The invention relates to the field of powder coatings, and specifically discloses a heat-curable powder coating composition and a preparation method thereof. The powder coating composition comprises: i) component A comprising at least one amorphous solid polyester resin compound having a Michael donor reactive group; ii) component B comprising at least one amorphous ethylenically unsaturated solid polyester resin with a Michael acceptor reactive group; iii) component C comprising at least one (semi) crystalline solid reactive diluent; iv) component D comprising at least one epoxy group-containing solid substance; v) component E comprising at least one basic catalyst. The present invention also discloses a preparation method of the above heat-curable powder coating composition. By adopting the invention, ultra-low temperature curing can be realized. The curing temperature is as low as 90-110° C., and the curing time is short.

The invention relates to the field of powder coatings, and specifically discloses a heat-curable powder coating composition and a preparation method thereof. The powder coating composition comprises: i) component A comprising at least one amorphous solid polyester resin compound having a Michael donor reactive group; ii) component B comprising at least one amorphous ethylenically unsaturated solid polyester resin with a Michael acceptor reactive group; iii) component C comprising at least one (semi) crystalline solid reactive diluent; iv) component D comprising at least one epoxy group-containing solid substance; v) component E comprising at least one basic catalyst. The present invention also discloses a preparation method of the above heat-curable powder coating composition. By adopting the invention, ultra-low temperature curing can be realized. The curing temperature is as low as 90-110° C., and the curing time is short.

A high-CTI and halogen-free epoxy resin composition for copper-clad plates and uses thereof is provided. The formula of the high-CTI and halogen-free epoxy resin composition for copper-clad plates comprises 100˜140 parts of halogen-free phosphorous epoxy resin, 10˜35 parts of dicyclopentadiene phenolic epoxy resin, 32˜60 parts of benzoxazine, 1˜5 parts of phenolic resin, 0.05˜0.5 parts of accelerants; and 25˜70 parts of fillers, by weight. The copper-clad plates, prepared according to embodiments of the present invention, can reach the requirements of high CTI (CTI≧500V), high heat resistance(Tg≧150 ° C., PCT, 2 h>6 min) and the level of flame retardance of UL-94 V0, and they are widely used in the electronic materials of electric machines, electric appliances, white goods and so on.

A crosslinking composition includes a compound having at least two functional groups that are each independently represented by Chemical Structure (I): ##STR00001##
X is an oxygen, sulfur, or nitrogen; R.sup.1 is an alkyl group, an aryl group, or an alkylaryl group; R.sup.2, R.sup.3, and R.sup.4 are each independently an alkyl group, an aryl group, an alkylaryl group, or a hydrogen; R.sup.5 is an alkyl group, an aryl group, an alkylaryl group, or a hydrogen; z is 0 when X is oxygen or sulfur and z is 1 when X is nitrogen; and when a double bond is formed between a carbon atom bonded to R.sup.3 and an adjacent nitrogen, m is 0, and when a single bond is formed between the carbon atom bonded to R.sup.3 and the adjacent nitrogen, m is 1.

A crosslinking composition includes a compound having at least two functional groups that are each independently represented by Chemical Structure (I): ##STR00001##
X is an oxygen, sulfur, or nitrogen; R.sup.1 is an alkyl group, an aryl group, or an alkylaryl group; R.sup.2, R.sup.3, and R.sup.4 are each independently an alkyl group, an aryl group, an alkylaryl group, or a hydrogen; R.sup.5 is an alkyl group, an aryl group, an alkylaryl group, or a hydrogen; z is 0 when X is oxygen or sulfur and z is 1 when X is nitrogen; and when a double bond is formed between a carbon atom bonded to R.sup.3 and an adjacent nitrogen, m is 0, and when a single bond is formed between the carbon atom bonded to R.sup.3 and the adjacent nitrogen, m is 1.

An epoxy resin composition provided according to one embodiment of the present invention includes: a triazine derivative epoxy compound; a siloxane compound including a cycloaliphatic epoxy group and a siloxane group; and a curing agent, where the epoxy resin composition includes 10 to 70 parts by weight of the siloxane group with respect to 100 parts by weight of the siloxane compound, thereby providing a composition excellent in heat resistance, light resistance, and excess moisture tolerance, with good shear adhesion to silicone, and capable of semi-solidification.

An epoxy resin composition provided according to one embodiment of the present invention includes: a triazine derivative epoxy compound; a siloxane compound including a cycloaliphatic epoxy group and a siloxane group; and a curing agent, where the epoxy resin composition includes 10 to 70 parts by weight of the siloxane group with respect to 100 parts by weight of the siloxane compound, thereby providing a composition excellent in heat resistance, light resistance, and excess moisture tolerance, with good shear adhesion to silicone, and capable of semi-solidification.

An epoxy resin composition provided according to one embodiment of the present invention includes: a triazine derivative epoxy compound; a siloxane compound including a cycloaliphatic epoxy group and a siloxane group; and a curing agent, where the epoxy resin composition includes 10 to 70 parts by weight of the siloxane group with respect to 100 parts by weight of the siloxane compound, thereby providing a composition excellent in heat resistance, light resistance, and excess moisture tolerance, with good shear adhesion to silicone, and capable of semi-solidification.

A thermoplastic polyester resin composition includes 0.05 to 10 parts by weight of an epoxy compound (B) and 0.001 to 1 part by weight of a hindered amine compound (C) with respect to 100 parts by weight of a thermoplastic polyester resin (A) having an amount of carboxyl groups of 50 eq/t or less. The thermoplastic polyester resin composition is capable of producing a molded article which is excellent in mechanical properties and heat resistance, as well as in long-term hydrolysis resistance, and has a small decrease in mechanical properties and hydrolysis resistance even when melt-processed at a high temperature of 270° C. or more.

A thermoplastic polyester resin composition includes 0.05 to 10 parts by weight of an epoxy compound (B) and 0.001 to 1 part by weight of a hindered amine compound (C) with respect to 100 parts by weight of a thermoplastic polyester resin (A) having an amount of carboxyl groups of 50 eq/t or less. The thermoplastic polyester resin composition is capable of producing a molded article which is excellent in mechanical properties and heat resistance, as well as in long-term hydrolysis resistance, and has a small decrease in mechanical properties and hydrolysis resistance even when melt-processed at a high temperature of 270° C. or more.