Disclosed is a composite floor, comprising a wear-resistant layer, a polyvinyl chloride patterned fabric layer, a base material layer, a balance layer, and a muting layer that are sequentially arranged, the wear-resistant layer being a melamine wear-resistant paper layer. The composite floor has a clear and vivid pattern, and the wear and scratch resistance is far better than that of a conventional floor, the manufacturing process comprising laying, hot pressing, demolding and tempering steps. The manufacturing process has simple steps, and the obtained composite floor has high dimensional stability and good wear and scratch resistance.

A recording paper includes: a laminated resin film including a substrate composed of a thermoplastic resin film and an underlayer disposed on at least one side of the substrate and composed of a thermoplastic resin composition; and a resin coating disposed facing the underlayer of the laminated resin film, wherein the underlayer has an indentation modulus of 50 to 1200 MPa, the resin coating contains a resin that is a reaction product of a cationic water-soluble polymer and a silane coupling agent, a content of a silane coupling agent component is 15 to 60 parts by mass with respect to 100 parts by mass of the cationic water-soluble polymer component in the resin coating, the resin coating is free from thermoplastic resin particles, and a content of an inorganic filler is 9 parts by mass or less with respect to 100 parts by mass of the cationic water-soluble polymer component in the resin coating.

Disclosed is a reactive hot-melt adhesive composition, containing: a urethane prepolymer having a polymer chain including a structural unit derived from polyol and a structural unit derived from polyisocyanate, and an isocyanate group as a terminal group of the polymer chain; and a functional group protection type silane coupling agent.

A colored adhesive tape (1), in particular a yellow, orange-colored, or black adhesive tape (1), preferably a cable wrapping tape, with a temperature class of at least T3 (LV 312), including a textile substrate with a polymer plastic substrate (4, 4a, 4b), on which an adhesive material (5, 5a, 5b) is applied. In order to improve the temperature stability of the tape, while maintaining advantageous properties, the color of at least a part of the substrate (4, 4a, 4b) is formed by the inherent color of the polymer plastic material. The tape is preferably substrate formed of a polymer plastic materials which are aromatic, nitrogen-containing polymers from the group of polyoxadiazoles (POD), polybenzobisoxazoles (PBO) or polybenzimidazoles (PBI) (4, 4a, 4b). The adhesive tape (1) may be used as a cable harness (3).

Provided is a film for manufacturing a semiconductor part in which an evaluation step accompanied with a temperature change, a segmenting step, and a pickup step can be commonly performed, a method for manufacturing a semiconductor part, a semiconductor part, and an evaluation method. The film includes a base layer, and an adhesive layer disposed on one surface side of the base layer, wherein the ratio RE (=E(160)/E(40)) of the elastic modulus of the base layer at 160 C. to the elastic modulus of the base layer at 40 C. is RE0.01, and the elastic modulus E(40) is 10 MPa to less than 1000 MPa. The method includes bonding the adhesive layer to a back surface of a semiconductor wafer, separating the semiconductor wafer into segments to obtain semiconductor parts, and separating the semiconductor parts from the adhesive layer, and includes a step of evaluating.

Provided is a film for manufacturing a semiconductor part in which an evaluation step accompanied with a temperature change, a segmenting step, and a pickup step can be commonly performed, a method for manufacturing a semiconductor part, a semiconductor part, and an evaluation method. The film includes a base layer, and an adhesive layer disposed on one surface side of the base layer, wherein the ratio RE (=E(160)/E(40)) of the elastic modulus of the base layer at 160 C. to the elastic modulus of the base layer at 40 C. is RE0.01, and the elastic modulus E(40) is 10 MPa to less than 1000 MPa. The method includes bonding the adhesive layer to a back surface of a semiconductor wafer, separating the semiconductor wafer into segments to obtain semiconductor parts, and separating the semiconductor parts from the adhesive layer, and includes a step of evaluating.

A composite article comprises a base layer and an adhesive layer disposed thereon. The base layer comprises the reaction product of a polyamide and an anhydride-functional copolymer, and an ionomer. The adhesive layer comprises a cationic polymer and an adhesive.

Disclosed is a reactive hot-melt adhesive composition, containing: a urethane prepolymer having a polymer chain including a structural unit derived from polyol and a structural unit derived from polyisocyanate, and an isocyanate group as a terminal group of the polymer chain; and a functional group protection type silane coupling agent.

Disclosed are hot-melt, curl-free methods, structures, and compositions. One embodiment provides an optionally oriented base film having a first side and a second side, wherein the optionally oriented base film base film is transparent or opaque. Further, the composition includes a water-based primer applied to the first side. Further still, the composition includes a water-based coating applied to the first side having the water-based primer disposed thereon, wherein the water-based coating has a weight of at least 0.1 g/m.sup.2, wherein the composition is curl-free and has a barrier to one or more migratory additives and components in a hot-melt adhesive on the first side.

A composite article comprises a base layer and an adhesive layer disposed thereon. The base layer comprises the reaction product of a polyamide and an anhydride-functional copolymer, and an ionomer. The adhesive layer comprises a cationic polymer and an adhesive.