Provided is a resin composition, which is fast curable at low temperature, has high adhesive strength (especially, high peel strength) after curing, and can suppress a decrease in adhesive strength (especially, in peel strength) after a moisture resistance test of the resin composition after curing, and further has excellent pot life. Provided is the resin composition including: (A) an epoxy resin; (B) a thiol compound represented by C(CH.sub.2OR.sup.1)(CH.sub.2OR.sup.2)(CH.sub.2OR.sup.3)(CH.sub.2OR.sup.4) (wherein R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are each independently hydrogen or C.sub.nH.sub.2nSH (wherein n is 2 to 6), at least one of R.sup.1, R.sup.2, R.sup.3 and R.sup.4 is C.sub.nH.sub.2nSH (wherein n is 2 to 6)); (b) a polyfunctional thiol compound other than the (B); and (C) a latent curing accelerator.

The present invention relates to an epoxy resin system containing an epoxy resin and a mono-alkylated diamine. The epoxy resin system can further contain a second amine. The present invention also relates to a method for producing an epoxy resin system comprising combining an epoxy resin with a mono-alkylated diamine. The mono-alkylated diamines of this invention enhance desirable processing and cured properties of epoxy resin compositions without the negative impact on mechanical properties in the cured product normally seen with cycloaliphatic amine-based curing agents.

A curable composition comprising (A) an epoxy resin containing on average more than one epoxy group per molecule; (B) a compound of formula A[—X—CO—CH.sub.2—CN].sub.n(1), wherein A is hydrogen or C.sub.1-C.sub.12 alkyl which is unsubstituted or substituted by one or more C.sub.1-C.sub.12 alkoxy groups, C.sub.1-C.sub.12 alkylcarbonyl groups, C.sub.7-C.sub.25 arylcarbonyl groups, hydroxyl groups, amino groups, C.sub.1-C.sub.12 alkylamino groups, C.sub.1-C.sub.12 dialkylamino groups, cyano groups or halogen atoms, or A is a bivalent aliphatic, cycloaliphatic, aromatic, araliphatic or heterocyclic organic radical, X denotes —O—or —NR.sub.1—, wherein R.sub.1 is hydrogen or C.sub.1-C.sub.12 alkyl which is unsubstituted or substituted by one or more C.sub.1-C.sub.12 alkoxy groups, C.sub.1-C.sub.12 alkylcarbonyl groups, C.sub.7-C.sub.25 arylcarbonyl groups, hydroxyl groups, amino groups, C.sub.1-C.sub.12 alkylamino groups, C.sub.1-C.sub.12 dialkylamino groups, cyano groups or halogen atoms, n is 1 or 2; and (C) a protected base in the form of an adduct or salt which is able to release a basic compound upon heating to a temperature greater than 70° C., is storage-stable, allows processing over a longer period of time (pot-life) and produces cured products having outstanding mechanical and thermal properties.

An epoxy resin composition containing an epoxy resin [A1], epoxy resin [B1], epoxy resin [C1] and curing agent [D] wherein [A1] is a bisphenol-type epoxy resin with a softening point of 90° C. or more, [B1] is a tri- or higher functional amine-type epoxy resin, [C1] is a bisphenol F-type epoxy resin with a number average molecular weight of 450 or less, and the epoxy resins [A1] to [C1] satisfy the following contents per 100 parts by mass of total epoxy resin content: [A1] 20 to 50 parts by mass, [B1] 30 to 50 parts by mass and [C1] 10 to 40 parts. The present invention provides low-viscosity epoxy resin compositions that are excellent in impregnating reinforcing fibers and capable of producing cured resins with excellent modulus and toughness, as well as prepregs and fiber-reinforced composite materials based on those epoxy resin compositions.

In various embodiments, the invention provides an in-situ adduct formed by reacting liquid, solid, and/or semi-solid epoxy resins with a di-carboxylic acid functionalized polymer. The adducting process at least doubles the viscosity of the mixture. A hot melt thermosetting surfacing film and composite formed using the adduct are also disclosed. Methods of preparing and using are also disclosed.

The present invention provides a composition comprising a) at least one epoxy resin, b) at least one cyclic amine of the formula (I) ##STR00001##
in which R.sup.1 to R.sup.4 is H or an organic radical, with the proviso that at least one of the R.sup.1, R.sup.2, R.sup.3 and R.sup.4 radicals ═H, and
X═—(Y.sup.1).sub.m-(A.sup.1).sub.n-(Y.sup.2).sub.o-(A.sup.2).sub.p-(Y.sup.3).sub.q-(A.sup.3).sub.r-(Y.sup.4).sub.s—  (II) where, independently of one another, m, n, o, p, q, r and s=0 or 1, A.sup.1, A.sup.2, A.sup.3=alkylene or alkenylene radical and Y.sup.1, Y.sup.2, Y.sup.3, Y.sup.4═NR.sup.5, PR.sup.5, O or S, where R.sup.5 independently=organic radical, where any two organic radicals selected from R.sup.1 to R.sup.5 and any radicals present in the alkylene and/or alkenylene radicals A.sup.1, A.sup.2, A.sup.3 may also form one or more further rings, with the proviso that at least one of the radicals selected from R.sup.1 to R.sup.5 present and any radicals present in the alkylene and/or alkenylene radicals A.sup.1, A.sup.2, A.sup.3 is substituted by at least one —NHR.sup.6 or —NH.sub.2 group, where R.sup.6=organic radical, and
c) at least one salt of a strong Brønsted acid with a counterion selected from metal ions, metal-containing ions, phosphonium ions and unsubstituted ammonium ions,
where the ratio of the epoxy groups in the epoxy resin to the sum total of all NH groups in all amines is 0.5:1 to 1.5:1,
and to processes for production thereof and use thereof.

Formulations comprising from 10 to 80% by weight of the formulation of a halogenated epoxy resin; from 1 to 15% by weight of the formulation of an antimony based fire retardant; from 1 to 10% by weight of the formulation of an inorganic or non-polymeric organic phosphorous containing fire retardant; and from 1 to 30% by weight of the formulation of a curative system are provided. The formulations are particularly suitable for producing aircraft interior composite components having good fire retarding properties, low smoke emission, low smoke toxicity and low heat release properties. The formulations also have excellent processing and mechanical properties. Further components may be included in the compositions to improve various properties, including the fire retarding, low smoke emission, low smoke toxicity and low heat release properties and to also further improve the processing and mechanical properties, including toughness. Compositions produced from the formulations have excellent processing and mechanical properties, and may also have good surface finishes.

A flame retardant epoxy resin composition for preparing a flame retardant fiber composite including: (a) at least one epoxy resin; (b) at least one flame retardant agent for improving the flammability performance of carbon fiber-reinforced epoxy composites; (c) at least one mold release agent; (d) at least one curing agent; and (e) at least one catalyst; a prepreg prepared using the above epoxy resin composition; and a flame retardant fiber composite prepared using the above prepreg.

A low-dust composite building product is provided. The low-dust composite building product includes a binder system comprising one or more of a thermoset resin, a diluent, and a hardener; and a low-dust filler material comprising filler particles that have been pre-coated with a coating agent comprising one or more of the thermoset resin, the diluent, and the hardener from the binder system.

Containing an epoxy compound and a curing agent and containing a bisphenol E type epoxy resin as the epoxy compound in an amount of 25 mass % or more and 100 mass % or less relative to the total amount of the epoxy compound.