A method for surface preparation of composite substrates prior to adhesive bonding. A curable surface treatment layer is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the surface treatment layer remains partially cured. The surface treatment layer may be a resin film or a removal peel ply composed of resin-impregnated fabric. After surface preparation, the composite substrate is provided with a chemically-active, bondable surface that can be adhesively bonded to another composite substrate to form a covalently-bonded structure.

A method for surface preparation of composite substrates prior to adhesive bonding. A curable surface treatment layer is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the surface treatment layer remains partially cured. The surface treatment layer may be a resin film or a removal peel ply composed of resin-impregnated fabric. After surface preparation, the composite substrate is provided with a chemically-active, bondable surface that can be adhesively bonded to another composite substrate to form a covalently-bonded structure.

A method for surface preparation of composite substrates prior to adhesive bonding. A curable surface treatment layer containing blocked isocyanate compounds is applied onto a curable composite substrate, followed by co-curing. The surface treatment layer may be a resin layer without fibers or a removal peel ply composed of resin-impregnated fabric. After surface preparation, the composite substrate is provided with a chemically-active, bondable surface that can be adhesively bonded to another composite substrate to form a covalently-bonded structure.

A method for surface preparation of composite substrates prior to adhesive bonding. A curable surface treatment layer containing blocked isocyanate compounds is applied onto a curable composite substrate, followed by co-curing. The surface treatment layer may be a resin layer without fibers or a removal peel ply composed of resin-impregnated fabric. After surface preparation, the composite substrate is provided with a chemically-active, bondable surface that can be adhesively bonded to another composite substrate to form a covalently-bonded structure.

There is provided a method for repairing or reinforcing a structure. The method includes the steps of: providing an adhesive sheet comprising an adhesive layer comprising at least a curable resin composition whose curing is promoted by irradiation with ionizing radiation and a curing aid which generates a basic substance by irradiation with ionizing radiation; attaching the adhesive sheet to a surface of the structure; and curing the adhesive layer of the adhesive sheet in a state where the adhesive layer is exposed.

A method for surface preparation of composite substrates prior to adhesive bonding. A curable surface treatment layer is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the surface treatment layer remains partially cured. The surface treatment layer may be a resin film or a removal peel ply composed of resin-impregnated fabric. After surface preparation, the composite substrate is provided with a chemically-active, bondable surface that can be adhesively bonded to another composite substrate to form a covalently-bonded structure.

The disclosure is directed to a silicon bridge die package, a dicing-die attach film structure and a method for silicon processing including a silicon bridge die package including at least two silicon die incorporating a plurality of integrated circuits, an embedded multi-die interconnect bridge coupled to the at least two silicon die, a dicing-die attach film (DDAF) structure coupled to a silicon wafer, an electro-static discharge (ESD) preventative within the DDAF structure to prevent static charge within the DDAF structure, and an auxetic material disposed within the DDAF structure configured to prevent dicing errors. A method for preparing a silicon die for singulation includes applying an auxetic material with an ESD preventative additive to an organic resin to form a DDAF, combining the DDAF with an acrylic adhesive and a polyolefin base film, and mounting the DDAF to the silicon die.

The present technology relates to a method of introducing a supported antistatic compound that does not comprise a transition-metal-based catalyst component for use in an olefin polymerization reactor. In some embodiments, the methods disclosed herein avoid the formation of polymer agglomerates in the reactor and minimize potentially negative effects on catalyst yield.

A method for making a pressure sensitive adhesive comprising: (a) making at least one epoxidized fatty acid from at least one plant oil, marine oil, other ester of unsaturated fatty acid, or a mixture thereof; and (b) polymerizing the at least one epoxidized fatty acid to produce a pressure sensitive adhesive. A method for making a pressure sensitive adhesive comprising: (a) making epoxidized oleic acid, an epoxidized linoleic acid (including fully and partially epoxidized linoleic acid), or an epoxidized linolenic acid (including fully and partially epoxidized linolenic acid) from at least one plant oil, marine oil, other ester of unsaturated fatty acid, or making mixture thereof; and (b) polymerizing the epoxidized oleic acid, the epoxidized linoleic acid, the epoxidized linolenic acid, or the mixture thereof to produce a pressure sensitive adhesive.

Objects are to provide a novel azole silane compound, a synthesis method thereof, and a silane coupling agent containing the azole silane compound as a component, and to provide a surface treatment solution using the azole silane compound, a surface treatment method, and a bonding method of two materials different in the quality of material. The azole silane compound of the present invention is a compound represented by the specific chemical formula (I-1) or (II-1).