Patent classifications
C11D7/18
Cleaning liquid composition and method for cleaning polymerization apparatus using same
A cleaning liquid composition is provided. More particularly, a cleaning liquid composition includes a transition metal compound represented by Chemical Formula 1 (see the detailed description of the present invention); and a hydrocarbon-based solvent, and a cleaning method of a polymerization apparatus using the same.
One part, solids containing decontamination blend composition
A one part, solids containing decontamination blend composition comprises a solid acetyl donor coated with a compound that protects it from hydrolysis, a peroxygen source, optionally a catalyst, optionally a surfactant, and optionally a buffer. The decontamination blend composition is generally in a dry powder, particle, etc. form or in a tablet, pill, etc. form and is complete in and of itself in that no additional compounds are required prior to use and is readily distributed as a one package system. Upon the addition of water, a peroxygen compound such as hydrogen peroxide is formed, and peracetic acid is generated under alkaline conditions. The decontamination blend composition is particularly suitable for oxidizing various chemical and biological compounds thereby eradicating the same in situ as on surfaces, clothes, articles, and the like. Representative contaminants include mustard gas, nerve gas, bacterial toxins, anthrax, bird flu, and the like.
Treatment liquid and method for washing substrate
A treatment liquid is a treatment liquid for a semiconductor device containing an oxidizing agent, a corrosion inhibitor, water, and Fe, in which the content ratio of the Fe to the oxidizing agent is 10.sup.10 to 10.sup.4 in terms of mass ratio.
Product for cleaning surfaces
A product for cleaning a surface includes a combination of a first composition with a second composition. The first composition includes hydrogen peroxide and makes up 94-99.5% of the combination by weight. The second composition includes at least one of a silicate, a carbonate, a bicarbonate and a percarbonate and makes up 0.5-6% of the combination by weight. The first composition and the second composition are stored in separate vessels until combined to form the combination. The combination is applied to the surface after mixing.
Alkaline earth metal-containing cleaning solution for cleaning semiconductor element, and method for cleaning semiconductor element using same
According to the present invention, it is possible to provide a cleaning solution which removes a dry etching residue and photoresist on a surface of a semiconductor element having a low dielectric constant film (a low-k film) and at least one material selected from between a material that contains 10 atom % or more of titanium and a material that contains 10 atom % or more of tungsten, wherein the cleaning solution contains: 0.002-50 mass % of at least one type of oxidizing agent selected from among a peroxide, perchloric acid, and a perchlorate salt; 0.000001-5 mass % of an alkaline earth metal compound; and water.
Composition for cleaning disarticulated skeletons
The composition for cleaning disarticulated skeletons is a mixture of ammonia, hydrogen peroxide and water. The composition may further include ozone continuously pumped into the mixture while soaking the skeleton. The skeleton may initially be soaked in a composition having 7% ammonia by volume and 8-10% hydrogen peroxide by volume, the balance being water, e.g., for a period of ten days. The composition may be maintained at 20 C. and ozone may be continuously pumped during the ten-day period. If any grease remains, the bones may be soaked again, e.g., in a composition having 3% ammonia and 3% hydrogen peroxide for an additional seven days, again with continuous pumping of ozone at a rate of 200 mg/hr into the mixture, followed by rinsing with water and drying.
One part, solids containing decontamination blend composition
A one part, solids containing decontamination blend composition comprises a solid acetyl donor coated with a compound that protects it from hydrolysis, a peroxygen source, optionally a catalyst, optionally a surfactant, and optionally a buffer. The decontamination blend composition is generally in a dry powder, particle, etc form or in a tablet, pill, etc form and is complete in and of itself in that no additional compounds are required prior to use and is readily distributed as a one package system. Upon the addition of water, a peroxygen compound such as hydrogen peroxide is formed, and peracetic acid is generated under alkaline conditions. The decontamination blend composition is particularly suitable for oxidizing various chemical and biological compounds thereby eradicating the same in situ as on surfaces, clothes, articles, and the like. Representative contaminants include mustard gas, nerve gas, bacterial toxins, anthrax, bird flu, and the like.
Process for making a granule
Process for making a powder or granule containing (A) at least one chelating agent selected from alkali metal salts of methyl glycine diacetic acid (MGDA) and of iminodisuccinic acid (IDS), (B) at least one compound of general formula (I a) or (I b) ##STR00001## wherein A.sup.1 is selected from (CH.sub.2).sub.a wherein the variable a is in the range of from 4 to 20, e is selected from zero and 1, and R.sup.1 being the same or different and selected from OC.sub.1-C.sub.10-alkyl and C.sub.1-C.sub.10-alkyl, and, optionally, (C) at least one homo- or copolymer of (meth)acrylic acid, partially or fully neutralized with alkali, said process comprising the steps of (a) providing an aqueous solution or slurry containing chelating agent (A) and said compound (B) and, if applicable, (co)polymer (C), with a pH value in the range of from 10 to 12, (b) removing most of said water by spray drying or spray granulation.