Disclosed is a polyurethane-modified epoxy resin composition capable of satisfying both high toughness and high elasticity. This epoxy resin composition is an epoxy resin composition, in which (A) a polyurethane-modified epoxy resin having a polycarbonate structure in the molecule and having a urethane modification rate of 20 to 60% by weight, (B) a non-polyurethane-modified epoxy resin that is liquid at 30° C., (C) a solid epoxy resin having a glass transition temperature or melting point of 50° C. or higher and (D) an amine-based curing agent that is dicyandiamide or a derivative thereof are as essential components, and 20.0 to 50.0% by weight of (A), 0.1 to 50.0% by weight of (B) and 0.1 to 50.0% by weight of (C) are contained relative to the total of (A) to (D).

Provided herein is a hardener composition comprising (a) a first adduct comprising a reaction product of a liquid epoxy resin and isophorone diamine; (b) a second adduct comprising a reaction product of a liquid epoxy resin and m-xylylenediamine; and (c) an accelerator component comprising methanesulfonic acid.

Provided herein is a hardener composition comprising (a) a first adduct comprising a reaction product of a liquid epoxy resin and isophorone diamine; (b) a second adduct comprising a reaction product of a liquid epoxy resin and m-xylylenediamine; and (c) an accelerator component comprising methanesulfonic acid.

The present disclosure provides an epoxy molding compound composition, a preparation method and use thereof. The epoxy molding compound composition includes the following ingredients in mass percentage: epoxy resin: 4-9 wt %; a curing agent: 4-9 wt %; PN phenolic resin: 1-3 wt %; a curing accelerator: 0.02-0.5 wt %; filler: 70-90 wt %; a coupling agent: 0.2-0.6 wt %; and auxiliary additives: 1-2 wt %. By adding the PN phenolic resin to an epoxy resin system of the epoxy molding compound composition, reducing the mass percentage of the coupling agent and removing a plasticizer, the thermal deformation of the molding compound composition can be effectively reduced, and the stability of a packaged product is improved.

The present invention relates to a support-attached resin film for an interlayer insulating layer, including a support, and a resin composition layer formed on one side surface of the support in which the support has particles exposed on the one side surface, and an average maximum height of exposed portions of the particles is 1.0 μm or less, or the support has no particles exposed on the one side surface, a multilayer printed wiring board using the support-attached resin film for an interlayer insulating layer, and the multilayer printed-wiring board.

The present invention relates to a support-attached resin film for an interlayer insulating layer, including a support, and a resin composition layer formed on one side surface of the support in which the support has particles exposed on the one side surface, and an average maximum height of exposed portions of the particles is 1.0 μm or less, or the support has no particles exposed on the one side surface, a multilayer printed wiring board using the support-attached resin film for an interlayer insulating layer, and the multilayer printed-wiring board.

A multiaxial fabric resin base material includes a multiaxial fabric base material laminate impregnated with a thermosetting resin (B), the multiaxial fabric base material laminate including fiber bundle sheets layered at different angles, the fiber bundle sheets including unidirectionally aligned fiber bundles stitched with stitching yarns composed of a thermoplastic resin (A), the multiaxial fabric base material laminate being penetrated in the thickness direction by other bodies of the stitching yarns, and being stitched with the other bodies of the stitching yarns such that the yarns reciprocate at predetermined intervals along the longitudinal direction, the thermoplastic resin (A) constituting the stitching yarns having a softening point, the softening point being higher than the resin impregnation temperature of the thermosetting resin (B).

A multiaxial fabric resin base material includes a multiaxial fabric base material laminate impregnated with a thermosetting resin (B), the multiaxial fabric base material laminate including fiber bundle sheets layered at different angles, the fiber bundle sheets including unidirectionally aligned fiber bundles stitched with stitching yarns composed of a thermoplastic resin (A), the multiaxial fabric base material laminate being penetrated in the thickness direction by other bodies of the stitching yarns, and being stitched with the other bodies of the stitching yarns such that the yarns reciprocate at predetermined intervals along the longitudinal direction, the thermoplastic resin (A) constituting the stitching yarns having a softening point, the softening point being higher than the resin impregnation temperature of the thermosetting resin (B).

Cationically curable compositions with latent reducing agents that demonstrate low cure temperature and improved work life are provided.

Cationically curable compositions with latent reducing agents that demonstrate low cure temperature and improved work life are provided.