A curable silicone-(meth)acrylate pressure sensitive composition is curable via hydrosilylation reaction to form a silicone-(meth)acrylate pressure sensitive adhesive with an initial adhesion. When the silicone-(meth)acrylate pressure sensitive adhesive is exposed to actinic radiation, the resulting silicone-(meth)acrylate adhesive has a subsequent adhesion, which is higher than the initial adhesion.

A method for producing a pressure-sensitive adhesive sheet of the present invention includes: forming a pressure-sensitive adhesive layer 10 formed of a transparent, light-cured base pressure-sensitive adhesive material on a support S1; irradiating the pressure-sensitive adhesive layer 10 with an ultraviolet ray U to cure the pressure-sensitive adhesive layer; providing a solution 12 of an ultraviolet absorbing agent 11; applying the solution 12 to one of opposite surfaces of the cured pressure-sensitive adhesive layer 10a to cause the ultraviolet absorbing agent 11 contained in the solution 12 to infiltrate from the one surface in a thickness direction of the pressure-sensitive adhesive layer 10a; and drying the pressure-sensitive adhesive layer 10a.

A method of preparing a light-curable artificial nail includes extracting from an adhesive film in a semi-cured state a portion of the adhesive film in a shape of a human nail. The portion of the adhesive film includes a light-curable composition in the semi-cured state. A portion of the polish film in the shape of the human nail is extracted from a polish film. The portion of the adhesive film and the portion of the polish film are combined to form layers of the light-curable artificial nail.

An adhesive sheet for temporary fixation which may have excellent heat resistance to exhibit a sufficient adhesive force even though it undergoes a high temperature process during a process of manufacturing a semiconductor device and may also exhibit a sufficient reduction of the adhesive force by photocuring during the step of peeling off, and a method of manufacturing a semiconductor device using the same, are provided.

Pressure sensitive adhesives and tapes having flame-retardant properties include a substrate layer and a layer of pressure sensitive adhesive disposed on the substrate layer. The pressure sensitive adhesive is a UV-cured composition of a curable composition. The curable composition includes a polymerizable (meth)acrylate-based mixture, a polymerizable aromatic (meth)acrylate oligomer, a liquid flame retarding agent, and at least one UV initiator. The UV-cured composition is an optically clear pressure sensitive adhesive with flame retarding properties.

The present invention provides a dual-curable hybrid adhesive composition including a photo-initiator, a thermal initiator, and a thiol group-containing compound, and more particularly, to an adhesive composition which may be cured through a single curing by ultraviolet (UV) light or heat, and where thermal curing proceeds concurrently with UV curing by a heat generated during the UV curing such that even a light shield portion which may not transmit UV light therethrough may be sufficiently cured.

A system includes a vacuum chuck; and a tape. The tape includes a flexible polymer substrate; and an adhesive die catching film disposed on the flexible polymer substrate facing a front surface of the flexible polymer substrate. The tape is held on the vacuum chuck by suction applied to a rear surface of the flexible polymer substrate.

Provided is a pressure-sensitive adhesive sheet that can temporarily fix an adherend in a peelable manner, the pressure-sensitive adhesive sheet being free from requiring the application of high-output laser light at the time of the peeling of the adherend and being capable of eliminating the need for a step of washing the adherend after the peeling. The pressure-sensitive adhesive sheet of the present invention includes a pressure-sensitive adhesive layer containing a UV absorber and an active energy ray-curable pressure-sensitive adhesive, wherein the pressure-sensitive adhesive sheet has a transmittance of 50% or less for light having a wavelength of 355 nm. In one embodiment, the pressure-sensitive adhesive layer has a thickness of 20 μm or less. In one embodiment, the pressure-sensitive adhesive sheet has a visible light transmittance of 50% or more.

A spacer tape is provided for spacing apart turns of a winding, which comprises a tape having an upper surface, a lower surface and a longitudinal axis, wherein the lower surface is adhesable and configured to be adhered to a conductor forming a turn of the winding, and spacers with an upper surface and a lower surface arranged on the tape, wherein the lower surface of the spacers is adhered to the upper surface of the tape, and wherein the upper surface of the spacers are adhesable and configured to be adhered to the conductor forming an adjacent turn of the winding.

An adhesive composition includes a resin, a crosslinking agent, and a light absorber. The light absorber includes at least one selected from the group consisting of a benzophenone-based compound, a cyanoacrylate-based compound having a ring structure, a benzotriazole-based compound, and a sterically hindered amine compound having a ring structure.