Provided are flux-compatible epoxy-anhydride compositions useful as low-gap underfill adhesives. The flux-compatible epoxy-anhydride compositions include an epoxy component and an anhydride composition comprising a monofunctional anhydride and at least one difunctional anhydride and optionally at least one polyfunctional anhydride. The flux-compatible compositions are useful as an underfilling sealant which (1) rapidly fills the underfill space in a semiconductor device, such as a flip chip assembly, (2) enables the device to be securely connected to a circuit board by short-time heat curing and with good productivity, and (3) demonstrates excellent solder reflow resistance.

Provided are flux-compatible epoxy-anhydride compositions useful as low-gap underfill adhesives. The flux-compatible epoxy-anhydride compositions include an epoxy component and an anhydride composition comprising a monofunctional anhydride and at least one difunctional anhydride and optionally at least one polyfunctional anhydride. The flux-compatible compositions are useful as an underfilling sealant which (1) rapidly fills the underfill space in a semiconductor device, such as a flip chip assembly, (2) enables the device to be securely connected to a circuit board by short-time heat curing and with good productivity, and (3) demonstrates excellent solder reflow resistance.

A curable composition obtained by blending a polymerizable compound (A) having predetermined types of polymerizable functional groups, a reactive compound (B) having predetermined types of reactive functional groups, a compound (C) which is an imidazolyl group-containing compound having a predetermined structure, and a compound (D) which is an oxime compound or an oxime ester compound having a predetermined structure.

A curable composition obtained by blending a polymerizable compound (A) having predetermined types of polymerizable functional groups, a reactive compound (B) having predetermined types of reactive functional groups, a compound (C) which is an imidazolyl group-containing compound having a predetermined structure, and a compound (D) which is an oxime compound or an oxime ester compound having a predetermined structure.