Patent classifications
C09J2400/143
DYNAMICALLY CROSSLINKED TOUGH ADHESIVE WITH RECYCLABILITY
A crosslinked adhesive composition comprising: (i) a polymer; (ii) solid particles embedded within the polymer; and (iii) a multiplicity of boronate linkages crosslinking between the polymer and solid particles, wherein the boronate linkages have the formula
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wherein the polymer and particles are connected to each other through the boronate linkages, and the crosslinked adhesive composition has an ability to bond surfaces and a further ability to thermally debond and rebond the surfaces. Also described herein is a method of bonding first and second surfaces together, the method comprising placing the above-described crosslinked adhesive composition onto the first surface and pressing the second surface onto the crosslinked adhesive composition on the first surface.
Layered film production method
Provided is a method of manufacturing a laminated film, the method including laminating a glass film and a resin film via an adhesive layer, by which peeling between the glass film and the resin film is prevented, and hence a laminated film excellent in appearance can be obtained. The method of manufacturing a laminated film of the present invention includes the steps of: laminating a glass film and a resin film via an adhesive to provide a precursor laminate; and curing the adhesive by applying an active energy ray to the precursor laminate, wherein the curing step includes nonuniformly applying the active energy ray in a surface of the precursor laminate.
ADHESIVE COMPOSITIONS AND KITS FOR APPLICATION OF SCREEN PROTECTORS
A screen protector application kit includes a glass-based substrate (110) having an adhesive belt (270) and an adhesive container (478) of an uncured adhesive composition. The adhesive belt (270) includes a first major surface (272) adhered to the glass-based substrate (110), a second major surface (274), a distal edge (276) extending between the first major surface (272) and the second major surface (274), and a proximal edge (278) extending between the first major surface (272) and the second major surface (274). The uncured adhesive composition includes 30 wt % to 99.9 wt % of at least one of: (i) a monomer; and (ii) an oligomer; and 0.01 wt % to 10 wt % of a visible-light photoinitiator. The uncured adhesive composition may further include 0.1 wt % to 10 wt % of a co-initiator. The uncured adhesive composition may further include 0.1 wt % to 5 wt % of an oxygen inhibitor.
POLYMER FOR INCREASING THE ELECTRICAL RESISTANCE OF A POLYURETHANE COMPOSITION
A poly(meth)acrylate urethane polymer, obtained from the reaction of at least one monomeric diisocyanate and a poly(meth)acrylate polyol having an OH number in the range from 50 to 200 mg KOH/g in an NCO/OH ratio of at least 3/1, followed by removal of a majority of the monomeric diisocyanate by means of a suitable separation method, wherein it has an NCO content in the range from 2.5% to 8% by weight, based on the poly(meth)acrylate urethane polymer, and a residual content of unconverted monomeric diisocyanates of not more than 0.5% by weight, and to the use thereof as additive and to moisture-curing polyurethane compositions.
Epoxy based reinforcing patches having improved damping loss factor
A reinforcing sheet including one or more layers of a reinforcing material, and a thermosetting adhesive associated with the reinforcing material, wherein the thermosetting adhesive includes a curing agent, and an epoxy-modified dimerized fatty acid combined with an epoxy terminated polyurethane interpenetrating network.
Sealant tape
Various embodiments disclosed related to sealant tape. The sealant tape can include a cured product of a sealant composition including a curable liquid that includes a polysulfide, a polythioether, a copolymer thereof, or a combination thereof. The sealant composition also includes a curing agent for curing the curable liquid. Various embodiments provide cured products of the sealant composition, sealant tapes including the cured product, and sealant tapes including any suitable material with an adhesive pattern thereon.
METHOD AND APPARATUS FOR APPLYING LIGHT TO CURE ADHESIVES
Methods, systems, devices, and apparatuses are described. Light output by a light source may be transformed into an annular shape (e.g., a spatial distribution of the light may be modified to have an annular shape) to cure an adhesive material having a similar annular shape. For example, a system may include a light source emitting light (e.g., ultraviolet (UV) light) having an angular distribution and a spatial distribution. An optical system may modify a shape of the spatial distribution into an annular shape, and the light having the annular shape may be focused on an adhesive material to cure the adhesive material. In some examples, the adhesive material may be positioned between an optical element and a structural component, and the focused light in the annular shape may cure the adhesive material while simultaneously avoiding one or more other optical components or structures.
Laser-releasable bonding materials for 3-D IC applications
Novel polyketanil-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, at wavelengths from about 300 nm to about 360 nm, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are resistant to common solvents used in semiconductor processing. The compositions can also be used as build-up layers for redistribution layer formation.
(METH)ACRYLIC ADHESIVE FILM, OPTICAL MEMBER COMPRISING THE SAME, AND OPTICAL DISPLAY APPARATUS COMPRISING THE SAME
A (meth)acrylic adhesive film, an optical member including the same, and an optical display apparatus including the same are provided. The (meth)acrylic adhesive film includes organic particles, and further includes greater than 0 wt % to 5 wt % of inorganic particles. The (meth)acrylic adhesive film has a haze of 1% or less and an initial dent formation height of 4.5 cm or more.
Cycloolefin polymer bonding method
A cycloolefin polymer (COP) bonding method wherein a first material that is COP and a second material that is COP or glass are bonded. The method includes: a step of exposing at least a bonding surface of the first material to H.sub.2O plasma; and a step of mating the bonding surface of the first material and a bonding surface of the second material. According to the method, the cycloolefin polymer (COP) can be bonded to a target material without applying high pressure or high temperature, and without affecting the optical properties.