Patent classifications
C08L71/08
PAEK/PPSU/PES Compositions
A composition [composition (C)] comprising from 1 to 90% by weight (wt. %) of at least one poly(aryl ether ketone) [(PAEK) polymer], from 1 to 25 wt. % of at least one polyphenylsulfone polymer [(PPSU) polymer], from 1 to 90 wt. % of at least one polyethersulfone polymer [(PES)polymer], and from 0.1 to 50 wt. % of at least one reinforcing filler, where all wt. % are based on the total weight of the composition (C) and the (PES) polymer has as melt flow rate(MFR) at a temperature of 380° C. and under a load of 2.16 kg according to ASTM D1238 of greater than 35 g/10 min.
PAEK/PPSU/PES Compositions
A composition [composition (C)] comprising from 1 to 90% by weight (wt. %) of at least one poly(aryl ether ketone) [(PAEK) polymer], from 1 to 25 wt. % of at least one polyphenylsulfone polymer [(PPSU) polymer], from 1 to 90 wt. % of at least one polyethersulfone polymer [(PES)polymer], and from 0.1 to 50 wt. % of at least one reinforcing filler, where all wt. % are based on the total weight of the composition (C) and the (PES) polymer has as melt flow rate(MFR) at a temperature of 380° C. and under a load of 2.16 kg according to ASTM D1238 of greater than 35 g/10 min.
Tire with an element attached to the surface thereof and method for attaching an element to the surface of a tire
A tire comprises an interior surface and an exterior surface, an accommodating region arranged on one of said interior and exterior surfaces, an adhesive layer arranged on the accommodating region and a member attached to the accommodating region by the adhesive layer, in which the adhesive layer is based on a silanized polyether.
Tire with an element attached to the surface thereof and method for attaching an element to the surface of a tire
A tire comprises an interior surface and an exterior surface, an accommodating region arranged on one of said interior and exterior surfaces, an adhesive layer arranged on the accommodating region and a member attached to the accommodating region by the adhesive layer, in which the adhesive layer is based on a silanized polyether.
Curing agent and method for manufacturing the same
A curing agent and method for producing the same are provided, the method includes: esterification reaction: reacting a polyhydric alcohol with a polybasic acid anhydride to obtain an ester-based emulsifier (A); chain extension reaction: reacting an ester-based emulsifier (A) with a bifunctional epoxy resin to obtain a polymer intermediate (B); and reacting the polymer intermediate (B) with a polyamine compound to obtain a curing agent (C).
Curing agent and method for manufacturing the same
A curing agent and method for producing the same are provided, the method includes: esterification reaction: reacting a polyhydric alcohol with a polybasic acid anhydride to obtain an ester-based emulsifier (A); chain extension reaction: reacting an ester-based emulsifier (A) with a bifunctional epoxy resin to obtain a polymer intermediate (B); and reacting the polymer intermediate (B) with a polyamine compound to obtain a curing agent (C).
RESIN COMPOSITION FOR WIRING BOARD MATERIAL, AND PREPREG, RESIN-COATED FILM, RESIN-COATED METAL FOIL, METAL-CLAD LAMINATE, AND WIRING BOARD IN WHICH SAID RESIN COMPOSITION IS USED
A resin composition for wiring board material contains a thermosetting resin and a thermally expandable microcapsule, in which the relative dielectric constant (10 GHz) of a cured product of the resin composition is more than 1.0 and 2.2 or less.
RESIN COMPOSITION FOR WIRING BOARD MATERIAL, AND PREPREG, RESIN-COATED FILM, RESIN-COATED METAL FOIL, METAL-CLAD LAMINATE, AND WIRING BOARD IN WHICH SAID RESIN COMPOSITION IS USED
A resin composition for wiring board material contains a thermosetting resin and a thermally expandable microcapsule, in which the relative dielectric constant (10 GHz) of a cured product of the resin composition is more than 1.0 and 2.2 or less.
POLYARYLETHERKETONE RESIN COMPOSITION, FIBER-REINFORCED RESIN BASE MATERIAL, AND FORMED PRODUCT
The objective of the present invention is to provide a polyarylketone resin composition, a fiber-reinforced resin base material, and formed products therefrom having excellent thermal stability and mechanical properties. In order to achieve the above objective, the present invention has the following constitution. That is, the polyaryletherketone resin composition comprises (A) a polyaryletherketone and (B) a transition metal compound, wherein the transition metal content is between 0.001 parts by mass and 4 parts by mass inclusive with respect to 100 parts by mass of (A) the polyaryletherketone.
POLYARYLETHERKETONE RESIN COMPOSITION, FIBER-REINFORCED RESIN BASE MATERIAL, AND FORMED PRODUCT
The objective of the present invention is to provide a polyarylketone resin composition, a fiber-reinforced resin base material, and formed products therefrom having excellent thermal stability and mechanical properties. In order to achieve the above objective, the present invention has the following constitution. That is, the polyaryletherketone resin composition comprises (A) a polyaryletherketone and (B) a transition metal compound, wherein the transition metal content is between 0.001 parts by mass and 4 parts by mass inclusive with respect to 100 parts by mass of (A) the polyaryletherketone.