An adhesive sheet for temporary fixation which may have excellent heat resistance to exhibit a sufficient adhesive force even though it undergoes a high temperature process during a process of manufacturing a semiconductor device and may also exhibit a sufficient reduction of the adhesive force by photocuring during the step of peeling off, and a method of manufacturing a semiconductor device using the same, are provided.

A roofing underlayment capable of adhering to a roof deck comprising: (a) a roofing membrane having a first and a second major surface; and (b) a pressure-sensitive adhesive disposed on the first major surface of the roofing membrane and comprising: (i) at least one of butyl rubber or polyisobutylene; (ii) a first liquid plasticizer, preferably polybutene; and (iii) a tackifier, wherein the Tg of the adhesive is at most about 100 C. The adhesive provides high bond strength and excellent long-term heat aging, weathering resistance, as well as good low temperature properties while providing a moisture proof seam. A method for making the roofing underlayment includes applying the adhesive to the membrane then applying a release liner over the adhesive layer. A method for using the roofing underlayment comprises removing the release liner then adhering the underlayment to the roof deck by contacting the first to the roof deck.

Embodiments provide methods of assembling an apparel product. The methods include applying a composition to a portion of a major component of the apparel product or a portion of a minor component of the apparel product. The methods include coupling the portion of the minor component with the portion of the major component via the composition. The major component forms a base portion of the apparel product and is configured to be supported and worn at least partially over a portion of a wearer. The minor component forms a secondary portion that is configured to be coupled to the major component with an adhesive. The composition is cured to form the adhesive and the apparel product. The adhesive includes a polymer having a cyclodextrin moiety bonded to an azobenzene moiety.

Aspects of the present disclosure provide for composite structures including a bonding layer that adheres a substrate (e.g., including a polymeric composition such as rubber) to a material (e.g., including a polymer such as polyurethane). The adhesion of the substrate to the material through the bonding layer can include chemical bonds such as, but not limited to, siloxane linkages, silanol linkages, silyl linkages, or any combination thereof in the bonding layer.

A debonding tape includes a first tape layer including a first base layer having a first modulus and a first adhesive layer on the first base layer, wherein the first tape layer has a first diameter. The debonding tape includes a second tape layer on the first tape layer and supporting the first tape layer, wherein the second tape layer includes a second base layer on the first adhesive layer and having a second modulus greater than the first modulus, an intermediate layer on the second base layer, and a second adhesive layer on the intermediate layer. The second tape layer has a second diameter smaller than the first diameter such that a circumferential portion of the first tape layer is exposed in a cross-sectional view.

There is provided an article that includes a polymeric layer disposed on and covering a first major surface of an porous layer, an adhesive layer disposed on a second major surface of the elastic layer opposite the polymeric layer; and a liner disposed on a major surface of the polymeric layer opposite the first major surface of the elastic layer. The polymeric layer and the porous layer together form an air and water barrier that is water vapor permeable. The liner is water vapor impermeable. In a preferred embodiment the polymeric layer comprises a polyoxyalkylene polymer having at least one end group derived from an alkoxy silane. A method of applying the article to a surface of a building component is also provided.

Aspects of the present disclosure provide for composite structures including a bonding layer that adheres a substrate (e.g., including a polymeric composition such as rubber) to a material (e.g., including a polymer such as polyurethane). The adhesion of the substrate to the material through the bonding layer can include chemical bonds such as, but not limited to, siloxane linkages, silanol linkages, silyl linkages, or any combination thereof in the bonding layer.

The present disclosure provides adhesive mounting articles that can be removed from surfaces without damage by having reduced contribution of a hardgood to the peel force generated by the adhesive article during removal. In some instances, this can be accomplished by a hardgood that is flexible in a peel direction and rigid in a weight hanging direction. Such hardgoods may include a plurality of minimally connected body segments arranged about the transverse axis of the hardgood body.

A temporary protective film for semiconductor sealing molding includes a support film and an adhesive layer provided on one surface or both surfaces of the support film and containing a resin and a silane coupling agent. The content of the silane coupling agent in the temporary protective film may be more than 5% by mass and less than or equal to 35% by mass with respect to the total mass of the resin.

The present disclosure provides adhesive mounting articles that can be removed from surfaces without damage by having reduced contribution of a hardgood to the peel force generated by the adhesive article during removal. In some instances, this can be accomplished by a hardgood that is flexible in a peel direction and rigid in a weight hanging direction. Such hardgoods may include a plurality of minimally connected body segments arranged about the transverse axis of the hardgood body.