A method comprising providing a polymeric substrate having a melting point of from about 130° C. to about 190° C., and locating a material layer onto the substrate, wherein the material layer comprises one or more polymeric materials that liquefy upon exposure to temperatures of at least about 100° C., to blend with a softened portion of the polymeric substrate. Upon exposure of one or more of the substrate and the material layer to a stimulus, the temperature is increased in a predetermined temperature zone of one or more of the substrate and material layer to cause blending of the one or more polymeric materials of the material layer with the softened portion of the polymeric substrate.

Curable compositions, cured compositions, articles containing the curable or cured compositions, and methods of making the articles are provided. More particularly, the curable compositions contain a (meth)acrylate-based polymer having pendant (meth)acryloyl groups, at least one monomer having a single ethylenically unsaturated group, a photoinitiator that includes an acyl phosphine oxide, and a thixotropic agent. The curable compositions can be printed or dispensed, if desired, and the cured compositions are pressure-sensitive adhesives.

Provided is a sealant sheet that is handled as a laminate with a release liner and can be cured by photoirradiation through the release liner. The release-linered sealant sheet has a photo-curable sealant: sheet, and a release liner placed on at least one face of the sealant sheet. The release liner has a light transmittance of 20% or higher in the wavelength range from 350 nm to 450 non.

Provided is a sealing method that uses a photo-curable sealant sheet. The sealing method provided comprises, in the following order, a step of obtaining a photo-curable sealant sheet, a step of subj ecting the sealant sheet to photoirradiation, and a step of applying the sealant sheet to a target object.

Provided is a hydrosilylation reactive composition that has a sufficient pot life at room temperature, that can be cured at low temperature by exposure to high energy radiation, and that produces a stable semi-cured product during the curing process, and to provide a semi-cured product and a cured product obtained using this hydrosilylation reactive composition. The composition comprises: (A) a compound containing at least one aliphatically unsaturated monovalent hydrocarbon group in the molecule; (B) a compound containing at least two hydrogen atoms bonded to silicon atoms in the molecule; (C) a first hydrosilylation catalyst exhibiting activity in the composition without exposure to high energy radiation; and (D) a second hydrosilylation catalyst not exhibiting activity unless exposed to high energy radiation, and exhibiting activity in the composition by exposure to high energy radiation.

The invention relates to a method for reducing end face stickiness of a roll (1) of adhesive tape, by supplying a precursor (18) to a plasma stream (20), using the plasma stream (20) enriched with the precursor (18) to coat a carrier film (2) with a passivation coat (3) in a plasma process, placing a carrier film section (5) by its passivation-coated side onto an end face (4) of the roll (1) of adhesive tape, removing the carrier film section (5) and leaving at least part of the passivation coat (6) on the end face (4) and reducing its end face stickiness.

Subject matter disclosed herein relates to improving a contact diameter of an adhesive/sealing material on surfaces of substrates by altering rheological properties of the adhesive/sealing material. An electrowetting display device comprises a first substrate and a second substrate, a first fluid and a second fluid disposed between the first substrate and the second substrate, wherein the first fluid is immiscible with the second fluid. An adhesive/sealing material comprising UV curable epoxy glue is in contact with the second fluid and couples the second substrate to the first substrate. The adhesive/sealing material further comprises silica particles in a range of 1-6% mass fraction of silica that alter rheological properties of the UV curable epoxy glue.

An adhesive set is disclosed. This adhesive set includes a main agent containing a compound having two or more isocyanate groups and a curing agent containing a compound having two or more hydroxyl groups. At least one of the compound having two or more isocyanate groups and the compound having two or more hydroxyl groups has a disulfide bond in the molecule. At least one of the main agent and the curing agent further contains a curing catalyst. At least one of the main agent and the curing agent further contains a photoradical generator.

The instant disclosure describes example techniques for bonding multiple metal structures prior or subsequent to application of a protective coating (e.g., an electrocoating or e-coating) to the structures. In certain aspects, the structures may include one or more attachment points for attaching a single structure or multiple structures bonded together to a clamp or other suitable means for applying an electrical current to the structure(s).

A pressure-sensitive adhesive sheet capable of allowing a small electronic part to be temporarily fixed in a satisfactory manner and satisfactorily peeled. The pressure-sensitive adhesive sheet includes: a gas-generating layer; and a gas barrier layer arranged on at least one side of the gas-generating layer, wherein the gas barrier layer is a layer that is deformed through laser light irradiation of the pressure-sensitive adhesive sheet, wherein a thickness (μm) of a highly elastic portion of the gas barrier layer is equal to or smaller than a value calculated by the following expression (1), and wherein the thickness (μm) of the highly elastic portion of the gas barrier layer is equal to or larger than a value calculated by the following expression (2): 12546×EXP(−0.728×log.sub.10(Er×10.sup.6)) . . . (1); 18096×EXP(−0.949×log.sub.10(Er×10.sup.6)) . . . (2), where Er represents a modulus of elasticity (MPa) of the highly elastic portion of the gas barrier layer by a nanoindentation method at 25° C.