Novel polyketanil-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, at wavelengths from about 300 nm to about 360 nm, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are resistant to common solvents used in semiconductor processing. The compositions can also be used as build-up layers for redistribution layer formation.

Novel polyketanil-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, at wavelengths from about 300 nm to about 360 nm, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are resistant to common solvents used in semiconductor processing. The compositions can also be used as build-up layers for redistribution layer formation.

Novel polyketanil-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, at wavelengths from about 300 nm to about 360 nm, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are resistant to common solvents used in semiconductor processing. The compositions can also be used as build-up layers for redistribution layer formation.

Novel polyketanil-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, at wavelengths from about 300 nm to about 360 nm, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are resistant to common solvents used in semiconductor processing. The compositions can also be used as build-up layers for redistribution layer formation.

Novel polyketanil-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, at wavelengths from about 300 nm to about 360 nm, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are resistant to common solvents used in semiconductor processing. The compositions can also be used as build-up layers for redistribution layer formation.

Novel polyketanil-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, at wavelengths from about 300 nm to about 360 nm, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are resistant to common solvents used in semiconductor processing. The compositions can also be used as build-up layers for redistribution layer formation.

A pressure-sensitive adhesive transfer tape that may have on one surface of a release substrate made of paper or a plastic film, a pressure-sensitive transfer layer having an adhesion inhibiting layer and an adhesive layer, wherein the adhesion inhibiting layer and the adhesive layer are successively stacked on one another. The adhesion inhibiting layer may prevent the adhesive layer formed on one adherend from being in contact with another adherend to weaken the adhesion between the one and another adherends, enabling the one and another adherends to be easily separated from each other. With the passage of time after being put on one another, the adhesion inhibiting layer may migrate to another adherend, so that the adherend is in contact with the adhesive layer, exhibiting strong adhesion properties between the adherends.

A pressure-sensitive adhesive transfer tape that may have on one surface of a release substrate made of paper or a plastic film, a pressure-sensitive transfer layer having an adhesion inhibiting layer and an adhesive layer, wherein the adhesion inhibiting layer and the adhesive layer are successively stacked on one another. The adhesion inhibiting layer may prevent the adhesive layer formed on one adherend from being in contact with another adherend to weaken the adhesion between the one and another adherends, enabling the one and another adherends to be easily separated from each other. With the passage of time after being put on one another, the adhesion inhibiting layer may migrate to another adherend, so that the adherend is in contact with the adhesive layer, exhibiting strong adhesion properties between the adherends.

Provided is an adhesive composition including: a reaction product (X) of a solid polymer (x1) having a first functional group and a liquid chain compound (x2) having, at a chain terminal, a second functional group capable of reacting with the first functional group, the reaction product (X) having the first functional group or the second functional group; and a liquid crosslinking agent (Y) having the first functional group or the second functional group, provided that when the reaction product (X) has the first functional group, the liquid crosslinking agent (Y) has the second functional group, and when the reaction product (X) has the second functional group, the liquid crosslinking agent (Y) has the first functional group.