A foam abrasive for grinding a workpiece includes a main part made of foam, in particular polyurethane foam, and abrasive grains which are fixed to at least one surface of the foam abrasive via a base binder made of thermoplastic polyurethane. The abrasive grains are covered with a cover binder.

Modified silanized colloidal silica particles are reaction products of silanized colloidal silica particles having epoxy moieties with a nitrogen of an amino group of an amino acid to form stable modified silanized colloidal silica particles. The modified silanized colloidal silica particles can be used as an abrasive in chemical mechanical polishing of various substrates.

Described are slurry compositions useful in chemical-mechanical processing of a nickel layer of a substrate, wherein the slurry compositions contain abrasive particles that include silica particles that are cationically charged at a low pH.

A lubricated mechanical polishing (LMP) process is provided that uses hard nanoparticles of less than 5 nm diameter dispersed in a fluid lubricant as a polishing slurry to produce an ultra-smooth surface on a hard metallic or non-metallic substrate with a sub-nanometer surface roughness substantially less than that produced by silica chemical mechanical polishing.

The present disclosure provides a novel azeotropic or azeotrope-like composition comprising hydrogen fluoride and 1,1,2-trifluoroethane (HFC-143), 1-chloro-2,2-difluoroethane (HCFC-142), or 1,2-dichloro-1-fluoroethane (HCFC-141); and a separation method using the composition.

An azeotropic or azeotrope-like composition comprising hydrogen fluoride and HFC-143. An azeotropic or azeotrope-like composition comprising hydrogen fluoride and HCFC-142. An azeotropic or azeotrope-like composition comprising hydrogen fluoride and HCFC-141. A separation method of a composition comprising hydrogen fluoride and at least one member selected from the group consisting of HFC-143, HCFC-142, and HCFC-141.

The present disclosure provides a novel azeotropic or azeotrope-like composition comprising hydrogen fluoride and 1,1,2-trifluoroethane (HFC-143), 1-chloro-2,2-difluoroethane (HCFC-142), or 1,2-dichloro-1-fluoroethane (HCFC-141); and a separation method using the composition. An azeotropic or azeotrope-like composition comprising hydrogen fluoride and HFC-143. An azeotropic or azeotrope-like composition comprising hydrogen fluoride and HCFC-142. An azeotropic or azeotrope-like composition comprising hydrogen fluoride and HCFC-141. A separation method of a composition comprising hydrogen fluoride and at least one member selected from the group consisting of HFC-143, HCFC-142, and HCFC-141.

Provided is a nanodiamond dispersion composition having excellent dispersibility of nanodiamond particles in an organic dispersion medium even when the organic dispersion medium has a small SP value. The nanodiamond dispersion composition according to an embodiment of the present invention includes an organic dispersion medium, nanodiamond particles dispersed in the organic dispersion medium, and a fatty acid ester dispersing agent. The fatty acid ester dispersing agent preferably has a mass loss rate of 20% or less when held in an air atmosphere at a temperature of 200° C. for 180 minutes. The fatty acid ester dispersing agent preferably has an acid value of 40 mgKOH/g or less.

A dispersant for chemical mechanical polishing that flattens a surface of at least one of an insulating layer and a wiring layer includes a block copolymer (P) having a polymer block A and B. The polymer block A has a structural unit derived from at least one monomer selected from the group consisting of an amide group-containing vinyl monomer and an ester group-containing vinyl monomer, and the polymer block B has a structural unit having an ionic functional group.

Aiming at providing a ceria-based composite particle dispersion capable of polishing silica film, Si wafer or even hard-to-process material at high polishing rate, and can give high surface accuracy, disclosed is a ceria-based composite particle dispersion that contains a ceria-based composite particle that has an average particle size of 50 to 350 nm, to solve the aforementioned problem, featured by that the ceria-based composite particle has a mother particle, a cerium-containing silica layer, a child particle, and an easily soluble silica-containing layer; the mother particle contains amorphous silica as a major ingredient; the child particle contains crystalline ceria as a major ingredient; ratio of the mass of the easily soluble silica-containing layer relative to the mass of the ceria-based composite particle falls in a specific range; mass ratio of silica and ceria in the ceria-based composite particle falls in a specific range; the ceria-based composite particle, when analyzed by X-ray diffractometry, shows only a crystal phase of ceria; and the ceria-based composite particle has an average crystallite size of the crystalline ceria, when analyzed by X-ray diffractometry, of 10 to 25 nm.

Described are chemical mechanical processing (CMP) compositions and related methods, including compositions and methods for polishing nickel phosphorus (NiP) surfaces for hard disk applications.