Thermosetting resin compositions useful for liquid compression molding encapsulation of a reconfigured wafer are provided. The so-encapsulated molded wafer offers improved resistance to warpage, compared to reconfigured wafers encapsulated with known encapsulation materials.

Thermosetting resin compositions useful for liquid compression molding encapsulation of a reconfigured wafer are provided. The so-encapsulated molded wafer offers improved resistance to warpage, compared to reconfigured wafers encapsulated with known encapsulation materials.

A housing (121) having an electromagnetic shielding property includes a resin molded body (101), which is a cured product of a thermosetting resin composition, and a plating layer (103) provided on a surface of the resin molded body (101) (cured product), in which the plating layer (103) includes a Cu layer (first plating layer (105)), and a thickness of the Cu layer (first plating layer (105)) is 2 μm or more and 30 μm or less.

A housing (121) having an electromagnetic shielding property includes a resin molded body (101), which is a cured product of a thermosetting resin composition, and a plating layer (103) provided on a surface of the resin molded body (101) (cured product), in which the plating layer (103) includes a Cu layer (first plating layer (105)), and a thickness of the Cu layer (first plating layer (105)) is 2 μm or more and 30 μm or less.

An addition condensation product, i.e., an addition condensation product of an aromatic compound with a carbonyl compound, is obtained as a condensation reaction product in the state of uniform solution or the like, in which clumping caused by agglomeration of the condensation product of the aromatic compound with the carbonyl compound can be prevented by the presence of a surfactant at the time of the condensation reaction. In addition, a coating solution prepared by using an original solution or an adjusted solution whose viscosity is 2.0 mPa.Math.s or greater exhibits an excellent polymer scale adhesion inhibition effect when applied to an inner wall and the like of a polymerization vessel; and in addition, a low-accumulative coating film is formed when the solution is applied to an inner wall and the like of a polymerization vessel.

A wax-extender emulsion including a plurality of wax-extender complex particles suspended in water is described. A wax-extender complex includes a wax component, an organic extender component and a surfactant that stabilizes the wax component and the organic extender component collectively to form the wax-extender complex. The wax-extender emulsion comprises from 2 wt % to 30 wt % organic extender. During manufacturing, the organic extender and wax component are emulsified and homogenized together to produce the wax-extender emulsion. The wax-extender emulsion can be co-applied as a mixture with adhesive resin during wood-based composite manufacturing.

A resin composition constituted by containing an epoxy resin monomer having a mesogenic structure, a novolac resin containing a compound having a structural unit represented by the following general formula (I), and an inorganic filler is superior in preservation stability before curing, and can attain high thermal conductivity after curing.

In the following general formula (I), R.sup.1, R.sup.2 and R.sup.3 independently represent a hydrogen atom, an alkyl group, an aryl group, or an aralkyl group; m represents an integer of 0 to 2; and n an integer of 1 to 7.

##STR00001##

The invention relates to a mixture of at least one dialkylphosphinic acid of the formula (I)

##STR00001##

in which R.sup.1, R.sup.2 are the same or different and are each C.sub.1-C.sub.18-alkyl, C.sub.2-C.sub.18-alkenyl, C.sub.6-C.sub.18-aryl, C.sub.7-C.sub.18-alkylaryl, with at least one different dialkylphosphinic acid of the formula (II)

##STR00002##

in which R.sup.3, R.sup.4 are the same or different and are each C.sub.1-C.sub.18-alkyl, C.sub.2-C.sub.18-alkenyl, C.sub.6-C.sub.18-aryl and/or C.sub.7-C.sub.18-alkylaryl, with the proviso that at least one of the R.sup.3 and R.sup.4 radicals is different than R.sup.1 and R.sup.2.

The invention relates to a mixture of at least one dialkylphosphinic acid of the formula (I)

##STR00001##

in which R.sup.1, R.sup.2 are the same or different and are each C.sub.1-C.sub.18-alkyl, C.sub.2-C.sub.18-alkenyl, C.sub.6-C.sub.18-aryl, C.sub.7-C.sub.18-alkylaryl, with at least one different dialkylphosphinic acid of the formula (II)

##STR00002##

in which R.sup.3, R.sup.4 are the same or different and are each C.sub.1-C.sub.18-alkyl, C.sub.2-C.sub.18-alkenyl, C.sub.6-C.sub.18-aryl and/or C.sub.7-C.sub.18-alkylaryl, with the proviso that at least one of the R.sup.3 and R.sup.4 radicals is different than R.sup.1 and R.sup.2.

An object of the present invention is to provide a friction material that applies low load on the environment and exhibits improved friction characteristics, particularly improved fade resistance and wear resistance. The friction material of the invention contains a fibrous base material, a friction modifier, and a binder, wherein the copper content is 0.5% by mass or less in terms of elemental copper, and lithium carbonate is contained.