Provided is a technique suitable for multilayering thin semiconductor elements via adhesive bonding while avoiding wafer damage in a method of manufacturing a semiconductor device, the method in which semiconductor elements are multilayered through laminating wafers in which the semiconductor elements are fabricated. The method of the present invention includes bonding and removing. In the bonding step, a back surface 1b side of a thinned wafer 1T in a reinforced wafer 1R having a laminated structure including a supporting substrate S, a temporary adhesive layer 2, and the thinned wafer 1T is bonded via an adhesive to an element forming surface 3a of a wafer 3. A temporary adhesive for forming the temporary adhesive layer 2 contains a polyvalent vinyl ether compound, a compound having two or more hydroxy groups or carboxy groups and thus capable of forming a polymer with the polyvalent vinyl ether compound, and a thermoplastic resin. The adhesive contains a polymerizable group-containing polyorganosilsesquioxane. In the removing step, a temporary adhesion by the temporary adhesive layer 2 between the supporting substrate S and the thinned wafer 1T is released to remove the supporting substrate S.

Provided is a technique suitable for multilayering thin semiconductor elements via adhesive bonding while avoiding wafer damage in a method of manufacturing a semiconductor device, the method in which semiconductor elements are multilayered through laminating wafers in which the semiconductor elements are fabricated. The method of the present invention includes bonding and removing. In the bonding step, a back surface 1b side of a thinned wafer 1T in a reinforced wafer 1R having a laminated structure including a supporting substrate S, a temporary adhesive layer 2, and the thinned wafer 1T is bonded via an adhesive to an element forming surface 3a of a wafer 3. A temporary adhesive for forming the temporary adhesive layer 2 contains a polyvalent vinyl ether compound, a compound having two or more hydroxy groups or carboxy groups and thus capable of forming a polymer with the polyvalent vinyl ether compound, and a thermoplastic resin. The adhesive contains a polymerizable group-containing polyorganosilsesquioxane. In the removing step, a temporary adhesion by the temporary adhesive layer 2 between the supporting substrate S and the thinned wafer 1T is released to remove the supporting substrate S.

Provided is a coating for forming a conductive release layer capable of forming a conductive release layer having high adhesion to a film base material, suppressing deterioration in conductivity over time in the air, and having a sufficient releasing property. The coating for forming a conductive release layer of the present invention contains a conductive composite including a π-conjugated conductive polymer and a polyanion, an epoxy compound having an epoxy group, a curable silicone, a polyester resin, and an organic solvent.

An adhesive sheet for temporary fixation which may have excellent heat resistance to exhibit a sufficient adhesive force even though it undergoes a high temperature process during a process of manufacturing a semiconductor device and may also exhibit a sufficient reduction of the adhesive force by photocuring during the step of peeling off, and a method of manufacturing a semiconductor device using the same, are provided.

An adhesive sheet for temporary fixation which may have excellent heat resistance to exhibit a sufficient adhesive force even though it undergoes a high temperature process during a process of manufacturing a semiconductor device and may also exhibit a sufficient reduction of the adhesive force by photocuring during the step of peeling off, and a method of manufacturing a semiconductor device using the same, are provided.

A multilayer film bonded to a base fabric includes a first layer bonded to the base fabric; and a second layer disposed on the first layer. The first layer, the second layer, or both includes a thermoplastic elastomer. The thermoplastic elastomer is at least one selected from the group consisting of a polyester-based elastomer, a polyurethane-based elastomer, and a polyamide-based elastomer. A melt strength of the multilayer film is greater than or equal to 7.5 mN.

A multilayer film bonded to a base fabric includes a first layer bonded to the base fabric; and a second layer disposed on the first layer. The first layer, the second layer, or both includes a thermoplastic elastomer. The thermoplastic elastomer is at least one selected from the group consisting of a polyester-based elastomer, a polyurethane-based elastomer, and a polyamide-based elastomer. A melt strength of the multilayer film is greater than or equal to 7.5 mN.

The present invention relates to a battery pack to which a thin-film label can be easily attached, and a label attaching method thereof. Disclosed in one embodiment is a battery pack comprising: a battery cell having an electrode assembly accommodated in a case; and an external film, which has a label attached to at least one surface of the case and directly attached to the case, a step difference compensation tape attached to the upper surface of the label and positioned on one side of the label, and a protective film attached to the upper surface of the label and extending to the upper part of the step difference compensation tape, wherein the protective film is attached so as to be detachable from the label.

The present invention relates to a battery pack to which a thin-film label can be easily attached, and a label attaching method thereof. Disclosed in one embodiment is a battery pack comprising: a battery cell having an electrode assembly accommodated in a case; and an external film, which has a label attached to at least one surface of the case and directly attached to the case, a step difference compensation tape attached to the upper surface of the label and positioned on one side of the label, and a protective film attached to the upper surface of the label and extending to the upper part of the step difference compensation tape, wherein the protective film is attached so as to be detachable from the label.

A composition comprising a pre-polymer having activated and functionalized groups on a polymeric backbone is disclosed. The composition may be used in a method of adhering or sealing tissue, or for adhering a medical device to the surface of a tissue.