A two-part fiber reinforced epoxy and delivery system having at least one tube containing one component of a two-part epoxy, the tube having an enlarged opening for dispensing strengthening fibers through the enlarged opening mixed with the one component of the two-part epoxy.

A two-part fiber reinforced epoxy and delivery system having at least one tube containing one component of a two-part epoxy, the tube having an enlarged opening for dispensing strengthening fibers through the enlarged opening mixed with the one component of the two-part epoxy.

The present invention is in the field of an improved method of applying a two-component adhesive, wherein the adhesive is provided packaged in a foil, typically one and the same foil, a package comprising said adhesive and an adapted sealing gun, said adapted sealing gun, and specific uses of said package and sealing gun.

The present invention is in the field of an improved method of applying a two-component adhesive, wherein the adhesive is provided packaged in a foil, typically one and the same foil, a package comprising said adhesive and an adapted sealing gun, said adapted sealing gun, and specific uses of said package and sealing gun.

The present invention relates to an adhesive composition comprising, among others, (i) microfibrillated cellulose and (ii) a metal in oxidation state of II or greater. The present invention further relates to uses of such an adhesive composition and to products prepared with such an adhesive composition. Furthermore, the present invention relates to a process for making corrugated paperboards or cardboards, or solid paperboards or cardboards by using such an adhesive composition.

The present invention relates to an adhesive composition comprising, among others, (i) microfibrillated cellulose and (ii) a metal in oxidation state of II or greater. The present invention further relates to uses of such an adhesive composition and to products prepared with such an adhesive composition. Furthermore, the present invention relates to a process for making corrugated paperboards or cardboards, or solid paperboards or cardboards by using such an adhesive composition.

An electrically conductive adhesive layer includes a plurality of particles dispersed between opposing first and second major surfaces of the electrically conductive adhesive layer. The first and second major surfaces are spaced apart a distance D. The particles are agglomerated so as to form a plurality of substantially continuous layers of particles generally extending along orthogonal first and second directions and arranged along a third direction. Each substantially continuous layer of particles has a length L along the first direction from a first to an opposing second edge of the electrically conductive adhesive layer and a width W along the second direction extending from the first to the second major surface. L/D ≥ 100. At least some of the particles are electrically conductive.

There is provided a conductive adhesive with which the connection stability between objects that are conductive members is excellent, the connection stability is maintained even when the conductive adhesive is subjected to high temperature, and rising towards the back side of an object is less likely to occur.

A conductive adhesive 1 includes a binder component 12, and metal particles (A) 11 having a 20% compressive strength of 25 MPa or less in a 170° C. environment. The metal particles 11 preferably include a metal having a melting point of 280° C. or less. The content of the metal having a melting point of 280° C. or less in the metal particles (A) 11 is preferably 80% by mass or more.

There is provided a conductive adhesive with which the connection stability between objects that are conductive members is excellent, the connection stability is maintained even when the conductive adhesive is subjected to high temperature, and rising towards the back side of an object is less likely to occur.

A conductive adhesive 1 includes a binder component 12, and metal particles (A) 11 having a 20% compressive strength of 25 MPa or less in a 170° C. environment. The metal particles 11 preferably include a metal having a melting point of 280° C. or less. The content of the metal having a melting point of 280° C. or less in the metal particles (A) 11 is preferably 80% by mass or more.

The present application relates to a cross-linkable composition. The present application can provide a cross-linkable composition without degradation of cross-linking efficiency while exhibiting conductivity by containing an ionic compound, and its use.