Patent classifications
C08K7/22
Spherical particles for preparing colored coatings
Colored coating compositions comprising a polymer binder and a sphere selected from porous metal oxide spheres formed from metal oxide particles and having an average porosity of from 0.10 to 0.90; polymer spheres formed from a multimodal distribution of polymer particles; or mixtures thereof, wherein the colored coating composition when dried, exhibits visible light absorbance at a wavelength range from 400 nm to 800 nm. The sphere has an average particle size diameter of from 1 micron to 5 microns, or from 3 microns to 5 microns and exhibits a structural color which may be angle-dependent or angle-independent.
Spherical particles for preparing colored coatings
Colored coating compositions comprising a polymer binder and a sphere selected from porous metal oxide spheres formed from metal oxide particles and having an average porosity of from 0.10 to 0.90; polymer spheres formed from a multimodal distribution of polymer particles; or mixtures thereof, wherein the colored coating composition when dried, exhibits visible light absorbance at a wavelength range from 400 nm to 800 nm. The sphere has an average particle size diameter of from 1 micron to 5 microns, or from 3 microns to 5 microns and exhibits a structural color which may be angle-dependent or angle-independent.
SILICONE RUBBER SPONGE COMPOSITION AND PRODUCING METHOD THEREOF
A silicone rubber sponge composition, including: (A) 100 parts by mass of an addition-crosslinkable silicone rubber composition containing a reinforcing silica and being liquid at 25° C.; (B) 1.0 to 20 parts by mass of expanded resin fine particles having a specific gravity of 0.01 to 0.3, having an average particle diameter of 10 to 200 μm, and having an organic resin shell; and (C) 0.1 to 10 parts by mass of spherical particles having average particle diameter being 0.001 to 0.5 times larger than average particle diameter of the component (B) expanded resin fine particles, and having an average circularity of 0.8 to 1. This improves flowability of silicone rubber sponge composition containing the expanded resin fine particles, reduces contractive deformation due to pressure of the expanded resin fine particles during casting or injection-molding. Thus, provided are a silicone rubber sponge composition that can reduce density of a sponge rubber.
Adhesive strips
The invention relates to adhesive strips consisting of at least four, particularly precisely four layers, comprising: a layer A having an upper side and a lower side consisting of a foamed adhesive substance containing a self-adhesive acrylate substance; a layer B consisting of a film carrier, layer B being arranged on the lower side of layer A, at least the main surface which faces layer A, preferably both main surfaces of the film carrier, being etched, the surface of layer A and the surface of layer B being in direct contact with each other; a layer C consisting of a self-adhesive substance, arranged on the upper side of layer A and containing a self-adhesive acrylate substance; and a layer D consisting of a self-adhesive substance, arranged on the side of layer B opposite layer A and containing a self-adhesive acrylate substance.
Adhesive strips
The invention relates to adhesive strips consisting of at least four, particularly precisely four layers, comprising: a layer A having an upper side and a lower side consisting of a foamed adhesive substance containing a self-adhesive acrylate substance; a layer B consisting of a film carrier, layer B being arranged on the lower side of layer A, at least the main surface which faces layer A, preferably both main surfaces of the film carrier, being etched, the surface of layer A and the surface of layer B being in direct contact with each other; a layer C consisting of a self-adhesive substance, arranged on the upper side of layer A and containing a self-adhesive acrylate substance; and a layer D consisting of a self-adhesive substance, arranged on the side of layer B opposite layer A and containing a self-adhesive acrylate substance.
Addition-curing silicone resin for producing heat-shielding film, method for forming heat-shielding film on inner surface of combustion chamber of engine by means of addition-curing silicone resin, heat-shielding film, and heat shielding method for reducing or preventing heat dissipation from combustion chamber of engine to outside by means of heat-shielding film
In a heat-shielding film formed of addition-curing silicone resin containing organopolysiloxane, organopolysiloxane includes the combination of a plurality of units including at least a R.sup.1SiO.sub.3/2 unit (a T unit), a R.sup.2R.sup.3SiO.sub.2/2 unit (a D unit), and a R.sup.4R.sup.5R.sup.6SiO.sub.1/2 unit (a M unit) (in each unit, R.sup.1 to R.sup.6 is aliphatic hydrocarbon or hydrogen), and the molar ratio of the T unit, the D unit, and the M unit among all structural units is T:33.3 mol % to 71.4 mol %, D:11.1 mol % to 42.9 mol %, and M:7.0 mol % to 42.9 mol %.
Addition-curing silicone resin for producing heat-shielding film, method for forming heat-shielding film on inner surface of combustion chamber of engine by means of addition-curing silicone resin, heat-shielding film, and heat shielding method for reducing or preventing heat dissipation from combustion chamber of engine to outside by means of heat-shielding film
In a heat-shielding film formed of addition-curing silicone resin containing organopolysiloxane, organopolysiloxane includes the combination of a plurality of units including at least a R.sup.1SiO.sub.3/2 unit (a T unit), a R.sup.2R.sup.3SiO.sub.2/2 unit (a D unit), and a R.sup.4R.sup.5R.sup.6SiO.sub.1/2 unit (a M unit) (in each unit, R.sup.1 to R.sup.6 is aliphatic hydrocarbon or hydrogen), and the molar ratio of the T unit, the D unit, and the M unit among all structural units is T:33.3 mol % to 71.4 mol %, D:11.1 mol % to 42.9 mol %, and M:7.0 mol % to 42.9 mol %.
RESIN COMPOSITION FOR WIRING BOARD MATERIAL, AND PREPREG, RESIN-COATED FILM, RESIN-COATED METAL FOIL, METAL-CLAD LAMINATE, AND WIRING BOARD IN WHICH SAID RESIN COMPOSITION IS USED
A resin composition for wiring board material contains a thermosetting resin and a thermally expandable microcapsule, in which the relative dielectric constant (10 GHz) of a cured product of the resin composition is more than 1.0 and 2.2 or less.
RESIN COMPOSITION FOR WIRING BOARD MATERIAL, AND PREPREG, RESIN-COATED FILM, RESIN-COATED METAL FOIL, METAL-CLAD LAMINATE, AND WIRING BOARD IN WHICH SAID RESIN COMPOSITION IS USED
A resin composition for wiring board material contains a thermosetting resin and a thermally expandable microcapsule, in which the relative dielectric constant (10 GHz) of a cured product of the resin composition is more than 1.0 and 2.2 or less.
NON-FOAMED COATED TEXTILE AND METHOD OF MAKING
A non-foamed aqueous composition can be applied to fabric substrates to provide non-foamed light-attenuating coatings in resulting coated fabric substrates that produce reduced glare from incident outside light. The non-foamed aqueous composition used to make these coated fabric substrates has a 5-50% solids and a zero shear viscosity of 100-1000 mPa-sec at 25° C. This composition has components i) through iv): i) porous particles at 0.1-20 weight %, and optionally an opacifying colorant; ii) a film-forming binder material comprising at least a chlorinated polymer at 4-20 weight %; iii) a white inorganic particulate filler material having a refraction index (RI) greater than 2 and a median particle size of less than 1 μm, at 5-16 weight %; and iv) a white low-density particulate hydrated alumina having a median particle size of less than or equal to 3 μm, at 2-16 weight %.