Patent classifications
C08L79/04
Liquid compression molding encapsulants
Thermosetting resin compositions useful for liquid compression molding encapsulation of a reconfigured wafer are provided. The so-encapsulated molded wafer offers improved resistance to warpage, compared to reconfigured wafers encapsulated with known encapsulation materials.
Liquid compression molding encapsulants
Thermosetting resin compositions useful for liquid compression molding encapsulation of a reconfigured wafer are provided. The so-encapsulated molded wafer offers improved resistance to warpage, compared to reconfigured wafers encapsulated with known encapsulation materials.
Composition for curable resin, cured product of said composition, production method for said composition and said cured product, and semiconductor device
The invention relates to a curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a biphenyl type epoxy compound, and (D) a curing agent, and optionally (E) an inorganic filler and (F) a curing accelerator; a cured product thereof; methods of producing the curable resin composition and the cured product; and a semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).
Composition for curable resin, cured product of said composition, production method for said composition and said cured product, and semiconductor device
The invention relates to a curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a biphenyl type epoxy compound, and (D) a curing agent, and optionally (E) an inorganic filler and (F) a curing accelerator; a cured product thereof; methods of producing the curable resin composition and the cured product; and a semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).
PATTERN-FORMING COMPOSITION
Provided is, for example, a pattern-forming composition that contains a triazine ring-containing polymer having a predetermined repeating unit structure, represented by formula [4] below, a crosslinking agent, and an organic solvent.
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PATTERN-FORMING COMPOSITION
Provided is, for example, a pattern-forming composition that contains a triazine ring-containing polymer having a predetermined repeating unit structure, represented by formula [4] below, a crosslinking agent, and an organic solvent.
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COLORING COMPOSITION, FILM, OPTICAL FILTER, SOLID-STATE IMAGING ELEMENT, AND IMAGE DISPLAY DEVICE
Provided are a coloring composition including a colorant, a first resin including a repeating unit represented by Formula (b-10), and a second resin different from the first resin, in which the second resin is at least one selected from a polyimide precursor, a polyimide resin, a polybenzoxazole precursor, a polybenzoxazole resin, or a polysiloxane resin; a film formed of the coloring composition; an optical filter; a solid-state imaging element; and an image display device. In Formula (b-10), Ar.sup.10 represents a group including an aromatic carboxyl group, L.sup.11 represents —COO— or —CONH—, L.sup.12 represents a trivalent linking group, and P.sup.10 represents a polymer chain.
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HIGHLY FUNCTIONAL POLYAMIDE POLYMER, SPINNING DOPE COMPOSITION CONTAINING SAME, AND MOLDED PRODUCT THEREOF
Provided are a novel polyamide polymer obtained by polymerizing monomers including aromatic diamine substituted with a nitrile group and an amide group and an aromatic dibasic acid compound, a spinning dope comprising the same, and a polyamide molded article. A fiber obtained using the novel polyamide polymer according to the present invention, particularly, a fiber obtained by spinning the polymer according to the present invention may have high strength and high elasticity, such that the fiber may be applied to various industrial fields.
HIGHLY FUNCTIONAL POLYAMIDE POLYMER, SPINNING DOPE COMPOSITION CONTAINING SAME, AND MOLDED PRODUCT THEREOF
Provided are a novel polyamide polymer obtained by polymerizing monomers including aromatic diamine substituted with a nitrile group and an amide group and an aromatic dibasic acid compound, a spinning dope comprising the same, and a polyamide molded article. A fiber obtained using the novel polyamide polymer according to the present invention, particularly, a fiber obtained by spinning the polymer according to the present invention may have high strength and high elasticity, such that the fiber may be applied to various industrial fields.
Preparation method of biomedical titanium implant with function of eliminating surface biomembrane
The present invention discloses a preparation method of a biomedical titanium implant with a function of eliminating a surface biomembrane. The method includes the following steps: firstly synthesizing mesoporous polydopamine (MPDA) nanoparticles by a “one-pot method”, constituting a surface-aminated titanium material through diacid corrosion and modification of a 3-aminopropyltriethoxysilane (APTES) coupling agent, and integrating the MPDA nanoparticles into the surface of the titanium material through Michael addition reaction; secondly, taking MPDA anchored on the surface of the titanium material as a photothermal material and a photosensitizer carrier, where MPDA contains abundant aromatic rings capable of facilitating abundant loading of a photosensitizer (indocyanine green, ICG) through π-π stacking interaction; and finally further modifying biocompatible RGD polypeptides on the surface of MPDA by Michael addition reaction, where a modified titanium material is referred to as Ti-M/I/RGD.