Non-fluorocarbon compositions for providing enhanced fluid repellency on various surfaces, including for laundry treatments in a finishing step of a laundry process, are disclosed. Non-fluorocarbon laundry treatment compositions and compositions including the non-fluorocarbon chemistries and a substrate surface are also disclosed along with methods of using the same in a laundry application.

Disclosed is a no-rinse aerospace cleaning composition useful in cleaning painted and unpainted metal, as well as polymeric surfaces found in aircraft, the composition comprising an oil-in-water emulsion containing water, organic solvent, an aqueous emulsion of wax-free glossing agent, solid particles, polyalkylsiloxane oil, surfactant, emulsifier, thickener, corrosion inhibitor, and pH adjuster; methods of making and using the composition are also provided.

In a substrate processing method, a rinse process using a rinse solution is performed on a development-processed photoresist pattern on a substrate. A substitution process including a first substitution step using a mixed solution of a non-polar organic solvent and a surfactant and a second substitution step using the non-polar organic solvent is performed on the substrate. The substitution process is performed a plurality of times until the rinse solution remaining on the substrate is less than a predetermined value. A supercritical fluid drying process is performed on the substrate to dry the non-polar organic solvent remaining on the substrate.

A surface cleaning device may include a nozzle, a dust cup, a suction motor configured to draw air into the nozzle and through the dust cup, and a first deodorizer coupled to the nozzle, the first deodorizer includes a deodorizing composition having a long chain fatty acid.

A cleaner composition consisting essentially of (A) 90.0-99.9 wt % of an organic solvent and (B) 0.1-10.0 wt % of a C.sub.3-C.sub.6 alcohol, and containing (C) 20-300 ppm of sodium and/or potassium is effective for cleaning a surface of a silicon semiconductor substrate. A satisfactory degree of cleanness is achieved within a short time and at a high efficiency without causing corrosion to the substrate.

The present invention relates to a liquid composition comprising: a) at least one alcohol; b) at least one hydrocarbon or hydrocarbon mixture; c) at least one peroxide agent; d) water. The compositions of the invention possess antimicrobial and enhanced sporicidal properties.

A cleaner composition includes: a saturated aliphatic hydrocarbon (A); an anionic surfactant (B); a nonionic surfactant (C); and water (D). The cleaner composition contains the saturated aliphatic hydrocarbon (A) in a proportion of 60.0% by mass to 85.0% by mass, the anionic surfactant (B) in a proportion of 8.0% by mass to 15.0% by mass, the nonionic surfactant (C) in a proportion of 2.0% by mass to 5.0% by mass, and the water (D) in a proportion of 1.0% by mass to 20.0% by mass, forms a W/O microemulsion or a solubilized W/O emulsion, and has a volume resistivity of 1×10.sup.9 Ω.Math.cm or less.

A cleaning article for cleaning a target surface. The cleaning article has a coating comprising mineral oil, a triglyceride and a silicone wax, to improve debris capture and retention. The coating further improves processability, without sacrificing debris capture and retention.

The present invention is a liquid detergent composition for tableware and/or kitchen hard articles containing: (a) a nonionic surfactant with an HLB of 10.5 or less (provided that (b) is excluded); (b) a glycoside having a hydrocarbon group with 8 or more and 18 or less carbons and a glycoside group with an average degree of condensation of 0.5 or more and 3 or less; and (c) an organic solvent with a logPow of 0 or more and 1.5 or less [hereinafter, referred to as component (c)], wherein the content of (a) in all surfactants is 30 mass % or more and 95 mass % or less, a mass ratio of component (c) to the content of (a), (c)/(a), is 2 or more and 8 or less, and a viscosity at 20° C. is 20 mPa.Math.s or less.

Provided is a composition for shrinking a photoresist pattern, which is capable of shrinking a photoresist pattern using a photoresist during the fabrication of a semiconductor, and to a method of shrinking a pattern using the composition, whereby a pattern to be formed can be shrunken in a photoresist-patterning process, thus remarkably decreasing the number of steps of a semiconductor fabrication process and reducing the fabrication time and costs.