System for selectively contacting a cleaning composition with a surface of a turbine engine component is presented. The system includes a cleaning apparatus and a manifold assembly. The cleaning apparatus includes an upper portion and a lower portion defining a cleaning chamber configured to allow selective contact between the cleaning composition and a surface of the first portion of the turbine engine component. The upper portion includes a plurality of fill holes in fluid communication with the cleaning chamber, and the lower portion includes a plurality of drain holes in fluid communication with the cleaning chamber. The manifold assembly is configured to selectively circulate the cleaning composition from a reservoir to the cleaning chamber via the plurality of fill holes, and recirculate the cleaning composition from the cleaning chamber to the reservoir via the plurality of drain holes. Methods for selectively cleaning a turbine engine component is also presented.

A cleaning sachet for removing carbon deposit and rust on a gun element, and a cleaning method thereof, uses cleaning powder that includes aluminum oxide making up 75.000% to 99.989% by weight of the cleaning powder, zinc peroxide making up 0.010% to 9.000% by weight of the cleaning powder, and nano zinc oxide making up 0.001% to 6.000% by weight of the cleaning powder. A user can lay the cleaning sachet on a carbon-deposited and/or rusting area of the gun element before or after moistening the cleaning sachet with a lubricating oil, and then wipe the carbon-deposited and/or rusting area with the cleaning sachet after waiting a period of time. Therefore, the colloidal solution formed by mixing the lubricating oil and the cleaning powder and released out of the cleaning sachet can remove the carbon deposit and/or rust on the surface of the gun element.

A cleaning composition is provided herein. The cleaning composition includes a plurality of metal particles and a base fluid. The plurality of metal particles have an average size in a range of from about 1 nanometer (nm) to about 10,000 micrometers (μm), and are dispersed in the base fluid. The cleaning composition is configured to generate an exothermic reaction when contacted with one or more components on a surface and water to facilitate removal of the one or more components from the surface. Methods of making and utilizing the cleaning composition are also provided.

A cleaning composition is provided herein. The cleaning composition includes a plurality of metal particles and a base fluid. The plurality of metal particles have an average size in a range of from about 1 nanometer (nm) to about 10,000 micrometers (μm), and are dispersed in the base fluid. The cleaning composition is configured to generate an exothermic reaction when contacted with one or more components on a surface and water to facilitate removal of the one or more components from the surface. Methods of making and utilizing the cleaning composition are also provided.

The object of the present invention is to provide a cleaning agent that is superior in the initial cleaning effect and allows residues to be easily distributed evenly in the next fabricated molded article. The object is achieved by a cleaning agent used for a molding machine and including a thermoplastic resin and a glass wool.

The object of the present invention is to provide a cleaning agent that is superior in the initial cleaning effect and allows residues to be easily distributed evenly in the next fabricated molded article. The object is achieved by a cleaning agent used for a molding machine and including a thermoplastic resin and a glass wool.

An object of the present invention is to provide a treatment liquid for a semiconductor substrate, which has excellent corrosion prevention performance for a metal-containing layer. In addition, another object of the present invention is to provide a chemical mechanical polishing method and a method for treating a semiconductor substrate.

The treatment liquid of an embodiment of the present invention is a treatment liquid for a semiconductor substrate, which includes a component A having two or more onium structures in the molecule and water, and has a pH of 6.0 to 13.5 at 25° C.

This invention is related to a process for purification of metallic objects comprising an oil-adsorbing step in the presence of a liquid and a layer silicate component.

This invention is related to a process for purification of metallic objects comprising an oil-adsorbing step in the presence of a liquid and a layer silicate component.

Disclosed are a composite glass composition for washing and cleaning and a method for producing composite glass powder using the same, in which a silicate-based glass composition containing an alkali oxide for activating water into alkaline water and a bleaching agent having bleaching performance are mixed or coated. Accordingly, since the silicate-based glass composition containing an alkali oxide can ionize water in place of a surfactant contained in existing synthetic detergents, washing and cleaning capacity equivalent to or greater than existing synthetic detergents can be secured with alkaline water ionized from water.