The present invention relates to a thermosetting material for use in a 3D printing process comprising: a) at least one epoxy resin A, b) at least one elastomer-modified epoxy resin B, c) at least one resin C with a dynamic viscosity of below 4 Pas at 150° C., d) at least one of a curing agent D capable of reacting with A, B and optionally C, e) and optionally additional compounds,
wherein the glass transition temperature of the uncured material is at least 30° C., preferably at least 40° C. as measured with DSC at a heating rate of 20° C./min.

The invention further relates to a method of producing a cured 3D thermoset object and the use of the above-mentioned thermosetting material in a 3D printing process.

The present invention relates to a thermosetting material for use in a 3D printing process comprising: a) at least one epoxy resin A, b) at least one elastomer-modified epoxy resin B, c) at least one resin C with a dynamic viscosity of below 4 Pas at 150° C., d) at least one of a curing agent D capable of reacting with A, B and optionally C, e) and optionally additional compounds,
wherein the glass transition temperature of the uncured material is at least 30° C., preferably at least 40° C. as measured with DSC at a heating rate of 20° C./min.

The invention further relates to a method of producing a cured 3D thermoset object and the use of the above-mentioned thermosetting material in a 3D printing process.

A surfactant comprising the reaction product of: (a) an epoxidised carboxylic acid ester; and (b) a compound including at least one reactive alcohol and/or amino functional group.

A surfactant comprising the reaction product of: (a) an epoxidised carboxylic acid ester; and (b) a compound including at least one reactive alcohol and/or amino functional group.

A process of preparing a compounded hydrostable poly(aliphatic ester-carbonate) comprises providing a hydrostable poly(aliphatic ester-carbonate), compounding in an extruder the hydrostable poly(aliphatic ester-carbonate) and 0.05 wt % to 0.60 wt % of a multifunctional epoxide compounding stabilizer, based on the total weight of the compounded hydrostable poly(aliphatic ester-carbonate), under vacuum of 17000 to 85000 Pascals, and a torque of 30% to 75%, to provide the compounded hydrostable poly(aliphatic ester-carbonate). After compounding, at least one of the following apply: the inter-sample variability in molecular weight is less than 5%, wherein inter-sample variability is determined by comparing five 100 mil chips of the compounded hydrostable poly(aliphatic ester-carbonate); the % weight average molecular weight (MW) difference is less than 5% after hydroaging at 85° C. and 85% humidity; or the compounded poly(aliphatic ester-carbonate) has less than 75 ppm of unreacted —COOH end groups measured by .sup.31P NMR.

A process of preparing a compounded hydrostable poly(aliphatic ester-carbonate) comprises providing a hydrostable poly(aliphatic ester-carbonate), compounding in an extruder the hydrostable poly(aliphatic ester-carbonate) and 0.05 wt % to 0.60 wt % of a multifunctional epoxide compounding stabilizer, based on the total weight of the compounded hydrostable poly(aliphatic ester-carbonate), under vacuum of 17000 to 85000 Pascals, and a torque of 30% to 75%, to provide the compounded hydrostable poly(aliphatic ester-carbonate). After compounding, at least one of the following apply: the inter-sample variability in molecular weight is less than 5%, wherein inter-sample variability is determined by comparing five 100 mil chips of the compounded hydrostable poly(aliphatic ester-carbonate); the % weight average molecular weight (MW) difference is less than 5% after hydroaging at 85° C. and 85% humidity; or the compounded poly(aliphatic ester-carbonate) has less than 75 ppm of unreacted —COOH end groups measured by .sup.31P NMR.

An object of the present invention is to provide an epoxy resin composition that can be preferably used for prepreg and fiber reinforced composite material applications and is excellent in elastic modulus, strength, and pot life.

The present invention is the epoxy resin composition including the following components [A] to [C] and satisfying the following conditions (1) to (3): [A]: epoxy resin [B]: polyamine curing agent, and [C]: a compound having a boiling point of 130° C. or more and a molecular weight m of 50 or more and 250 or less, the compound having no epoxy group in the molecule and having substantially no curing ability of an epoxy resin, and (1): at least a part of the component [C] has two or more alcoholic hydroxyl groups in the molecule. (2): the ratio C/E of the amount by mole, E, for epoxy groups of the component [A] to the amount by mole, C, of the component [C] satisfying the condition (1) is 0.01 or more and 0.20 or less. (3): the viscosity at 70° C. for 2 hours is 5.0 times or less the initial viscosity at 70° C.

An object of the present invention is to provide an epoxy resin composition that can be preferably used for prepreg and fiber reinforced composite material applications and is excellent in elastic modulus, strength, and pot life.

The present invention is the epoxy resin composition including the following components [A] to [C] and satisfying the following conditions (1) to (3): [A]: epoxy resin [B]: polyamine curing agent, and [C]: a compound having a boiling point of 130° C. or more and a molecular weight m of 50 or more and 250 or less, the compound having no epoxy group in the molecule and having substantially no curing ability of an epoxy resin, and (1): at least a part of the component [C] has two or more alcoholic hydroxyl groups in the molecule. (2): the ratio C/E of the amount by mole, E, for epoxy groups of the component [A] to the amount by mole, C, of the component [C] satisfying the condition (1) is 0.01 or more and 0.20 or less. (3): the viscosity at 70° C. for 2 hours is 5.0 times or less the initial viscosity at 70° C.

A thermally-conductive structural adhesive for new energy power batteries, including: composition A including 3.3-14 wt. % of a block polymerized telechelic carboxyl compound and/or a block polymerized telechelic amino compound; 0.1-1.0 wt. % of a coupling agent and/or a modifier; 0-1.6 wt. % of curing accelerator; 84-92 wt. % of a thermally-conductive powder; and 0.3-3.0 wt. % of a flame retardant agent; and composition B including 3.3-14 wt. % of a block polymerized telechelic isocyanate compound and/or a block polymerized telechelic epoxy compound; 0-1.0 wt. % of a coupling agent and/or a modifier; 0-1.6 wt. % of a curing accelerator; 84-92 wt. % of a thermally-conductive powder; and 0.3-3 wt. % of a flame retardant agent. The composition A and the composition B are mixed evenly in a weight or volume ratio of 1:(0.25-2) and cured to obtain the thermally-conductive structural adhesive. A preparation of the thermally-conductive structural adhesive is also provided.

A thermally-conductive structural adhesive for new energy power batteries, including: composition A including 3.3-14 wt. % of a block polymerized telechelic carboxyl compound and/or a block polymerized telechelic amino compound; 0.1-1.0 wt. % of a coupling agent and/or a modifier; 0-1.6 wt. % of curing accelerator; 84-92 wt. % of a thermally-conductive powder; and 0.3-3.0 wt. % of a flame retardant agent; and composition B including 3.3-14 wt. % of a block polymerized telechelic isocyanate compound and/or a block polymerized telechelic epoxy compound; 0-1.0 wt. % of a coupling agent and/or a modifier; 0-1.6 wt. % of a curing accelerator; 84-92 wt. % of a thermally-conductive powder; and 0.3-3 wt. % of a flame retardant agent. The composition A and the composition B are mixed evenly in a weight or volume ratio of 1:(0.25-2) and cured to obtain the thermally-conductive structural adhesive. A preparation of the thermally-conductive structural adhesive is also provided.