A method comprising providing a polymeric substrate having a melting point of from about 130° C. to about 190° C., and locating a material layer onto the substrate, wherein the material layer comprises one or more polymeric materials that liquefy upon exposure to temperatures of at least about 100° C., to blend with a softened portion of the polymeric substrate. Upon exposure of one or more of the substrate and the material layer to a stimulus, the temperature is increased in a predetermined temperature zone of one or more of the substrate and material layer to cause blending of the one or more polymeric materials of the material layer with the softened portion of the polymeric substrate.

The sprayable olefin-based hot melt adhesive and absorbent articles comprising the adhesive are disclosed. The sprayable olefin-based hot melt adhesive is particularly suitable for spraying at low application temperatures. The sprayable low application temperature hot melt adhesives have high green strength, excellent bond strength and aging performance. Moreover, the sprayable low application temperature hot melt adhesives allows for thin bond lines without bleed-through and burn-through risks for heat-sensitive substrates.

A sealing film which seals between a metal first base and a second base, the sealing film including: a first adhesive layer that mainly contains an acid-modified polyolefin and adheres to the first base; a second adhesive layer that mainly contains a polyolefin and adheres to the second base; and a base material layer provided between the first adhesive layer and the second adhesive layer, in which the base material layer contains (A), (B), and (C), a ratio [(A)/(B)+(C)] is 90/10 to 20/80, a content percentage of (B) with respect to a total amount of (A), (B), and (C) is 5% by mass or more and 70% by mass or less, and a content percentage of (C) with respect to the total amount of (A), (B), and (C) is 5% by mass or more and 70% by mass or less.

A plasticizer may be suitable for resins and contain an amorphous propylenic polymer having a weight-average molecular weight (Mw), measured according to a GPC method, in a range of from 5,000 to 30,000 and having a molecular weight distribution (Mw/Mn) of 3.0 or less. The amorphous propylenic polymer may be a propylene homopolymer

A degradable EVOH high-barrier composite film, characterized in that the materials of various layers in the composite film all obtain approximately-consistent biodegradability by introducing biomass, and the additive amount of the additive master batch in the materials of each layer is controlled within the range of 0.3-15% of the total mass of the materials of the corresponding layer; the hydrophilic activity of the hydrophilic groups in the additive master batch should be greater than or equal to that of the hydrophilic groups in the materials of each layer; by adding the additive master batch, the mole ratios of the hydrophilic groups to carbon atoms of the materials of various layers tend to be consistent, namely, the bioactivities tend to be consistent, so that the degradation rates of the materials of various layers in the composite film tend to be consistent. The present invention makes contribution to obtaining approximately-consistent bioactivities and approximately-consistent biodegradation rates by balancing the mole ratios of the hydrophilic groups to carbon atoms in the materials of various layers, and the appearance, the functions and the physical and mechanical properties of a product remain unchanged.

Floor coverings having a greige good, an adhesive layer, and a secondary backing material. The greige good has a primary backing component having adjoined first and second portions, and a plurality of fibers. The secondary backing material has an attached portion and a first exposable portion, with the attached portion adhered to the first portion of the primary backing component by contact with the adhesive layer. The second portion of the primary backing component is unattached to the first exposable portion of the secondary backing material, and the first exposable portion defines a portion of the first end edge of the floor covering. The second portion of the primary backing component is selectively moveable relative to the first portion to a position in which at least a portion of the second portion of the primary backing component does not overlie the first exposable portion of the secondary backing material.

A dielectric welding film capable of achieving a tight welding through a short period of dielectric heating, and a welding method using the dielectric welding film are provided. The dielectric welding film is configured to weld a pair of adherends of the same material or different materials through dielectric heating, the dielectric welding film including a thermoplastic resin as an A component and a dielectric filler as a B component and satisfying the conditions (i) and (ii): (i) a melting point or softening point measured in accordance with JIS K 7121 (1987) is in a range from 80 to 200 degrees C.; and (ii) heat of fusion measured in accordance with JIS K 7121 (1987) is in a range from 1 to 80 J/g.

Described herein is an absorbent article. The absorbent article includes an assembly of components and an adhesive composition joining at least two of the assembly of components together. The adhesive composition includes from about 50 wt. % to about 80 wt. % of one or more copolymers and a blend of one or more heterophase copolymers. The one or more copolymers include from about 30 mole % to about 70 mole % of monomer units selected from ethylene. 1-butene, and mixtures thereof. The one or more copolymers also include from about 30 mole % to about 70 mole % of propene monomer units. The adhesive composition is free of polyisobutylene and has a viscosity of from about 2,000 mPa.Math.s to about 11,500 mPa.Math.s at 150° C.

Described herein is an adhesive composition including a copolymer. The adhesive composition has a viscosity of from about 2,000 mPa.Math.s to about 11,500 mPa.Math.s at 150° C. The adhesive composition has a Storage Modulus at 37° C. of from about 3 MPa to 9.5 MPa. The adhesive composition has a Yield Stress at 37° C. of from about 0.8 MPa to about 1.45 MPa.

A hot-melt adhesive composition, which can be used for bonding of expanded polystyrene foam plates and expanded extruded polystyrene foam plates. The adhesive composition includes at least one at 25° C. solid poly-α-olefin, at least one tackifying resin, and at least one organic phosphorus-containing compound. The invention also uses adhesive composition for bonding of plastic foam plates, to a method for producing a composite element, and to a composite element including a first and second substrate bonded to each via a layer of adhesive composition of the present invention.