A multilayer film and a decorative film, each of which is excellent in chipping resistance, exhibits favorable adhesive properties to a variety of resin materials, such as polypropylene and ABS, and a molded body provided with such a film. The multilayer film includes three layers of an impact absorption layer (a), a base material layer (b), and a pressure sensitive adhesive layer (c) disposed in this order, wherein a thermoplastic polymer composition constituting the impact absorption layer (a) is composed of at least one block copolymer containing a polymer block (X) containing a structural unit derived from an aromatic vinyl compound and a polymer block (Y) containing a structural unit derived from a conjugated diene compound, or a hydrogenated product thereof; and has a loss tangent (tan δ) at 11 Hz in a range of −50 to −20° C. of 3×10.sup.−2 or more.