A protective, sacrificial, water-reversible, coating composition for the protection of substrates comprised of water, a volatile base, a film-forming acrylic polymer in a water dispersion form, a compatabilizing polymer, specifically poly (2-ethyl-2-oxazoline), a poly acidic polymer (pH specific in terms of its solubility), wherein said coating is both water applied and water reversible or re-soluble under specific pH conditions.

Described herein is an aqueous composition to improve barrier properties. Particularly, described herein is a polymer-based grease resistant aqueous composition for coating paper and paper products.

Disclosed herein are coating compositions with enhanced adhesion to a variety of different substrates. In some embodiments, the coating can comprise at least one copolymer derived from a monomer mixture that includes tert-butyl acrylate.

Disclosed herein are coating compositions with enhanced adhesion to a variety of different substrates. In some embodiments, the coating can comprise at least one copolymer derived from a monomer mixture that includes tert-butyl acrylate.

The present invention relates to an adhesive film comprising an adhesive layer; a photothermal conversion layer containing a light absorber and a thermally decomposable resin; and an adhesive base film layer disposed between the adhesive layer and the photothermal conversion layer, wherein the adhesive base film layer contains a multifunctional epoxy resin, a binder resin, a curing agent, and a curing catalyst. The adhesive film according to the present invention may be able to simplify a processing process of a substrate, and prevent damage to the substrate and circuits or elements formed on the substrate.

A floor finishing composition comprises water, polymer of ethylenic unsaturated monomers having a glass transition temperature of at least 90#C as measured using differential scanning calorimetry according to the ASTM Method D3418-15, coalescing solvent, and polyvalent metal crosslinking agent. The ethylenic unsaturated monomers comprise methyl (meth)acrylate, α,β-unsaturated carboxylic acid, aromatic vinyl monomer, and no more than 25% by weight of α,β-unsaturated carboxylic ester of C2-10 alcohol based on total weight of the monomers. The ethylenic unsaturated monomers may comprise from about 14% to about 18% by weight of the α,β-unsaturated carboxylic acid based on total weight of the monomers. The amount of coalescing solvent in the floor finishing composition may be more than 6% by weight based on total weight of the floor finishing composition.

Provided is a thermosetting resin composition, from which a cured product having excellent transparency with less yellowing than that in the related art can be obtained, and which is advantageous in cost because a monomer obtained by using an inexpensive raw material is used. An ester compound contains, in one molecule, at least one functional group represented by the following general formula (1) or (2).

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(In both the general formulae (1) and (2), R.sub.1 is an alkyl group having 50 or less carbon atoms.

R.sub.2 is an alkylene group having 50 or less carbon atoms that may contain an oxygen atom and a nitrogen atom as a portion thereof.)

An acrylic pressure-sensitive adhesive (PSA) includes an acrylic polymer produced by free radical polymerization, having a weight-average molecular weight (M.sub.w) of less than 830 kDa; a relative peak width at half height (PWHH) of the acrylic polymer is 1.75 or less or, the acrylic polymer has an entanglement molecular weight (M.sub.e) of less than 50 kg/mol, the relative PWHH of the acrylic polymer being the ratio of an absolute PWHH of the acrylic polymer determined from differentiated DSC signal of the acrylic polymer at glass transition temperature (T.sub.g) to an absolute PWHH of a reference acrylic polymer obtained by reacting ethyl acrylate and acrylic acid in a weight ratio of 100:5 with 10 mmol/l AIBN, wherein the absolute PWHH of the reference acrylic polymer is determined in the same manner as the absolute PWHH of the acrylic polymer, and M.sub.e being calculated from a plateau modulus determined by rheological methods.

The present invention relates to silver ink for printing a three dimensional microstructure and a 3D printing method using the same. The present invention provides a method for printing a 3-dimensional silver structure pattern, the method including: a step of providing a nozzle with liquid ink including capped silver nanoparticles and exhibiting Newtonian fluid behavior; a step of forming, at a predetermined point on a substrate, a meniscus of the liquid ink with ink extruded from the nozzle; a step of allowing the ink of the nozzle to be extruded by means of the surface tension of the meniscus while moving the nozzle along a path in a direction perpendicular to the substrate, in a direction parallel to the substrate, or according to a combination of said directions; and a step of forming a silver structure pattern corresponding to the movement path of the nozzle by evaporating a solvent from the extruded ink from the region closer to the substrate. The present invention can provide a 3D printing method based on direct ink printing that is suitable for application to 3D printing electronic technology.

The present invention relates to silver ink for printing a three dimensional microstructure and a 3D printing method using the same. The present invention provides a method for printing a 3-dimensional silver structure pattern, the method including: a step of providing a nozzle with liquid ink including capped silver nanoparticles and exhibiting Newtonian fluid behavior; a step of forming, at a predetermined point on a substrate, a meniscus of the liquid ink with ink extruded from the nozzle; a step of allowing the ink of the nozzle to be extruded by means of the surface tension of the meniscus while moving the nozzle along a path in a direction perpendicular to the substrate, in a direction parallel to the substrate, or according to a combination of said directions; and a step of forming a silver structure pattern corresponding to the movement path of the nozzle by evaporating a solvent from the extruded ink from the region closer to the substrate. The present invention can provide a 3D printing method based on direct ink printing that is suitable for application to 3D printing electronic technology.