the polycarbonate-polyorganosiloxane copolymer is 150 ppm or less; and condition (B): average weights of polyorganosiloxane blocks in polycarbonate-polyorganosiloxane copolymers obtained by separating the polycarbonate-polyorganosiloxane copolymer with a gel permeation chromatograph satisfy a specific expression.
POLYCARBONATE/POLYORGANOSILOXANE COPOLYMER AND RESIN COMPOSITION INCLUDING SAID COPOLYMER
Provided is a polycarbonate-polyorganosiloxane copolymer, including: a polyorganosiloxane block (A-1) including a specific structural unit; and a polycarbonate block (A-2) formed of a specific repeating unit, wherein the polycarbonate-polyorganosiloxane copolymer satisfies the following condition (A) or (B): condition (A): a hexane extraction amount of the polycarbonate-polyorganosiloxane copolymer is 150 ppm or less; and condition (B): average weights of polyorganosiloxane blocks in polycarbonate-polyorganosiloxane copolymers obtained by separating the polycarbonate-polyorganosiloxane copolymer with a gel permeation chromatograph satisfy a specific expression.
THERMOSETTING RESIN COMPOSITION AND PREPREG, LAMINATE AND PRINTED CIRCUIT BOARD USING SAME
Provided are a thermosetting resin composition and a prepreg, laminate and printed circuit board using same. The thermosetting resin composition comprises a resin component, the resin component comprising a modified cyclic olefin copolymer having a structure as shown in formula I and another unsaturated resin. By introducing a methacrylate end group having a certain polarity into a cyclic olefin copolymer, a modified cyclic olefin copolymer is formed. The modified cyclic olefin copolymer can form a thermosetting material by means of cross-linking with itself or another unsaturated resin, whereby the bonding property can be significantly improved while retaining the excellent dielectric properties of the cyclic olefin copolymer itself. The laminate prepared using the thermosetting resin composition has good dielectric properties, a good peel strength and a good heat resistance, and can meet all the performance requirements for printed circuit board substrates in the current high-frequency and high-speed communication field.
Composition for radar penetration cover of vehicle
Disclosed are a composition for a radar penetration cover of a vehicle which may improve dielectric properties while maintaining excellent mechanical physical properties, and the radar penetration cover including the same. The composition for a radar penetration cover includes: an amount of about 60 to 70 wt % of polybutylene terephthalate (PBT), an amount of about 10 to 20 wt % of polycarbonate (PC), and an amount of about 11.5 to 27.8 wt % of an additive including polypropylene (PP) having maleic anhydride (MAH) grafted to an end group and a glass fiber (GF), wt % based on the total weight of the composition.
Composition for radar penetration cover of vehicle
Disclosed are a composition for a radar penetration cover of a vehicle which may improve dielectric properties while maintaining excellent mechanical physical properties, and the radar penetration cover including the same. The composition for a radar penetration cover includes: an amount of about 60 to 70 wt % of polybutylene terephthalate (PBT), an amount of about 10 to 20 wt % of polycarbonate (PC), and an amount of about 11.5 to 27.8 wt % of an additive including polypropylene (PP) having maleic anhydride (MAH) grafted to an end group and a glass fiber (GF), wt % based on the total weight of the composition.