The aim is to provide an adhesive tape that effectively protects an electronic construction from permeants, especially water, and that at the same time has good gap-filling qualities. To solve this problem an adhesive tape is proposed that has in the following order:—a carrier layer without barrier effect at least towards water and with a WVTR of at least 1 g/(m.sup.2*d) (38° C., 90% relative humidity, 50 μm layer thickness); —a layer comprising at least one getter material capable of sorbing at least water; —a water barrier ply; and—a layer of pressure-sensitive adhesive, where the carrier layer bears an outward-facing release layer and/or the layer of pressure-sensitive adhesive is lined with a release liner which has a release layer lying on the layer of pressure-sensitive adhesive.

The invention provides a frameless photo-energy assembly including a photo-energy converter, wherein an edge of the photo-energy converter is sealed by an adhesive tape, comprising an adhering layer for adhesion and cushioning; and an aging-resistant protective layer. The adhering layer is used to contact the edge of an article and comprises: a substrate layer; optionally, a first adhesive layer and a second adhesive layer situated at both sides of the substrate layer oppositely, wherein the first adhesive layer being used to be contact with the article. The aging-resistant protective layer is situated on the adhering layer, which comprises: an optional primer layer, which is situated on the adhering layer; and a film layer, which is situated on either the primer layer or the substrate or the second adhesive layer. The invention further provides an adhesive tape for sealing an edge of an article and an article made of the assembly.

An adhesive sheet of an embodiment of the present disclosure is an adhesive sheet including: a rigid resin film having a thickness of 80 micrometers to 500 micrometers, and a first pressure sensitive adhesive layer being disposed on or above a surface of the rigid resin film, wherein the first pressure sensitive adhesive layer includes elastic resin microspheres having a volume average particle diameter of 110 micrometers or greater and a tacky binder, and the first pressure sensitive adhesive layer has an uneven surface due to the presence of the microspheres.

Provided is a pressure-sensitive adhesive tape having excellent pressure-sensitive adhesive strength to an adherend before ultraviolet (UV) irradiation and excellent peelability after UV irradiation. The pressure-sensitive adhesive tape includes: a pressure-sensitive adhesive layer containing a UV-curable pressure-sensitive adhesive and a photopolymerization initiator; an intermediate layer containing the photopolymerization initiator and being free from a UV-curable component; and a base material. When the intermediate layer contains the photopolymerization initiator, excellent peelability can be exhibited after UV irradiation.

The present invention relates to a transdermal therapeutic system for administration of an active ingredient and a process for the preparation thereof. The transdermal therapeutic system comprises an overtape with two adhesive layers.

A multilayer film and a decorative film, each of which is excellent in chipping resistance, exhibits favorable adhesive properties to a variety of resin materials, such as polypropylene and ABS, and a molded body provided with such a film. The multilayer film includes three layers of an impact absorption layer (a), a base material layer (b), and a pressure sensitive adhesive layer (c) disposed in this order, wherein a thermoplastic polymer composition constituting the impact absorption layer (a) is composed of at least one block copolymer containing a polymer block (X) containing a structural unit derived from an aromatic vinyl compound and a polymer block (Y) containing a structural unit derived from a conjugated diene compound, or a hydrogenated product thereof; and has a loss tangent (tan δ) at 11 Hz in a range of −50 to −20° C. of 3×10.sup.−2 or more.

An adhesive sheet of an embodiment of the present disclosure is an adhesive sheet including: a rigid resin film having a thickness of 80 micrometers to 500 micrometers, and a first pressure sensitive adhesive layer being disposed on or above a surface of the rigid resin film, wherein the first pressure sensitive adhesive layer includes elastic resin microspheres having a volume average particle diameter of 110 micrometers or greater and a tacky binder, and the first pressure sensitive adhesive layer has an uneven surface due to the presence of the microspheres.

Barrier adhesive compositions include at least one polyisobutylene-containing polymer and a copolymeric additive that is a polyisobutylene-polysiloxane copolymer. The polyisobutylene-polysiloxane copolymers are prepared by the reaction of a hydridosilane-functional polysiloxane and an ethylenically unsaturated polyisobutylene oligomer. Barrier film articles include the barrier adhesive compositions and a film. The barrier film articles can be used to encapsulate organic electronic devices.

The present invention aims to provide an adhesive tape for semiconductor device production which exhibits excellent chip component separability and can reduce adhesive deposits on chip components. Provided is an adhesive tape for semiconductor device production, including: a substrate; an ablation layer; a barrier layer; and a first adhesive layer in this order.

A pressure sensitive adhesive sheet may include a base material and a hot-melt pressure sensitive adhesive layer which contains a softener, and further include a barrier layer disposed between the base material and the hot-melt pressure sensitive adhesive layer, the barrier layer containing at least one selected from the group consisting of a polyester-based resin, a polyurethane-based resin, and a polyolefin-based resin. The polyester-based resin may be at least one of a polyester resin or a modified polyester resin.