An adhesive article that remains securely bonded to a substrate until a stimuli is applied. The article may be embodied as an adhesive tape, a bandage, or as other articles. The stimuli may be a change in temperature or application of a reduction that causes a structure within the article to break, creak, or otherwise disrupt to expose the adhesive to a solvent, such as via a difference in Coefficient of Thermal Expansion (CTE) or by exposing the article to a glass transition temperature.

An adhesive article that remains securely bonded to a substrate until a stimuli is applied. The article may be embodied as an adhesive tape, a bandage, or as other articles. The stimuli may be a change in temperature or application of a reduction that causes a structure within the article to break, creak, or otherwise disrupt to expose the adhesive to a solvent, such as via a difference in Coefficient of Thermal Expansion (CTE) or by exposing the article to a glass transition temperature.

An adhesive article that remains securely bonded to a substrate until a stimuli is applied. The article may be embodied as an adhesive tape, a bandage, or as other articles. The stimuli may be a change in temperature or application of a reduction that causes a structure within the article to break, creak, or otherwise disrupt to expose the adhesive to a solvent, such as via a difference in Coefficient of Thermal Expansion (CTE) or by exposing the article to a glass transition temperature.

The invention relates to a method of manufacturing an electronic device comprising the steps of: preparing a substrate comprising an electrically conductive layer; applying a conductive paste on the electrically conductive layer, wherein the conductive paste comprises 100 parts by weight of a metal powder, 5 to 20 parts by weight of a solvent and 0.01 to 5 parts by weight of a dispersant and wherein the dispersant is selected from the group consisting of allyl ether copolymer, polyhydroxy fatty acid and a mixture thereof; mounting an electrical component on the applied conductive paste; and heating the conductive paste to bond the electrically conductive layer and the electrical component.

The invention relates to a method of manufacturing an electronic device comprising the steps of: preparing a substrate comprising an electrically conductive layer; applying a conductive paste on the electrically conductive layer, wherein the conductive paste comprises 100 parts by weight of a metal powder, 5 to 20 parts by weight of a solvent and 0.01 to 5 parts by weight of a dispersant and wherein the dispersant is selected from the group consisting of allyl ether copolymer, polyhydroxy fatty acid and a mixture thereof; mounting an electrical component on the applied conductive paste; and heating the conductive paste to bond the electrically conductive layer and the electrical component.

The invention relates to a method of manufacturing an electronic device comprising the steps of: preparing a substrate comprising an electrically conductive layer; applying a conductive paste on the electrically conductive layer, wherein the conductive paste comprises 100 parts by weight of a metal powder, 5 to 20 parts by weight of a solvent and 0.01 to 5 parts by weight of a dispersant and wherein the dispersant is selected from the group consisting of allyl ether copolymer, polyhydroxy fatty acid and a mixture thereof; mounting an electrical component on the applied conductive paste; and heating the conductive paste to bond the electrically conductive layer and the electrical component.

An adhesive article that remains securely bonded to a substrate until a stimuli is applied. The article may be embodied as an adhesive tape, a bandage, or as other articles. The stimuli may be a change in temperature or application of a reduction that causes a structure within the article to break, creak, or otherwise disrupt to expose the adhesive to a solvent, such as via a difference in Coefficient of Thermal Expansion (CTE) or by exposing the article to a glass transition temperature.

An adhesive article that remains securely bonded to a substrate until a stimuli is applied. The article may be embodied as an adhesive tape, a bandage, or as other articles. The stimuli may be a change in temperature or application of a reduction that causes a structure within the article to break, creak, or otherwise disrupt to expose the adhesive to a solvent, such as via a difference in Coefficient of Thermal Expansion (CTE) or by exposing the article to a glass transition temperature.

A polycarbonate polyfunctional-vinyl ether molecule of formula (I):

##STR00001##

A polycarbonate polyfunctional-vinyl ether molecule of formula (I):

##STR00001##