Patent classifications
C11D1/34
Concentrated solid hard surface cleaner
A solid hard surface cleaning composition suitable for replacing liquid formulations while providing at least equivalent or enhanced cleaning performance, including at lower concentrations, is provided. The solid hard surface cleaning compositions include alkali metal carbonate alkalinity source(s), aminocarboxylic acid chelant(s), amphoteric surfactant(s), polyacrylate polymer(s) and anionic surfactant(s). The solid hard surface cleaning compositions can include additional functional ingredients, such as corrosion inhibitors. The solid hard surface cleaning compositions do not include hydroxide alkalinity and beneficially provide stable ready-to-use formulations that are safe for contact without the use of personal protective equipment (PPE) and are compatible with soft metals.
Liquid detergent composition comprising suspended solid particles
A liquid detergent composition may have a continuous liquid phase and solid particles dispersed in the continuous phase. The continuous phase may be transparent or translucent. The solid particles may be made of a polymeric matrix material, have a diameter ranging from about 0.8 to about 8 mm, and may include a plurality of microcapsules. The plurality of microcapsules may be dispersed in the polymeric matrix material. The microcapsules may have a diameter ranging from about 4 to about 70 70 μm. Use of and methods of use of such a liquid composition are also described.
HOME CARE COMPOSITIONS
Home care compositions are disclosed herein. According to one aspect, provided is a home care composition that includes a preservative comprising alpha hydroxy acid; and from about 1 to about 25 wt. % of a surfactant system comprising: (i) an anionic surfactant, (ii) a non-ionic surfactant, and (iii) optionally, an amphoteric surfactant; wherein the home care composition has a Micro Robustness Index of 0.85 or greater, and all weight percentages are based on the total weight of the home care composition.
HOME CARE COMPOSITIONS
Home care compositions are disclosed herein. According to one aspect, provided is a home care composition that includes a preservative comprising alpha hydroxy acid; and from about 1 to about 25 wt. % of a surfactant system comprising: (i) an anionic surfactant, (ii) a non-ionic surfactant, and (iii) optionally, an amphoteric surfactant; wherein the home care composition has a Micro Robustness Index of 0.85 or greater, and all weight percentages are based on the total weight of the home care composition.
DISPERSIBLE ANTIMICROBIAL COMPLEX AND COATINGS THEREFROM
Disclosed are latexes, suspensions, and colloids having a cationic antimicrobial compound complexed with an anionic surfactant. The surfactant may have greater affinity for the antimicrobial compound than other anionic surfactants and other anions in the latex, suspension, or colloid that contribute to disperse phase stability to prevent disrupting the dispersions. Dispersions containing the antimicrobial compound may therefore have a shelf life comparable to dispersions that are otherwise identical but lack the cationic antimicrobial compound and its complexed anionic surfactant. Coatings made with the complexes can exhibit essentially undiminished antimicrobial activity.
MECHANISM OF UREA/SOLID ACID INTERACTION UNDER STORAGE CONDITIONS AND STORAGE STABLE SOLID COMPOSITIONS COMPRISING UREA AND ACID
Solid rinsing, cleaning and/or sanitizing compositions for various applications are provided. In particular, solid compositions include a complex of urea and an acid having desirable storage stability previously unavailable in solid urea/acid compositions. Stable solid compositions are disclosed and methods of making the same to overcome conventional limitations associated with with forming kinetically and thermodynamically stable solids that utilize urea/acid compositions.
MECHANISM OF UREA/SOLID ACID INTERACTION UNDER STORAGE CONDITIONS AND STORAGE STABLE SOLID COMPOSITIONS COMPRISING UREA AND ACID
Solid rinsing, cleaning and/or sanitizing compositions for various applications are provided. In particular, solid compositions include a complex of urea and an acid having desirable storage stability previously unavailable in solid urea/acid compositions. Stable solid compositions are disclosed and methods of making the same to overcome conventional limitations associated with with forming kinetically and thermodynamically stable solids that utilize urea/acid compositions.
CLEANING LIQUID COMPOSITION AND CLEANING METHOD USING SAME
The present disclosure relates to a cleaning liquid composition and a cleaning method using the same. A polishing slurry composition according to an embodiment of the present disclosure includes: a chelating agent containing an organic salt; and an anionic surfactant.
Liquid composition for removing titanium nitride, semiconductor-element cleaning method using same, and semiconductor-element manufacturing method
This invention provides a liquid composition that removes titanium nitride from a substrate without corroding tungsten or a low-k interlayer dielectric also present on said substrate. Said liquid composition has a pH between 0 and 4, inclusive, and contains the following: at least one oxidizing agent (A) selected from the group consisting of potassium permanganate, ammonium peroxodisulfate, potassium peroxodisulfate, and sodium peroxodisulfate; a fluorine compound (B); and a tungsten-corrosion preventer (C). The tungsten-corrosion preventer (C) either contains at least two different compounds selected from a group of compounds (C1) consisting of alkylamines, salts thereof, fluoroalkylamines, salts thereof, and the like or contains at least one compound selected from said group of compounds (C1) and at least one compound selected from a group of compounds (C2) consisting of polyoxyalkylene alkylamines, polyoxyalkylene fluoroalkylamines, and the like. The mass concentration of potassium permanganate in the abovementioned oxidizing agent (A) is between 0.001% and 0.1%, inclusive, and the mass concentration of the abovementioned fluorine compound (B) is between 0.01% and 1%, inclusive.
CLEANING LIQUID
An object of the present invention is to provide a cleaning liquid for semiconductor substrates with a change in the pH of the cleaning liquid caused by dilution being suppressed. A cleaning liquid of the invention is a cleaning liquid for semiconductor substrates that contains a chelating agent, and an acidity constant (pKa) of the chelating agent and a pH of the cleaning liquid satisfy a condition defined by Formula (A):
pKa−1<pH<pKa+1 (A)