Provided herein is a copolyetherester resin composition that is suitable for the manufacture of CVJ boots showing reduced squeak. Further provided are CVJ boots comprising the copolyetherester resin composition.

Provided herein is a copolyetherester resin composition that is suitable for the manufacture of CVJ boots showing reduced squeak. Further provided are CVJ boots comprising the copolyetherester resin composition.

A microcatheter comprising an inner layer, a strike layer and an outer layer and a braided skeleton located between the inner layer and the outer layer, wherein the inner layer is made of Polytetrafluoroethylene (PTFE) and has a thickness of 0.0015 inch or less, wherein the strike layer includes a polyether block amide and has a thickness of 0.001 inch or less, and wherein a distal portion of said outer layer is made of polycarbonate-based thermoplastic polyurethane having a shore of 90A or below.

A microcatheter comprising an inner layer, a strike layer and an outer layer and a braided skeleton located between the inner layer and the outer layer, wherein the inner layer is made of Polytetrafluoroethylene (PTFE) and has a thickness of 0.0015 inch or less, wherein the strike layer includes a polyether block amide and has a thickness of 0.001 inch or less, and wherein a distal portion of said outer layer is made of polycarbonate-based thermoplastic polyurethane having a shore of 90A or below.

A polymer composition comprising at least one liquid crystalline polymer and an ultrahigh molecular weight siloxane polymer in an amount from about 0.1 to about 20 parts by weight per 100 parts by weight of the liquid crystalline polymer is provided. The siloxane polymer has a number average molecular weight of about 100,000 grams per mole or more.

A polymer composition comprising at least one liquid crystalline polymer and an ultrahigh molecular weight siloxane polymer in an amount from about 0.1 to about 20 parts by weight per 100 parts by weight of the liquid crystalline polymer is provided. The siloxane polymer has a number average molecular weight of about 100,000 grams per mole or more.

The invention provides a method for polishing or planarizing a substrate of at least one of semiconductor, optical and magnetic substrates. The method includes attaching a polymer-polymer composite polishing pad having a polishing layer to a polishing device. A hydrophilic polymeric matrix forms the polishing layer. Cationic fluoropolymer particles having nitrogen-containing end groups are embedded in the polymeric matrix. A slurry containing anionic particles is applied to the polymer-polymer composite polishing pad and rubbed against the substrate to polish or planarize the substrate with the fluoropolymer particles interacting with the anionic particles to increase polishing removal rate.

The invention provides a method for polishing or planarizing a substrate of at least one of semiconductor, optical and magnetic substrates. The method includes attaching a polymer-polymer composite polishing pad having a polishing layer to a polishing device. A hydrophilic polymeric matrix forms the polishing layer. Cationic fluoropolymer particles having nitrogen-containing end groups are embedded in the polymeric matrix. A slurry containing anionic particles is applied to the polymer-polymer composite polishing pad and rubbed against the substrate to polish or planarize the substrate with the fluoropolymer particles interacting with the anionic particles to increase polishing removal rate.

A shaping material for a powder bed fusion method, including a powder of a fluororesin, wherein the fluororesin has a D50 of 30 μm or more and 200 μm or less, and the fluororesin has a D10 of 12 μm or more.

A shaping material for a powder bed fusion method, including a powder of a fluororesin, wherein the fluororesin has a D50 of 30 μm or more and 200 μm or less, and the fluororesin has a D10 of 12 μm or more.