An adhesive film is formed of an adhesive composition that includes a monomer mixture including a hydroxyl group-containing (meth)acrylate and a comonomer, and nanoparticles. The adhesive film has a glass transition temperature (Tg) of about −20° C. or less, an index of refraction of about 1.40 to about 1.55, and a haze of about 3% or less at a thickness of 100 μm.

An adhesive film is formed of an adhesive composition that includes a monomer mixture including a hydroxyl group-containing (meth)acrylate and a comonomer, and nanoparticles. The adhesive film has a glass transition temperature (Tg) of about −20° C. or less, an index of refraction of about 1.40 to about 1.55, and a haze of about 3% or less at a thickness of 100 μm.

The present invention provides a UV-curable pressure-sensitive adhesive composition, comprising: 81 to 97.5 parts of (meth)acrylate polymer having a carboxyl functional group by weight, the amount of the carboxyl functional group in the (meth)acrylate polymer having the carboxyl functional group being equal to or greater than 40 mmol/100 g; 2.5 to 19 parts of an epoxy resin by weight; 0.3 to 6 parts of a polyol by weight; and 0.05 to 5 parts of a photoinitiator by weight. The UV-curable pressure-sensitive adhesive composition has good anti-repulsion. The present invention further provides a UV-curable adhesive tape comprising the UV-curable pressure-sensitive adhesive composition.

The present invention provides a UV-curable pressure-sensitive adhesive composition, comprising: 81 to 97.5 parts of (meth)acrylate polymer having a carboxyl functional group by weight, the amount of the carboxyl functional group in the (meth)acrylate polymer having the carboxyl functional group being equal to or greater than 40 mmol/100 g; 2.5 to 19 parts of an epoxy resin by weight; 0.3 to 6 parts of a polyol by weight; and 0.05 to 5 parts of a photoinitiator by weight. The UV-curable pressure-sensitive adhesive composition has good anti-repulsion. The present invention further provides a UV-curable adhesive tape comprising the UV-curable pressure-sensitive adhesive composition.

An electrically conductive adhesive layer includes a plurality of particles dispersed between opposing first and second major surfaces of the electrically conductive adhesive layer. The first and second major surfaces are spaced apart a distance D. The particles are agglomerated so as to form a plurality of substantially continuous layers of particles generally extending along orthogonal first and second directions and arranged along a third direction. Each substantially continuous layer of particles has a length L along the first direction from a first to an opposing second edge of the electrically conductive adhesive layer and a width W along the second direction extending from the first to the second major surface. L/D ≥ 100. At least some of the particles are electrically conductive.

An electrically conductive adhesive layer includes a plurality of particles dispersed between opposing first and second major surfaces of the electrically conductive adhesive layer. The first and second major surfaces are spaced apart a distance D. The particles are agglomerated so as to form a plurality of substantially continuous layers of particles generally extending along orthogonal first and second directions and arranged along a third direction. Each substantially continuous layer of particles has a length L along the first direction from a first to an opposing second edge of the electrically conductive adhesive layer and a width W along the second direction extending from the first to the second major surface. L/D ≥ 100. At least some of the particles are electrically conductive.

Disclosed are an apparatus and a method for separating a semiconductor chip disposed on a base member via an adhesive member from the base member. The method includes: a step of providing a push member on a side of the base member opposite to a side on which the semiconductor chip is disposed and moving the push member in a direction adjacent to the semiconductor chip; and a step of separating the semiconductor chip, moved together with the push member, from the base member through a pick-up unit. The adhesive member and the push member are each magnetized such that repulsive forces act on each other.

Disclosed are an apparatus and a method for separating a semiconductor chip disposed on a base member via an adhesive member from the base member. The method includes: a step of providing a push member on a side of the base member opposite to a side on which the semiconductor chip is disposed and moving the push member in a direction adjacent to the semiconductor chip; and a step of separating the semiconductor chip, moved together with the push member, from the base member through a pick-up unit. The adhesive member and the push member are each magnetized such that repulsive forces act on each other.

A water-dispersed pressure-sensitive adhesive composition of the present invention includes a water-dispersible polymer, a carboxylic acid copolymer thickener, a polyacrylic acid thickener, and water. A ratio of the carboxylic acid copolymer thickener in the solid content of the water-dispersed pressure-sensitive adhesive composition is 0.1% by mass or more and 1.5% by mass or less. A ratio of the polyacrylic acid thickener in the solid content of the adhesive composition is 1% by mass or more and 3.7% by mass or less. A pressure-sensitive adhesive sheet of the present invention has a pressure-sensitive adhesive layer formed from the water-dispersed pressure-sensitive adhesive composition.

A water-dispersed pressure-sensitive adhesive composition of the present invention includes a water-dispersible polymer, a carboxylic acid copolymer thickener, a polyacrylic acid thickener, and water. A ratio of the carboxylic acid copolymer thickener in the solid content of the water-dispersed pressure-sensitive adhesive composition is 0.1% by mass or more and 1.5% by mass or less. A ratio of the polyacrylic acid thickener in the solid content of the adhesive composition is 1% by mass or more and 3.7% by mass or less. A pressure-sensitive adhesive sheet of the present invention has a pressure-sensitive adhesive layer formed from the water-dispersed pressure-sensitive adhesive composition.