A resin composition contains a (A) thermoplastic component, a (B) thermosetting component, and a (C) inorganic filler, 5%-weight-reduction temperature of a hardened substance of the resin composition being 440 degrees C. or more.

A composite comprises: a reinforcing element (10), an adhesive layer (14) made from an adhesive composition, and an elastomeric body made from an elastomeric matrix comprising an ethylene/alpha-olefin type elastomer and/or a polychloroprene elastomer. The adhesive composition comprises a resin based: on a polyphenol comprising an aromatic ring bearing two hydroxyl functions in the meta position relative to one another, the two positions ortho to one of the hydroxyl functions being unsubstituted; and/or on a monophenol comprising a six-membered aromatic ring bearing a single hydroxyl function, the two ortho positions being unsubstituted, or an ortho position and the para position being unsubstituted, and on a compound comprising an aromatic ring bearing two functions, one of these functions being a hydroxymethyl function and the other being an aldehyde function or a hydroxymethyl function.

A composite comprises: a reinforcing element (10), an adhesive layer (14) made from an adhesive composition, and an elastomeric body made from an elastomeric matrix comprising an ethylene/alpha-olefin type elastomer and/or a polychloroprene elastomer. The adhesive composition comprises a resin based: on a polyphenol comprising an aromatic ring bearing two hydroxyl functions in the meta position relative to one another, the two positions ortho to one of the hydroxyl functions being unsubstituted; and/or on a monophenol comprising a six-membered aromatic ring bearing a single hydroxyl function, the two ortho positions being unsubstituted, or an ortho position and the para position being unsubstituted, and on a compound comprising an aromatic ring bearing two functions, one of these functions being a hydroxymethyl function and the other being an aldehyde function or a hydroxymethyl function.

An adhesive resin composition for bonding two adherends of different materials together, the composition comprising a phenoxy resin and a polyester elastomer at a weight ratio (phenoxy resin:polyester elastomer) ranging from 20:80 to 80:20, wherein the area of portions where solid matter forms a phase separation structure attributed to both of the phenoxy resin and the polyester elastomer is at most 1 area % of an entire observation area in an elastic modulus phase image of a plurality of arbitrarily defined 10-μm square regions observed by an atomic force microscope (AFM) to which a probe having a tip radius of curvature of 10 nm at 25° C. is attached.

An adhesive resin composition for bonding two adherends of different materials together, the composition comprising a phenoxy resin and a polyester elastomer at a weight ratio (phenoxy resin:polyester elastomer) ranging from 20:80 to 80:20, wherein the area of portions where solid matter forms a phase separation structure attributed to both of the phenoxy resin and the polyester elastomer is at most 1 area % of an entire observation area in an elastic modulus phase image of a plurality of arbitrarily defined 10-μm square regions observed by an atomic force microscope (AFM) to which a probe having a tip radius of curvature of 10 nm at 25° C. is attached.

Provided is a thermosetting adhesive including: a polyurethane; an isocyanate; an epoxy; and a phenoxy resin, in which dynamic viscoelasticity spectrum of a cured product has a peak indicating a softening temperature in an area of 200° C. or higher and has no peak in an area of 160° C. or lower.

Provided is a thermosetting adhesive including: a polyurethane; an isocyanate; an epoxy; and a phenoxy resin, in which dynamic viscoelasticity spectrum of a cured product has a peak indicating a softening temperature in an area of 200° C. or higher and has no peak in an area of 160° C. or lower.

Provided is a thermosetting adhesive including: a polyurethane; an isocyanate; an epoxy; and a phenoxy resin, in which dynamic viscoelasticity spectrum of a cured product has a peak indicating a softening temperature in an area of 200° C. or higher and has no peak in an area of 160° C. or lower.

A temporary adhesive includes: a polar resin of 5 wt % to 50 wt %, a first solvent of 30 wt % to 90 wt %, and a second solvent of 5 wt % to 60 wt %, wherein the polar resin includes at least one selected from a group consisting of a phenoxy resin, a poly(ether-ether-ketone) resin, a polycarbonate resin, a modified epoxy resin, or a polyolefin resin with a modified polar group; the first solvent is used to dissolve the polar resin; and the second solvent is used to improve a leveling property of the temporary adhesive.

A temporary adhesive includes: a polar resin of 5 wt % to 50 wt %, a first solvent of 30 wt % to 90 wt %, and a second solvent of 5 wt % to 60 wt %, wherein the polar resin includes at least one selected from a group consisting of a phenoxy resin, a poly(ether-ether-ketone) resin, a polycarbonate resin, a modified epoxy resin, or a polyolefin resin with a modified polar group; the first solvent is used to dissolve the polar resin; and the second solvent is used to improve a leveling property of the temporary adhesive.