The present invention pertains to a functionalized polymeric liquid polysiloxane material comprising non-organofunctional Q-type siloxane moieties and mono-organofunctional T-type siloxane moieties, as well as optionally tri-organofunctional M-type siloxane moieties and/or di-organofunctional D-type siloxane moieties characterized in that the polysiloxane material has a specified degree of polymerization, comprises a limited low amount of four-membered Q2-type and/or Q3-type siloxane ring species relative to the total Q-type siloxane species, and is functionalized at specific moieties. The present invention further pertains to methods for producing the polymeric liquid polysiloxane material as well as associated uses of the material.

Silicone polyoxamide and silicone polyoxamide-hydrazide copolymers comprise at least two repeating units of formula (I). In this formula, each R.sup.1 is independently an alkyl, haloalkyl, aralkyl, alkenyl, aryl, or aryl substituted with an alkyl, alkoxy, or halo; each Y is independently an alkylene, aralkylene, or a combination thereof; each G is independently a bond or a divalent residue equal to a diamine of formula R.sup.3HN-G-NHR.sup.3 minus the two —NHR.sup.3 groups; each R.sup.3 is independently hydrogen or alkyl or R.sup.3 taken together with G and with the nitrogen to which they are both attached form a heterocyclic group; each n is independently an integer of 0 to 300; each p is independently an integer of 1 to 25, and the average of p is 1.3 or greater; and each q is independently an integer of 1 to 2, and the average of q is no greater than 1.05.

##STR00001##

A composition including a polysiloxane compound (A) containing a structural unit represented by formula (1) and a structural unit represented by formula (2), wherein a siloxane structural unit ratio represented by Q unit/(Q unit+T unit) in all Si structural units is 0.60 or more and less than 1.00, and the solvent (B).

[(R.sup.1).sub.b(R.sup.2).sub.m(OR.sup.3).sub.lSiO.sub.n/2]  (1)

[In the formula, R.sup.1 is a group represented by following formula.]

##STR00001##

[(R.sup.4).sub.pSiO.sub.q/2]  (2)

A composition including a polysiloxane compound (A) containing a structural unit represented by formula (1) and a structural unit represented by formula (2), wherein a siloxane structural unit ratio represented by Q unit/(Q unit+T unit) in all Si structural units is 0.60 or more and less than 1.00, and the solvent (B).

[(R.sup.1).sub.b(R.sup.2).sub.m(OR.sup.3).sub.lSiO.sub.n/2]  (1)

[In the formula, R.sup.1 is a group represented by following formula.]

##STR00001##

[(R.sup.4).sub.pSiO.sub.q/2]  (2)

The present disclosure relates to a polymer composition including eco-friendly materials, an electronic device and a method of manufacturing the same. The polymer composition according to an aspect of the present disclosure includes a thermoplastic resin at 30 to 70 parts by weight; an eco-friendly resin, including a bio-resin, at 1 to 50 parts by weight; and a silicone resin at 1 to 60 parts by weight based on the total weight of the polymer composition.

The present disclosure relates to a polymer composition including eco-friendly materials, an electronic device and a method of manufacturing the same. The polymer composition according to an aspect of the present disclosure includes a thermoplastic resin at 30 to 70 parts by weight; an eco-friendly resin, including a bio-resin, at 1 to 50 parts by weight; and a silicone resin at 1 to 60 parts by weight based on the total weight of the polymer composition.

A curable organopolysiloxane composition comprising: (A) a mercapto group-containing organopolysiloxane; (B) a compound containing in a molecule at least two groups that are at least one type of functional groups selected from a group consisting of acryloyl groups, methacryloyl groups, and epoxy groups; and (C) an amine compound that does not have a N—H bond and/or a phosphine compound that does not have a P—H bond. The composition has favorable curability even at a relatively low temperature, and forms a cured film with excellent bonding with regard to an article to be coated.

A curable organopolysiloxane composition comprising: (A) a mercapto group-containing organopolysiloxane; (B) a compound containing in a molecule at least two groups that are at least one type of functional groups selected from a group consisting of acryloyl groups, methacryloyl groups, and epoxy groups; and (C) an amine compound that does not have a N—H bond and/or a phosphine compound that does not have a P—H bond. The composition has favorable curability even at a relatively low temperature, and forms a cured film with excellent bonding with regard to an article to be coated.

A curable organopolysiloxane composition comprising: (A) a mercapto group-containing organopolysiloxane; (B) a compound containing in a molecule at least two groups that are at least one type of functional groups selected from a group consisting of acryloyl groups, methacryloyl groups, and epoxy groups; and (C) an amine compound that does not have a N—H bond and/or a phosphine compound that does not have a P—H bond. The composition has favorable curability even at a relatively low temperature, and forms a cured film with excellent bonding with regard to an article to be coated.

A composition crosslinkable by condensation reaction and producible using (A) organopolysiloxanes of the formula (R.sup.2O).sub.3-aSiR.sup.1.sub.aO(SiR.sub.2O).sub.nSiR.sup.1.sub.a(OR.sup.2).sub.3-a (I), (B1) silanes of the formula R.sup.3.sub.4-b(R.sup.4O).sub.bSi (II), and optionally (B2) silicon compounds consisting of units of the formula R.sup.7.sub.c(R.sup.8O).sub.dSiO.sub.(4-c-d)/2 (III). The composition contains organosilicon compounds having a molecular weight of less than or equal to 195 g/mol maximally in amounts of less than 0.5 wt%, based on organopolysiloxane (A).