C09D171/10

POWDER COMPOSITION, COATING FILM, AND THREE-DIMENSIONAL SHAPED ARTICLE

A powder composition containing an aromatic polyetherketone resin (I) and a fluorine-containing copolymer (II). The powder composition has a ratio r2/r1 of 1.60 or lower, wherein r1 represents an average dispersed particle size of the fluorine-containing copolymer (II) and r2 represents an average dispersed particle size of the fluorine-containing copolymer (II) after melt flow rate measurement at 380° C. and a load of 5000 g with 5-minute pre-heating in conformity with ASTM D1238.

POWDER COMPOSITION, COATING FILM, AND THREE-DIMENSIONAL SHAPED ARTICLE

A powder composition containing an aromatic polyetherketone resin (I) and a fluorine-containing copolymer (II). The powder composition has a ratio r2/r1 of 1.60 or lower, wherein r1 represents an average dispersed particle size of the fluorine-containing copolymer (II) and r2 represents an average dispersed particle size of the fluorine-containing copolymer (II) after melt flow rate measurement at 380° C. and a load of 5000 g with 5-minute pre-heating in conformity with ASTM D1238.

INDUSTRIAL THERMAL INKJET INKS

The present invention is a thermal inkjet ink that provides good reliability at a wide range of industrial print conditions from both low temperature to high temperature environments across a broad range of humidities. It is particularly advantageous in low-temperature applications, for example, printing at temperatures down to 5° C. or lower continuously for 8 hours without developing print defects which can lead to unreadable codes; and, in the meantime also maintains other critical functional aspects including contrast, wetting, decap time, dry time, adhesion, ink cartridge stability, etc. The inks contain one or more binder resins that exhibit a hydroxyl number or acid number of at least 100 mg KOH/g; one or more terpene phenolic resins; one or more volatile organic solvents; and one or more dyes, and optionally further components.

INDUSTRIAL THERMAL INKJET INKS

The present invention is a thermal inkjet ink that provides good reliability at a wide range of industrial print conditions from both low temperature to high temperature environments across a broad range of humidities. It is particularly advantageous in low-temperature applications, for example, printing at temperatures down to 5° C. or lower continuously for 8 hours without developing print defects which can lead to unreadable codes; and, in the meantime also maintains other critical functional aspects including contrast, wetting, decap time, dry time, adhesion, ink cartridge stability, etc. The inks contain one or more binder resins that exhibit a hydroxyl number or acid number of at least 100 mg KOH/g; one or more terpene phenolic resins; one or more volatile organic solvents; and one or more dyes, and optionally further components.

CURABLE THERMOSETTING COMPOSITION INCLUDING POLY(ARYLENE ETHER) COPOLYMER
20230183477 · 2023-06-15 ·

A curable thermosetting composition, comprising a capped poly(arylene ether) copolymer comprising a reactive end group, wherein the capped poly(arylene ether) copolymer is derived from an alkyl, aryl-phenol.

CURABLE THERMOSETTING COMPOSITION INCLUDING POLY(ARYLENE ETHER) COPOLYMER
20230183477 · 2023-06-15 ·

A curable thermosetting composition, comprising a capped poly(arylene ether) copolymer comprising a reactive end group, wherein the capped poly(arylene ether) copolymer is derived from an alkyl, aryl-phenol.

INSULATED WIRE AND PREPARATION METHOD THEREOF, COIL AND ELECTRONIC/ELECTRICAL DEVICE
20220306921 · 2022-09-29 ·

The present application discloses an insulated wire and a preparation method thereof, a coil and an electronic/electrical device. According to the insulated wire, a bonding layer containing PEEK nano-powder is arranged between a conductor and a PEEK resin insulating layer, and a bonding agent for forming the bonding layer contains organic solvent, polyamide-imide resin and PEEK nano-powder material which are mixed. The bonding layer can be well bonded with both the conductor material and the PEEK resin insulating layer, so that the produced insulated wire rod has good adhesion, and cracking and detachment will not appear during application.

FIRE PROTECTION COMPOSITION

The present invention relates to a fire protection composition comprising a component A and a component B. Component A comprises an epoxy liquid resin and ammonium polyphosphate. Component B comprises an adduct B1 of (i) at least one polyamine having at least three amine hydrogens reactive toward epoxide groups with (ii) at least one epoxide, an ether group-containing aliphatic primary diamine B2, and an aliphatic or cycloaliphatic primary diamine B3. The fire protection composition has good adhesion to metal, and after passing through burning-in ovens in the automotive industry still shows good fire protection values with a low mass loss and is suitable for spray application.

FIRE PROTECTION COMPOSITION

The present invention relates to a fire protection composition comprising a component A and a component B. Component A comprises an epoxy liquid resin and ammonium polyphosphate. Component B comprises an adduct B1 of (i) at least one polyamine having at least three amine hydrogens reactive toward epoxide groups with (ii) at least one epoxide, an ether group-containing aliphatic primary diamine B2, and an aliphatic or cycloaliphatic primary diamine B3. The fire protection composition has good adhesion to metal, and after passing through burning-in ovens in the automotive industry still shows good fire protection values with a low mass loss and is suitable for spray application.

INSULATED ELECTRICAL WIRE AND RESIN COMPOSITION

An insulated wire including a conductor (A) and an insulating layer (B) around the conductor (A). The insulating layer (B) contains an aromatic polyetherketone resin (I) and a fluorine-containing copolymer (II) and has a melt viscosity at 60 sec.sup.−1 and 390° C. of 0.40 to 0.75 kPa.Math.s. The aromatic polyetherketone resin (I) has a melt viscosity at 60 sec.sup.−1 and 390° C. of 0.30 kPa.Math.s or lower. The insulating layer (B) has a thickness of 30 to 300 μm.