Provided are methods for adhesively bonding profiles to substrate surface. An example method includes plasma-treating each of a profile surface and a first adhesive side of a layer of pressure sensitive adhesive. The pressure sensitive adhesive includes a) 40 to 70 wt %, based on the total weight of the pressure sensitive adhesive, of at least one poly(meth)acrylate; b) 15 to 50 wt %, based on the total weight of the pressure sensitive adhesive, of at least one synthetic rubber; and c) at least one tackifier compatible with the poly(meth)acrylate(s). The method further includes bonding the profile surface and the first adhesive side to one another, plasma-treating a second adhesive side of the layer of the pressure sensitive adhesive, and bonding the plasma-treated second adhesive side to the substrate surface.

Disclosed herein is a process for laminating a polar substrate with a film cast from a sulfonated block copolymer having at least one end block A and at least one interior block B wherein each A block contains essentially no sulfonic acid or sulfonate ester functional groups and each B block is a polymer block containing from about 10 to about 100 mol percent sulfonic acid or sulfonate ester functional groups based on the number of monomer units. The film is exposed to water and dried onto a polar or active metal substrate. The laminates do not delaminate in the presence of water, or in a humidity of up to 85%, and at a temperature of at least 60° C. The laminates are used for a variety of applications including energy exchange applications.

Disclosed herein is a process for laminating a polar substrate with a film cast from a sulfonated block copolymer having at least one end block A and at least one interior block B wherein each A block contains essentially no sulfonic acid or sulfonate ester functional groups and each B block is a polymer block containing from about 10 to about 100 mol percent sulfonic acid or sulfonate ester functional groups based on the number of monomer units. The film is exposed to water and dried onto a polar or active metal substrate. The laminates do not delaminate in the presence of water, or in a humidity of up to 85%, and at a temperature of at least 60 C. The laminates are used for a variety of applications including energy exchange applications.

A method for connecting sealing strips, includes at least one latent alkyl borane and is substantially free of decomplexing agent for the latent alkyl borane, to a sealing-strip substrate (1), applying a radical-curing adhesive to the sealing-strip substrate (1) pre-treated with the latent alkyl borane, bringing the sealingstrip substrate (1) in contact with a sealing-strip substrate (2) in such a way that the radical-curing adhesive is arranged between the two substrates, and allowing the radical-curing adhesive to cure, a composite structure thus being fonned. The method for adhesively bonding sealing strips based on elastic and thennoplastic substrates, such as EPDM or SBR, but also for adhesively bonding PVC sealing strips. Sealing strips adhesively bonded accordingly are characterized by favorable resistance of the adhesive to alkaline media, wherein conventional adhesives can be used which have optimized properties with regard to the storage stability, the open time, and the curing time thereof.