Patent classifications
C09J135/02
COMPOSITION FOR FORMING EASY-TO-DETACH THIN RESIN FILM, AND EASY-TO-DETACH THIN RESIN FILM
The invention provides a composition for forming an easy-to-detach thin resin film, the composition being characterized by including a urethane (meth)acrylate compound, and a first polymerizable composition containing an ethylenic unsaturated monomer having a tert-butoxy group and a radical polymerization initiator, or a polymer of a second polymerizable composition containing the ethylenic unsaturated monomer having a tert-butoxy group, wherein the amount of the ethylenic unsaturated monomer having a tert-butoxy group is 5 mass % or more and less than 95 mass % with respect to the sum of the amount of the urethane (meth)acrylate compound and the total amount of the monomer(s) contained in the first polymerizable composition or the second polymerizable composition.
BIOCOMPATIBLE ADHESIVE
The present invention is to provide an adhesive composition which comprises a copolymer A which contains a recurring unit having a cyclic ether structure and a recurring unit having a benzophenone structure, and a copolymer B which contains a recurring unit having a betaine structure and a recurring unit having a hydroxyl group, a cured product thereof, and a method for producing the cured product. The adhesive composition of the present invention is capable of curing in water, has high hydrophilicity, and is capable of forming a cured product having an excellent ability to inhibit adhesion of biological substances.
BIOCOMPATIBLE ADHESIVE
The present invention is to provide an adhesive composition which comprises a copolymer A which contains a recurring unit having a cyclic ether structure and a recurring unit having a benzophenone structure, and a copolymer B which contains a recurring unit having a betaine structure and a recurring unit having a hydroxyl group, a cured product thereof, and a method for producing the cured product. The adhesive composition of the present invention is capable of curing in water, has high hydrophilicity, and is capable of forming a cured product having an excellent ability to inhibit adhesion of biological substances.
BIODEGRADABLE ADHESIVE COMPOSITION
An adhesive composition comprises about 2.5 to about 12% by weight of a biodegradable polymer; about 0.5 to about 1.5% by weight of a preservative; and at least 10% by weight of water.
BIODEGRADABLE ADHESIVE COMPOSITION
An adhesive composition comprises about 2.5 to about 12% by weight of a biodegradable polymer; about 0.5 to about 1.5% by weight of a preservative; and at least 10% by weight of water.
RESIN COMPOSITION
The present invention relates to a cuarable resin composition, etc., having an excellent transparency, applicability, and workability. Specifically, the present invention relates to a resin composition, etc., including: (A) a polymer having two or more (meth)acryloyl groups in one molecule thereof; (B) a silica powder surface-treated with an alkyl silane; and (C) boric acid or a borate ester.
RESIN COMPOSITION
The present invention relates to a cuarable resin composition, etc., having an excellent transparency, applicability, and workability. Specifically, the present invention relates to a resin composition, etc., including: (A) a polymer having two or more (meth)acryloyl groups in one molecule thereof; (B) a silica powder surface-treated with an alkyl silane; and (C) boric acid or a borate ester.
UV light curable adhesive and device with UV light curable adhesive
A UV light curable adhesive is disclosed, comprising, at least one bi-active monomer, at least one polymerizable oligomer, a primary photoinitiator, and a monomer scavenger, wherein photopolymerization of the at least one bi-active monomer by the primary photoinitiator activates the monomer scavenger, reducing residual monomer content in a cured adhesive formed by the photopolymerization of the bi-active monomer in comparison to an otherwise identical comparative UV adhesive lacking the monomer scavenger. A method for curing the UV light curable adhesive is disclosed, including applying the UV light curable adhesive to a surface and exposing the UV light curable adhesive to UV light, free from heating the UV light curable adhesive other than any autogenous increases in temperature from exothermic polymerization reactions. A device with the UV light cured adhesive is disclosed, including the UV light cured adhesive joining a first surface to a second surface.
UV light curable adhesive and device with UV light curable adhesive
A UV light curable adhesive is disclosed, comprising, at least one bi-active monomer, at least one polymerizable oligomer, a primary photoinitiator, and a monomer scavenger, wherein photopolymerization of the at least one bi-active monomer by the primary photoinitiator activates the monomer scavenger, reducing residual monomer content in a cured adhesive formed by the photopolymerization of the bi-active monomer in comparison to an otherwise identical comparative UV adhesive lacking the monomer scavenger. A method for curing the UV light curable adhesive is disclosed, including applying the UV light curable adhesive to a surface and exposing the UV light curable adhesive to UV light, free from heating the UV light curable adhesive other than any autogenous increases in temperature from exothermic polymerization reactions. A device with the UV light cured adhesive is disclosed, including the UV light cured adhesive joining a first surface to a second surface.
LIGHT OR HEAT TRIGGERED FRONTALLY CURED CURE-ON-DEMAND ADHESIVES KIT
A cure-on-demand adhesive kit capable of self-sustaining frontal polymerization after a heat or actinic radiation trigger for bonding two substrates is provided. The kit includes a first monomer/oligomer component and a UV or thermal cure catalyst component. In practical application, the first monomer/oligomer component and the UV or thermal cure catalyst component are mixed together to form a ready-to-use prepolymer mixture. The prepolymer mixture is applied onto the surface of a first substrate, and the first substrate is contacted with a second substrate by the mixture applied side. After giving a heat or actinic radiation trigger, a self-sustaining frontal polymerization of the mixture will be started for curing the mixture between two substrates as an adhesive to adhere the two substrates.