A base composition for forming a release coating composition is disclosed. The base composition comprises (A) a silicate resin that is a liquid at 25° C. in the absence of any solvent. The (A) silicate resin includes an average of at least one silicon-bonded ethylenically unsaturated group per molecule. The composition further comprises (B) an organopolysiloxane including an average of at least two silicon-bonded ethylenically unsaturated groups per molecule. A method of preparing the base composition and a method of preparing a release coating composition are also disclosed.

A base composition for forming a release coating composition is disclosed. The base composition comprises (A) a silicate resin that is a liquid at 25° C. in the absence of any solvent. The (A) silicate resin includes an average of at least one silicon-bonded ethylenically un saturated group per molecule. The composition further comprises (B) an organopolysiloxane including an average of at least two silicon-bonded ethylenically un saturated groups per molecule. The (A) silicate resin is miscible with the (B) organopolysiloxane in the absence of any solvent. A method of preparing the base composition and a method of preparing a release coating composition are also disclosed.

A composition for forming a release coating is disclosed. The composition comprises (A) an organopolysiloxane comprising the reaction product of: (i) a silicone resin having a particular formula; and (ii) a cyclic siloxane; in the presence of a polymerization catalyst. The composition further comprises (B) an organopolysiloxane including an average of at least two silicon-bonded ethylenically unsaturated groups per molecule.

Provided is a recording medium for a nail sticker and a method of manufacturing the same, and more particularly, to a recording medium and a method of manufacturing the same, which show that an ink reception layer is formed on a base of a polyurethane material so that a nail sticker can be printed using a sublimation printer. The recording medium for a nail sticker comprises: a release paper; an adhesion layer formed on the release paper; a base of a polyurethane material attached onto the adhesion layer; an undercoating layer formed on the base; and an ink reception layer formed on the undercoating layer.

The purpose of the present invention is to improve surface scratch problems occurring in the manufacturing process and handling of an adherend on which stamping foil is applied, prevent a problem in which a transfer layer of stamping foil is separated at a portion that is bent when the adherend is folded, secure binding force in printing with various inks, and fundamentally prevent powder generated during cutting according to a product standard in a stamping foil manufacturing process. To this end, the stamping foil of the present invention comprises: (a) a base film which is removed after stamping transfer; (b-1) a wear-resistant release layer formed on the base film and containing a polyurethane-based release agent, an acrylic resin, and an ethene-based polymer additive, or (b-2) (i) a polyurethane-based release layer formed on the base film and (ii) a wear-resistant layer formed on the polyurethane-based release layer and containing an acrylic matrix resin and an ethene-based polymer additive; (c) a moisture penetration-preventing and metal-deposited heat-resistant cured coating layer; (d) a metal deposition layer formed on the moisture penetration-preventing cured coating layer; and (e) optionally, a thick film protective layer formed on the metal deposition layer, for preventing the corrosion of the metal deposition layer.

The present invention relates to a heat separable two-layer adhesive system, to a process of adhesive debonding using the adhesive system and to a heat separable bonded composite body. In particular, the present invention relates to a heat separable two-layer adhesive system comprising an adhesive layer having conductive particles.

Disclosed are methods of fabricating semiconductor devices and methods of separating substrates. The semiconductor device fabricating method comprises providing a release layer between a carrier substrate and a first surface of a device substrate to attach the device substrate to the carrier substrate, irradiating the carrier substrate with an ultraviolet ray to separate the carrier substrate from the release layer and to expose one surface of the release layer, and performing a cleaning process on the one surface of the release layer to expose the first surface of the device substrate. The release layer includes an aromatic polymerization unit and a siloxane polymerization unit.

A blend suitable for use in a release layer of a multilayer protective film. The blends comprise greater than 50 wt. % of an ethylene/alpha-olefin copolymer, a functionalized ethylene-based polymer, and an inorganic filler.

A label having a silicone-free (water-based) release coating and compatible adhesive patch is provided. The label includes a thermally coated substrate having a silicone-free substrate overlaid thereon of a first surface. A second surface includes a microsphere adhesive layer.

The invention relates to a method for reducing end face stickiness of a roll (1) of adhesive tape, by supplying a precursor (18) to a plasma stream (20), using the plasma stream (20) enriched with the precursor (18) to coat a carrier film (2) with a passivation coat (3) in a plasma process, placing a carrier film section (5) by its passivation-coated side onto an end face (4) of the roll (1) of adhesive tape, removing the carrier film section (5) and leaving at least part of the passivation coat (6) on the end face (4) and reducing its end face stickiness.