A cleaning composition which is used for cleaning a coating film forming device, the composition including an acid component having a pKa of 12 or less.

A composition for cleaning a substrate is provided. According to an embodiment, the composition for cleaning the substrate includes an organic solvent having a Hansen solubility parameter of 5 or more to 12 or less for polystyrene latex to the substrate.

The invention relates to a process for removing red oils deposits formed in an installation comprising the use of a cleaning agent comprising one or more fatty acid esters to dissolve the red oils deposit and to form a mixture comprising the cleaning agent and the dissolved red oils; and removing the mixture comprising the cleaning agent and the dissolved red oils.

A reloadable microcapsule contains a microcapsule core and a microcapsule wall encapsulating the microcapsule core. The microcapsule core contains a hydrophobic core solvent and a hydrophilic core solvent, and the microcapsule wall, formed of an encapsulating polymer, is permeable to the hydrophilic core solvent. Also disclosed are methods of preparing the reloadable microcapsule and consumer products having the microcapsules.

An article for cleaning or hand-washing an object includes a core substrate comprising a plurality of fibers including a resin. The core substrate has one or more abrasive surfaces and contains an active cleaning formulation. The resin and the core substrate are water-dispersible upon contact with water at a low temperature, such as 40° C. or below, and water-soluble upon contact with water at a higher temperature. Also disclosed are methods for making the article.

A reloadable microcapsule contains a microcapsule core and a microcapsule wall encapsulating the microcapsule core. The microcapsule core contains a hydrophobic core solvent and a hydrophilic core solvent, and the microcapsule wall, formed of an encapsulating polymer, is permeable to the hydrophilic core solvent. Also disclosed are methods of preparing the reloadable microcapsule and consumer products having the microcapsules.

The present invention pertains to: a composition capable of removing dry etching residue present on the surface of a semiconductor integrated circuit, while suppressing alumina damage in a production process for the semiconductor integrated circuit; a cleaning method for semiconductor substrates that use alumina; and a production method for a semiconductor substrate having an alumina layer. This composition is characterized by containing 0.00005%-1% by mass of a barium compound (A) and 0.01%-20% by mass of a fluorine compound (B) and having a pH of 2.5-8.0.

This disclosure relates to a method to deink plastic material comprising or provided with ink. The method comprises the step of contacting the plastic material with an oxidizing inorganic acid having a standard electrode potential of at least 0 V. The disclosure also relates to a method to delaminate and deink plastic material by contacting the plastic material with an oxidizing inorganic acid and with a short chain or medium chain fatty acid. Furthermore, the disclosure relates to an installation to deink or to delaminate and deink plastic material.

The present invention provides a semiconductor substrate cleaning method including a step of removing an adhesive layer provided on a semiconductor substrate by use of a remover composition, wherein the remover composition contains a solvent but no salt; and the solvent includes an organic solvent represented by formula (L) (in the formula, each of L.sup.1 and L.sup.2 represents a C1 to C6 alkyl group, and the sum of the number of carbon atoms of the alkyl group L.sup.1 and that of the alkyl group L.sup.2 is 6 or less) in an amount of 80 mass % or more.

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Described herein are compositions and methods for use in automotive care. The present disclosure includes compositions directed to, for example, a wheel cleaner.