A resin composition including: a magnetic fluid that includes magnetic particles, a dispersant, and a dispersion medium; and a resin or precursor thereof that includes, in a molecule thereof, at least one partial structure selected from the group consisting of a diene skeleton, a silicone skeleton, a urethane skeleton, a 4- to 7-membered ring lactone skeleton, an alkyl group having from 6 to 30 carbon atoms and an alkylene group having from 6 to 30 carbon atoms, a production method thereof, a resin composition molded body obtained by using the resin composition, and a production method thereof.

A resin composition constituted by containing an epoxy resin monomer having a mesogenic structure, a novolac resin containing a compound having a structural unit represented by the following general formula (I), and an inorganic filler is superior in preservation stability before curing, and can attain high thermal conductivity after curing.

In the following general formula (I), R.sup.1, R.sup.2 and R.sup.3 independently represent a hydrogen atom, an alkyl group, an aryl group, or an aralkyl group; m represents an integer of 0 to 2; and n an integer of 1 to 7.

##STR00001##

A resin composition constituted by containing an epoxy resin monomer having a mesogenic structure, a novolac resin containing a compound having a structural unit represented by the following general formula (I), and an inorganic filler is superior in preservation stability before curing, and can attain high thermal conductivity after curing.

In the following general formula (I), R.sup.1, R.sup.2 and R.sup.3 independently represent a hydrogen atom, an alkyl group, an aryl group, or an aralkyl group; m represents an integer of 0 to 2; and n an integer of 1 to 7.

##STR00001##

A process of preparing a compounded hydrostable poly(aliphatic ester-carbonate) comprises providing a hydrostable poly(aliphatic ester-carbonate), compounding in an extruder the hydrostable poly(aliphatic ester-carbonate) and 0.05 wt % to 0.60 wt % of a multifunctional epoxide compounding stabilizer, based on the total weight of the compounded hydrostable poly(aliphatic ester-carbonate), under vacuum of 17000 to 85000 Pascals, and a torque of 30% to 75%, to provide the compounded hydrostable poly(aliphatic ester-carbonate). After compounding, at least one of the following apply: the inter-sample variability in molecular weight is less than 5%, wherein inter-sample variability is determined by comparing five 100 mil chips of the compounded hydrostable poly(aliphatic ester-carbonate); the % weight average molecular weight (MW) difference is less than 5% after hydroaging at 85° C. and 85% humidity; or the compounded poly(aliphatic ester-carbonate) has less than 75 ppm of unreacted —COOH end groups measured by .sup.31P NMR.

A process of preparing a compounded hydrostable poly(aliphatic ester-carbonate) comprises providing a hydrostable poly(aliphatic ester-carbonate), compounding in an extruder the hydrostable poly(aliphatic ester-carbonate) and 0.05 wt % to 0.60 wt % of a multifunctional epoxide compounding stabilizer, based on the total weight of the compounded hydrostable poly(aliphatic ester-carbonate), under vacuum of 17000 to 85000 Pascals, and a torque of 30% to 75%, to provide the compounded hydrostable poly(aliphatic ester-carbonate). After compounding, at least one of the following apply: the inter-sample variability in molecular weight is less than 5%, wherein inter-sample variability is determined by comparing five 100 mil chips of the compounded hydrostable poly(aliphatic ester-carbonate); the % weight average molecular weight (MW) difference is less than 5% after hydroaging at 85° C. and 85% humidity; or the compounded poly(aliphatic ester-carbonate) has less than 75 ppm of unreacted —COOH end groups measured by .sup.31P NMR.

A resin composition containing a polyimide resin particle (A) and at least one selected from the group consisting of a thermoplastic resin (B) and a thermosetting resin (C), wherein the polyimide resin particle (A) contains a repeating structural unit represented by the following formula (1) and a repeating structural unit represented by the following formula (2), a content ratio of the repeating structural unit of the formula (1) with respect to the total of the repeating structural unit of the formula (1) and the repeating structural unit of the formula (2) is 20 to 70 mol %, and the polyimide resin particle (A) has a volume average particle size D50 of 5 to 200 μm.

(R.sub.1 represents a divalent group having from 6 to 22 carbon atoms containing at least one alicyclic hydrocarbon structure; R.sub.2 represents a divalent chain aliphatic group having from 5 to 16 carbon atoms; and X.sub.1 and X.sub.2 each independently represent a tetravalent group having from 6 to 22 carbon atoms containing at least one aromatic ring.)

##STR00001##

A resin composition containing a polyimide resin particle (A) and at least one selected from the group consisting of a thermoplastic resin (B) and a thermosetting resin (C), wherein the polyimide resin particle (A) contains a repeating structural unit represented by the following formula (1) and a repeating structural unit represented by the following formula (2), a content ratio of the repeating structural unit of the formula (1) with respect to the total of the repeating structural unit of the formula (1) and the repeating structural unit of the formula (2) is 20 to 70 mol %, and the polyimide resin particle (A) has a volume average particle size D50 of 5 to 200 μm.

(R.sub.1 represents a divalent group having from 6 to 22 carbon atoms containing at least one alicyclic hydrocarbon structure; R.sub.2 represents a divalent chain aliphatic group having from 5 to 16 carbon atoms; and X.sub.1 and X.sub.2 each independently represent a tetravalent group having from 6 to 22 carbon atoms containing at least one aromatic ring.)

##STR00001##

Provided is a vinyl chloride resin composition that can form a vinyl chloride resin molded product having excellent adhesiveness to a foamed polyurethane molded product. The vinyl chloride resin composition contains a vinyl chloride resin, a plasticizer, and a vinyl chloride-(meth)acrylate copolymer.

Provided is a vinyl chloride resin composition that can form a vinyl chloride resin molded product having excellent adhesiveness to a foamed polyurethane molded product. The vinyl chloride resin composition contains a vinyl chloride resin, a plasticizer, and a vinyl chloride-(meth)acrylate copolymer.

A curable photosensitive resin composition which can be cured at a relatively low temperature, has excellent developability and adhesion to a support, and a cured product that realizes low dielectric constant properties. A curable photosensitive resin composition containing a polyimide resin (A) which is a reaction product of monomer groups containing an aromatic tetracarboxylic anhydride (a1) and a diamine (a2) containing a dimer diamine, maleimides (B), and a polyfunctional polymerizable compound (C) having two or more ethylenic double bonds other than the component (A) and the component (B), a cured product, a photosensitive element, a resist pattern, a method of producing a resist pattern, a semiconductor device and an electronic device.