A method of forming a pattern, the method comprising: applying a photoresist underlayer composition over a substrate to provide a photoresist underlayer; forming a photoresist layer over the photoresist underlayer; patterning the photoresist layer; and transferring a pattern from the patterned photoresist layer to the photoresist underlayer. The photoresist underlayer composition includes a polymer that includes a repeating unit represented by Formula 1 as described herein, a compound including a substituent group represented by Formula 2 as described herein, and a solvent.

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A method of forming a pattern, the method comprising: applying a photoresist underlayer composition over a substrate to provide a photoresist underlayer; forming a photoresist layer over the photoresist underlayer; patterning the photoresist layer; and transferring a pattern from the patterned photoresist layer to the photoresist underlayer. The photoresist underlayer composition includes a polymer that includes a repeating unit represented by Formula 1 as described herein, a compound including a substituent group represented by Formula 2 as described herein, and a solvent.

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This invention provides a coating composition that contains an aromatic adhesion promoter. Containers and other articles comprising the coatings and methods of making such containers and other articles are also provided. The invention further provides compositions including the adhesion promoter, which have utility in a variety of coating end uses, including, for example, valve and pipe coatings.

This invention provides a coating composition that contains an aromatic adhesion promoter. Containers and other articles comprising the coatings and methods of making such containers and other articles are also provided. The invention further provides compositions including the adhesion promoter, which have utility in a variety of coating end uses, including, for example, valve and pipe coatings.

Compositions useful for improving the adhesion of coating compositions, such as dielectric film-forming compositions, include a hydrolyzed poly(alkoxysilane). These compositions are useful in methods of improving the adhesion of coating compositions to a substrate.

Compositions useful for improving the adhesion of coating compositions, such as dielectric film-forming compositions, include a hydrolyzed poly(alkoxysilane). These compositions are useful in methods of improving the adhesion of coating compositions to a substrate.

A novel material is provided herein which is suitable for use in a precursor of a polymer coating material that coats a polymer on a surface of a base material to provide the base material with surface modification and/or functionality assignment. A composite material characterized in that a compound having a polymerization initiation site containing a halogen group is incorporated in a crosslinked structure comprising a catechol derivative or a phenol derivative represented by the following formula (I). In the formula (I), R may be interrupted by an oxygen molecule and represents a hydrocarbon group with 2 to 20 carbons that has at least one double bond site, and A represents a hydrogen atom, a hydroxyl group, or an alkoxy group with 1 to 20 carbons. ##STR00001##

A novel material is provided herein which is suitable for use in a precursor of a polymer coating material that coats a polymer on a surface of a base material to provide the base material with surface modification and/or functionality assignment. A composite material characterized in that a compound having a polymerization initiation site containing a halogen group is incorporated in a crosslinked structure comprising a catechol derivative or a phenol derivative represented by the following formula (I). In the formula (I), R may be interrupted by an oxygen molecule and represents a hydrocarbon group with 2 to 20 carbons that has at least one double bond site, and A represents a hydrogen atom, a hydroxyl group, or an alkoxy group with 1 to 20 carbons. ##STR00001##

This invention relates to a supported polymer heterostructure and methods of manufacture. The heterostructure is suitable for use in a range of applications which require semiconductor devices, including photovoltaic devices and light-emitting diodes.

This invention relates to a supported polymer heterostructure and methods of manufacture. The heterostructure is suitable for use in a range of applications which require semiconductor devices, including photovoltaic devices and light-emitting diodes.