A photosensitive resin composition is provided comprising (A) 100 pbw of a phenolic hydroxyl group-containing resin, and (B) 0.1-18 pbw of an epoxy additive in the form of a compound containing 1-8 epoxy groups per molecule, containing nitrogen, sulfur or phosphorus, and having a molecular weight of 50-6,000. The composition has an improved bonding force to metal wirings.

A photosensitive resin composition is provided comprising (A) 100 pbw of a phenolic hydroxyl group-containing resin, and (B) 0.1-18 pbw of an epoxy additive in the form of a compound containing 1-8 epoxy groups per molecule, containing nitrogen, sulfur or phosphorus, and having a molecular weight of 50-6,000. The composition has an improved bonding force to metal wirings.

A resin composition includes 100 parts by weight of an unsaturated C═C double bond-containing polyphenylene ether resin; 15 parts by weight to 40 parts by weight of a hydrogenated styrene-butadiene-styrene triblock copolymer; 1 part by weight to 20 parts by weight of a compound of Formula (1); and 0.001 part by weight to 0.5 part by weight of a compound of Formula (2), a compound of Formula (3), a compound of Formula (4) or a combination thereof. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.

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A resin composition includes 100 parts by weight of an unsaturated C═C double bond-containing polyphenylene ether resin; 15 parts by weight to 40 parts by weight of a hydrogenated styrene-butadiene-styrene triblock copolymer; 1 part by weight to 20 parts by weight of a compound of Formula (1); and 0.001 part by weight to 0.5 part by weight of a compound of Formula (2), a compound of Formula (3), a compound of Formula (4) or a combination thereof. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.

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A method of preparing a thermoplastic composition is provided. The method includes the following steps. A polyetherimide or a polyphenylene sulfide is provided. A polyimide is provided, wherein the glass transition temperature of the polyimide is between 128° C. and 169° C., the 10% thermogravimetric loss temperature of the polyimide is between 490° C. and 534° C., and when the polyimide is dissolved in N-methyl-2-pyrrolidone and the solid content of the polyimide is 30 wt %, the viscosity of the polyimide is between 100 cP and 250 cP. A melt process is performed to mix the polyetherimide and the polyimide or mix the polyphenylene sulfide and the polyimide to form a thermoplastic composition. Further, a thermoplastic composition is also provided.

A method of preparing a thermoplastic composition is provided. The method includes the following steps. A polyetherimide or a polyphenylene sulfide is provided. A polyimide is provided, wherein the glass transition temperature of the polyimide is between 128° C. and 169° C., the 10% thermogravimetric loss temperature of the polyimide is between 490° C. and 534° C., and when the polyimide is dissolved in N-methyl-2-pyrrolidone and the solid content of the polyimide is 30 wt %, the viscosity of the polyimide is between 100 cP and 250 cP. A melt process is performed to mix the polyetherimide and the polyimide or mix the polyphenylene sulfide and the polyimide to form a thermoplastic composition. Further, a thermoplastic composition is also provided.

The present invention relates to an electrolyte for a lithium secondary battery, comprising an organic solvent, a lithium salt and a compound of Chemical Formula 1, wherein the compound of Chemical Formula 1 is contained in an amount of 0.001 wt % or more and less than 0.1 wt %. ##STR00001## In Chemical Formula 1, n is one of the integers 3 to 10.

The present invention relates to an electrolyte for a lithium secondary battery, comprising an organic solvent, a lithium salt and a compound of Chemical Formula 1, wherein the compound of Chemical Formula 1 is contained in an amount of 0.001 wt % or more and less than 0.1 wt %. ##STR00001## In Chemical Formula 1, n is one of the integers 3 to 10.

A dielectric material, to a device comprising the dielectric material and to use of the dielectric material in the fabrication of a device. One dielectric material may comprise a halogen-based elastomer mixed with a halogen based surfactant and exhibiting electro-mechanical self-healing properties and/or an increased dielectric constant compared to the halogen-based elastomer. Another dielectric material may comprise a halogen-based polymer mixed with a halogen based surfactant and exhibiting an increased dielectric constant compared to the halogen-based polymer.

A dielectric material, to a device comprising the dielectric material and to use of the dielectric material in the fabrication of a device. One dielectric material may comprise a halogen-based elastomer mixed with a halogen based surfactant and exhibiting electro-mechanical self-healing properties and/or an increased dielectric constant compared to the halogen-based elastomer. Another dielectric material may comprise a halogen-based polymer mixed with a halogen based surfactant and exhibiting an increased dielectric constant compared to the halogen-based polymer.