A resin having a small linear thermal expansion coefficient and a low absorbance is provided. The resin is characterized by including at least one structure selected from structures represented by the following general formulae (1) and (2):

##STR00001##

Ruptureable, dual reagent mono-capsules are disclosed that have a core composition, which includes a first reagent, encapsulated within a polymer wall, and a shell connected to an exterior surface of the polymer wall by a surfactant. The shell is made from a second reagent that is chemically bonded to the surfactant by a chemical electrostatic interaction. Upon rupture of the polymer wall of the mono-capsule, the first reagent and the second reagent chemically react with one another to form a reaction product.

The present disclosure is directed to pharmaceutical packages which include a coating that comprises polycyanurate, and methods for the production of such. In one or more embodiments of the present disclosure, a pharmaceutical package may comprise a glass container comprising a first surface and a second surface opposite the first surface. The first surface may be an outer surface of the glass container. The pharmaceutical package may further comprise a coating positioned over at least a portion of the first surface of the glass container. The coating may comprise polycyanurate.

The present disclosure is directed to pharmaceutical packages which include a coating that comprises polycyanurate, and methods for the production of such. In one or more embodiments of the present disclosure, a pharmaceutical package may comprise a glass container comprising a first surface and a second surface opposite the first surface. The first surface may be an outer surface of the glass container. The pharmaceutical package may further comprise a coating positioned over at least a portion of the first surface of the glass container. The coating may comprise polycyanurate.

A metallic or metallized reinforcer has at least a surface of which is at least partially metallic, the at least partially metallic surface being coated with a polybenzoxazine sulfide whose repeating units include at least one unit corresponding to formula (I) or (II): ##STR00001##
in which the two oxazine rings are connected together via a central aromatic group, the benzene ring of which bears one, two, three or four groups of formula —S.sub.x—R in which “x” is an integer from 1 to 8 and R represents hydrogen or a hydrocarbon-based group including 1 to 10 carbon atoms and optionally a heteroatom chosen from O, S, N and P. Such a reinforcement can be used for the reinforcement of a rubber article, in particular a motor vehicle tire.

A metallic or metallized reinforcer has at least a surface of which is at least partially metallic, the at least partially metallic surface being coated with a polybenzoxazine sulfide whose repeating units include at least one unit corresponding to formula (I) or (II): ##STR00001##
in which the two oxazine rings are connected together via a central aromatic group, the benzene ring of which bears one, two, three or four groups of formula —S.sub.x—R in which “x” is an integer from 1 to 8 and R represents hydrogen or a hydrocarbon-based group including 1 to 10 carbon atoms and optionally a heteroatom chosen from O, S, N and P. Such a reinforcement can be used for the reinforcement of a rubber article, in particular a motor vehicle tire.

For example, a triazine ring-containing polymer containing a repeating unit structure represented by formula (25) below,

##STR00001##

wherein R.sup.a represents R.sup.102 or R.sup.103, R.sup.102 represents a fluorine atom or a fluoroalkyl group having 1 to 10 carbon atoms, and R.sup.103 represents a crosslinking group.

For example, a triazine ring-containing polymer containing a repeating unit structure represented by formula (25) below,

##STR00001##

wherein R.sup.a represents R.sup.102 or R.sup.103, R.sup.102 represents a fluorine atom or a fluoroalkyl group having 1 to 10 carbon atoms, and R.sup.103 represents a crosslinking group.

A packaging semiconductor device, such as a fan-out Wafer-Level Packaging (FOWLP) device, is fabricated by providing a semiconductor device (20) having conductive patterns (22) disposed on a first surface and then forming, on the conductive patterns, photoresist islands (24) having a first predetermined shape defined by a first critical width dimension and a minimum height dimension so that a subsequently-formed dielectric polymer layer (26) surrounds but does not cover each photoresist island (24), thereby allowing each photoresist island to be selectively removed from the one or more conductive patterns to form one or more via openings (28) in the dielectric polymer layer such that each via opening has a second predetermined shape which matches at least part of the first predetermined shape of the photoresist islands.

A packaging semiconductor device, such as a fan-out Wafer-Level Packaging (FOWLP) device, is fabricated by providing a semiconductor device (20) having conductive patterns (22) disposed on a first surface and then forming, on the conductive patterns, photoresist islands (24) having a first predetermined shape defined by a first critical width dimension and a minimum height dimension so that a subsequently-formed dielectric polymer layer (26) surrounds but does not cover each photoresist island (24), thereby allowing each photoresist island to be selectively removed from the one or more conductive patterns to form one or more via openings (28) in the dielectric polymer layer such that each via opening has a second predetermined shape which matches at least part of the first predetermined shape of the photoresist islands.