An object of the present invention is to provide an adhesive tape that can be removed from an adherend more easily and more rapidly. The adhesive tape of the present invention includes a base material layer, and adhesive layers on both sides of the base material layer, the base material layer has a thickness of 10 to 100 μm, a breaking strength of 20 to 90 MPa, a breaking elongation of 400% to 1,500%, and a 100% modulus of 1 to 5 MPa, and an adhesive composition forming the adhesive layers contains 1% to 40% by mass of filler particles having an average particle diameter of 0.1 to 40 μm with respect to 100% by mass of the adhesive composition.

A multilayer film and a decorative film, each of which is excellent in chipping resistance, exhibits favorable adhesive properties to a variety of resin materials, such as polypropylene and ABS, and a molded body provided with such a film. The multilayer film includes three layers of an impact absorption layer (a), a base material layer (b), and a pressure sensitive adhesive layer (c) disposed in this order, wherein a thermoplastic polymer composition constituting the impact absorption layer (a) is composed of at least one block copolymer containing a polymer block (X) containing a structural unit derived from an aromatic vinyl compound and a polymer block (Y) containing a structural unit derived from a conjugated diene compound, or a hydrogenated product thereof; and has a loss tangent (tan δ) at 11 Hz in a range of −50 to −20° C. of 3×10.sup.−2 or more.

An object of the present invention is to provide an adhesive tape that can be removed from an adherend more easily and more rapidly. The adhesive tape of the present invention includes a base material layer, and adhesive layers on both sides of the base material layer, the base material layer has a thickness of 10 to 100 ?m, a breaking strength of 20 to 90 MPa, a breaking elongation of 400% to 1,500%, and a 100% modulus of 1 to 5 MPa, and an adhesive composition forming the adhesive layers contains 1% to 40% by mass of filler particles having an average particle diameter of 0.1 to 40 ?m with respect to 100% by mass of the adhesive composition.