A production method of a laminate including a substrate and a light-transmitting support plate that are laminated each other via an adhesive layer and a release layer that is altered through absorption of light, the method including a release layer forming step of coating a reactive polysilsesquioxane on a surface of the support plate, the surface being opposed to the substrate, and heating the reactive polysilsesquioxane to perform polymerization, thereby forming the release layer.

The invention relates to a composition comprising a sulfone-group containing resin obtainable by reaction of a polyamine containing at least one sulfone-group with a polyepoxide and optionally a hardener, as well as adhesives and coating compositions comprising said compositions having gas-barrier properties, methods for bonding substrates using said adhesives and the thus obtained articles as well as the use of the compositions described herein as adhesive or coatings having gas-barrier properties.

The invention relates to a composition comprising a sulfone-group containing resin obtainable by reaction of a polyamine containing at least one sulfone-group with a polyepoxide and optionally a hardener, as well as adhesives and coating compositions comprising said compositions having gas-barrier properties, methods for bonding substrates using said adhesives and the thus obtained articles as well as the use of the compositions described herein as adhesive or coatings having gas-barrier properties.

Adhesive formulations for forming a fluorinated poly(imide-phthalonitrile) thermoset polymer are provided. Such an adhesive formulation may comprise a fluorinated imide-phthalonitrile oligomer having Formula IV

##STR00001##

wherein R.sub.1 is an unsubstituted or substituted aryl group and does not comprise an ether group; R.sub.2 is an unsubstituted or substituted aryl group and does not comprise an ether group; at least one of R.sub.1 and R.sub.2 comprises a fluorine substituent; and n has a value of from 1 to 30.

Adhesive formulations for forming a fluorinated poly(imide-phthalonitrile) thermoset polymer are provided. Such an adhesive formulation may comprise a fluorinated imide-phthalonitrile oligomer having Formula IV

##STR00001##

wherein R.sub.1 is an unsubstituted or substituted aryl group and does not comprise an ether group; R.sub.2 is an unsubstituted or substituted aryl group and does not comprise an ether group; at least one of R.sub.1 and R.sub.2 comprises a fluorine substituent; and n has a value of from 1 to 30.

[Problem] The present invention is to provide: a film which is excellent in film moldability, is also excellent in heat resistance and transparency, and has a small shrinkage factor and a small heating weight loss ratio even under a high-temperature atmosphere; and a heat-resistant adhesive tape comprising the same.

[Solution] A multilayer film having alternately laminated therein one or more layers of each of a substrate layer (A) comprising a sulfone-based resin having a glass transition temperature of 200° C. or more and an adhesive layer (B) comprising a thermoplastic resin having a glass transition temperature of 190° C. or more, and a multilayer film excellent in film moldability, heat resistance, and transparency is obtained due to at least one outermost layer of the multilayer film comprising the adhesive layer (B) and the arithmetic mean surface roughness Ra of a surface of at least one outermost layer of the multilayer film being greater than 0.1 μm and less than 10.0 μm.

[Problem] The present invention is to provide: a film which is excellent in film moldability, is also excellent in heat resistance and transparency, and has a small shrinkage factor and a small heating weight loss ratio even under a high-temperature atmosphere; and a heat-resistant adhesive tape comprising the same.

[Solution] A multilayer film having alternately laminated therein one or more layers of each of a substrate layer (A) comprising a sulfone-based resin having a glass transition temperature of 200° C. or more and an adhesive layer (B) comprising a thermoplastic resin having a glass transition temperature of 190° C. or more, and a multilayer film excellent in film moldability, heat resistance, and transparency is obtained due to at least one outermost layer of the multilayer film comprising the adhesive layer (B) and the arithmetic mean surface roughness Ra of a surface of at least one outermost layer of the multilayer film being greater than 0.1 μm and less than 10.0 μm.

The invention provides an aromatic polysulfone including an aromatic polysulfone having at least one highly polar functional group at its terminus, wherein in the aromatic polysulfone, an area of a signal attributed to the aromatic polysulfone having a highly polar functional group with respect to a total area of all signals attributed to the aromatic polysulfone in a chromatogram obtained by measurement through a gel permeation chromatography method under the following conditions is 19% or more and 100% or less, wherein sample injection volume is 5 L, column is Shodex KF-803 manufactured by Showa Denko K.K., column temperature is 40 C., eluent is N,N-dimethylformamide, eluent flow rate is 0.5 mL/min, and detector is ultraviolet-visible spectrophotometer (UV).

The invention provides an aromatic polysulfone including an aromatic polysulfone having at least one highly polar functional group at its terminus, wherein in the aromatic polysulfone, an area of a signal attributed to the aromatic polysulfone having a highly polar functional group with respect to a total area of all signals attributed to the aromatic polysulfone in a chromatogram obtained by measurement through a gel permeation chromatography method under the following conditions is 19% or more and 100% or less, wherein sample injection volume is 5 L, column is Shodex KF-803 manufactured by Showa Denko K.K., column temperature is 40 C., eluent is N,N-dimethylformamide, eluent flow rate is 0.5 mL/min, and detector is ultraviolet-visible spectrophotometer (UV).

Resin composition, resin adhesive film, and application thereof. The resin composition comprises the following components in parts by weight: 80-120 parts an epoxy resin, 1-20 parts a carbodiimide compound, 30-130 parts a phenolic resin, 20-250 parts a modified polymer, and 50-500 parts silicon dioxide; where the modified polymer is selected from a polyethersulfone or a polyamide-imide resin. By means of selection and compounding of components, the present resin composition has a uniquely advantageous film forming property, effectively solves the problem of a semi-cured resin adhesive film being prone to cracking or fracture, has outstanding heat resistance, a high glass transition temperature, a high modulus, good strength and toughness, and can to form a high strength stable bond with a metal film, has uniquely advantageous reliability, can amply satisfy printed circuit board and chip packaging performance requirements, and is suitable in a variety of chip packaging processes.