A negative-working photosensitive resin composition including an epoxy group-containing resin, a metal oxide, and a cationic polymerization initiator, in which a photosensitive resin film having a film thickness of 20 μm obtained by applying the negative-working photosensitive resin composition onto a silicon wafer and performing a bake treatment at 90° C. for 5 minutes has a Martens hardness of less than 235 [N/mm.sup.2], and when a viscoelasticity of a cured film, which is obtained by exposing the photosensitive resin film to i-rays at an irradiation amount of 200 mJ/cm.sup.2, performing a bake treatment after the exposure at 90° C. for 5 minutes, and then performing a bake treatment at 200° C. for 1 hour to cure the photosensitive resin film, is measured at a frequency of 1.0 Hz, a tensile elastic modulus (E*) of the cured film at a temperature of 175° C. is 2.1 [GPa] or more.

A negative-working photosensitive resin composition including an epoxy group-containing resin, a metal oxide, and a cationic polymerization initiator, in which a photosensitive resin film having a film thickness of 20 μm obtained by applying the negative-working photosensitive resin composition onto a silicon wafer and performing a bake treatment at 90° C. for 5 minutes has a Martens hardness of less than 235 [N/mm.sup.2], and when a viscoelasticity of a cured film, which is obtained by exposing the photosensitive resin film to i-rays at an irradiation amount of 200 mJ/cm.sup.2, performing a bake treatment after the exposure at 90° C. for 5 minutes, and then performing a bake treatment at 200° C. for 1 hour to cure the photosensitive resin film, is measured at a frequency of 1.0 Hz, a tensile elastic modulus (E*) of the cured film at a temperature of 175° C. is 2.1 [GPa] or more.

The present invention relates to an adhesive composition comprising a. a polyethylene resin (A) which has been grafted with an acid grafting agent and b. an epoxy resin (B) in an amount of 0.01 to 15 wt. % of the adhesive total composition, wherein the adhesive composition is having a MFR.sub.5 of 0.1 to 12 g/10 min. Furthermore, the invention relates to an article, in particular a multilayer pipe, comprising an adhesive layer which comprises said adhesive composition and the use of said adhesive composition for the production of an adhesive layer, in particular of an adhesive layer of a pipe.

The present invention relates to an adhesive composition comprising a. a polyethylene resin (A) which has been grafted with an acid grafting agent and b. an epoxy resin (B) in an amount of 0.01 to 15 wt. % of the adhesive total composition, wherein the adhesive composition is having a MFR.sub.5 of 0.1 to 12 g/10 min. Furthermore, the invention relates to an article, in particular a multilayer pipe, comprising an adhesive layer which comprises said adhesive composition and the use of said adhesive composition for the production of an adhesive layer, in particular of an adhesive layer of a pipe.

The present invention relates to an adhesive composition comprising a. a polyethylene resin (A) which has been grafted with an acid grafting agent and b. an epoxy resin (B) in an amount of 0.01 to 15 wt. % of the adhesive total composition, wherein the adhesive composition is having a MFR.sub.5 of 0.1 to 12 g/10 min. Furthermore, the invention relates to an article, in particular a multilayer pipe, comprising an adhesive layer which comprises said adhesive composition and the use of said adhesive composition for the production of an adhesive layer, in particular of an adhesive layer of a pipe.

A foundry mix includes a major amount of a foundry aggregate and an effective binding amount of a binder system. The binder system cures in the presence of sulfur dioxide and a free radical initiator. The binder system may include (1) 10 to 70 parts by weight of an epoxy novolac resin; (2) 0.5 to 10 parts by weight of resorcinol; (3) 20 to 70 parts by weight of a monomeric or polymeric acrylate; and (4) an effective amount of a free radical initiator. Notably, (1), (2), (3) and (4) are separate components or mixed with another of said components, provided (4) is not mixed with (3) until a foundry mix is to be created, where said parts by weight are based upon 100 parts of the binder system.

A foundry mix includes a major amount of a foundry aggregate and an effective binding amount of a binder system. The binder system cures in the presence of sulfur dioxide and a free radical initiator. The binder system may include (1) 10 to 70 parts by weight of an epoxy novolac resin; (2) 0.5 to 10 parts by weight of resorcinol; (3) 20 to 70 parts by weight of a monomeric or polymeric acrylate; and (4) an effective amount of a free radical initiator. Notably, (1), (2), (3) and (4) are separate components or mixed with another of said components, provided (4) is not mixed with (3) until a foundry mix is to be created, where said parts by weight are based upon 100 parts of the binder system.

This disclosure generally provides compositions with improved thermal aging resistance, crack resistance and flux compatibility, wherein the resin composition comprising: (a) an epoxy resin comprising a compound having two or more epoxy groups per molecule; (b) a binder comprising a compound having at least one carboxyl group per molecule; (c) a photopolymerization initiator; and (d) a filler composition comprising silica, talc and wollastonite.

This disclosure generally provides compositions with improved thermal aging resistance, crack resistance and flux compatibility, wherein the resin composition comprising: (a) an epoxy resin comprising a compound having two or more epoxy groups per molecule; (b) a binder comprising a compound having at least one carboxyl group per molecule; (c) a photopolymerization initiator; and (d) a filler composition comprising silica, talc and wollastonite.

Disclosed is a polyurethane-modified epoxy resin composition capable of satisfying both high toughness and high elasticity. This epoxy resin composition is an epoxy resin composition, in which (A) a polyurethane-modified epoxy resin having a polycarbonate structure in the molecule and having a urethane modification rate of 20 to 60% by weight, (B) a non-polyurethane-modified epoxy resin that is liquid at 30° C., (C) a solid epoxy resin having a glass transition temperature or melting point of 50° C. or higher and (D) an amine-based curing agent that is dicyandiamide or a derivative thereof are as essential components, and 20.0 to 50.0% by weight of (A), 0.1 to 50.0% by weight of (B) and 0.1 to 50.0% by weight of (C) are contained relative to the total of (A) to (D).