A curable perfluoropolyether adhesive composition containing the following components (A) to (C): (A) 100 parts by mass of a linear perfluoropolyether compound having at least two alkenyl groups per molecule and having a perfluoropolyether structure containing a repeating unit represented by —C.sub.aF.sub.2aO— in a main chain, “a” being an integer of 1 to 6; (B) an effective curing amount of an organosilicon compound having at least two silicon-bonded hydrogen atoms per molecule; and (C) a catalytic amount of a hydrosilylation-reaction catalyst, where a cured product of the curable perfluoropolyether adhesive composition is an adhesive having adhesion of less than 0.5 N/25 mm.

An apparatus comprising: a module; a substrate; and electrolyte between the module and the substrate, wherein an electronic component is formed between the module and the substrate and wherein the electrolyte is configured to function as the electrolyte in the electronic component and also as the adhesive to attach the module to the substrate.

An apparatus comprising: a module; a substrate; and electrolyte between the module and the substrate, wherein an electronic component is formed between the module and the substrate and wherein the electrolyte is configured to function as the electrolyte in the electronic component and also as the adhesive to attach the module to the substrate.

Provided is a technique suitable for multilayering thin semiconductor elements via adhesive bonding while avoiding wafer damage in a method of manufacturing a semiconductor device, the method in which semiconductor elements are multilayered through laminating wafers in which the semiconductor elements are fabricated. The method of the present invention includes bonding and removing. In the bonding step, a back surface 1b side of a thinned wafer 1T in a reinforced wafer 1R having a laminated structure including a supporting substrate S, a temporary adhesive layer 2, and the thinned wafer 1T is bonded via an adhesive to an element forming surface 3a of a wafer 3. A temporary adhesive for forming the temporary adhesive layer 2 contains a polyvalent vinyl ether compound, a compound having two or more hydroxy groups or carboxy groups and thus capable of forming a polymer with the polyvalent vinyl ether compound, and a thermoplastic resin. The adhesive contains a polymerizable group-containing polyorganosilsesquioxane. In the removing step, a temporary adhesion by the temporary adhesive layer 2 between the supporting substrate S and the thinned wafer 1T is released to remove the supporting substrate S.

Provided is a technique suitable for multilayering thin semiconductor elements via adhesive bonding while avoiding wafer damage in a method of manufacturing a semiconductor device, the method in which semiconductor elements are multilayered through laminating wafers in which the semiconductor elements are fabricated. The method of the present invention includes bonding and removing. In the bonding step, a back surface 1b side of a thinned wafer 1T in a reinforced wafer 1R having a laminated structure including a supporting substrate S, a temporary adhesive layer 2, and the thinned wafer 1T is bonded via an adhesive to an element forming surface 3a of a wafer 3. A temporary adhesive for forming the temporary adhesive layer 2 contains a polyvalent vinyl ether compound, a compound having two or more hydroxy groups or carboxy groups and thus capable of forming a polymer with the polyvalent vinyl ether compound, and a thermoplastic resin. The adhesive contains a polymerizable group-containing polyorganosilsesquioxane. In the removing step, a temporary adhesion by the temporary adhesive layer 2 between the supporting substrate S and the thinned wafer 1T is released to remove the supporting substrate S.

A multicomponent adhesive composition comprises a composition A and a composition B. Composition A comprises at least one silyl polymer comprising at least one hydrolyzable alkoxysilane group and at least one tackifying resin. Composition B comprises at least one catalyst and at least one compound C chosen from a compound C1 with a number-average molecular mass ranging from 300 g/mol to 500 000 g/mol; and a compound C2 with a vapor pressure at 20° C. of greater than or equal to 0.08 kPa; and mixtures thereof. The composition A:composition B mass ratio ranges from 99.98:0.02 to 60:40. The total content of catalyst ranges from 0.01% to 10% relative to the total weight of said adhesive composition.

A tire comprises an interior surface and an exterior surface, an accommodating region arranged on one of said interior and exterior surfaces, an adhesive layer arranged on the accommodating region and a member attached to the accommodating region by the adhesive layer, in which the adhesive layer is based on a silanized polyether.

A tire comprises an interior surface and an exterior surface, an accommodating region arranged on one of said interior and exterior surfaces, an adhesive layer arranged on the accommodating region and a member attached to the accommodating region by the adhesive layer, in which the adhesive layer is based on a silanized polyether.

The disclosure relates to moisture curable compositions based on a combination of silane-modified polymer and silane functional additive, their manufacture and use. The silane functional additive is preferably prepared from a water miscible polyol having a functionality of about 2 to about 4 and/or a polyol having a tertiary nitrogen atom in the backbone and a functionality equal or greater than about 2.

The disclosure relates to moisture curable compositions based on a combination of silane-modified polymer and silane functional additive, their manufacture and use. The silane functional additive is preferably prepared from a water miscible polyol having a functionality of about 2 to about 4 and/or a polyol having a tertiary nitrogen atom in the backbone and a functionality equal or greater than about 2.