A doped electrode may be manufactured by doping an active material included in an electrode with an alkali metal in a dope solution containing a first aprotic solvent and an alkali metal salt. The doped electrode may be cleaned with a cleaning solution containing a second aprotic solvent that has a boiling point lower than that of the first aprotic solvent. The cleaning solution may be controlled such that a content ratio of the first aprotic solvent in the cleaning solution is 8 vol % or lower.

The present invention provides a composition which is suppressed in decrease of the etching rate over time. A composition which contains; at least one of a quaternary alkyl ammonium fluoride and a hydrate of a quaternary alkyl ammonium fluoride; (A) an N-substituted amide compound that has no active hydrogen on a nitrogen atom and (B) a dipropylene glycol dimethyl ether, which serve as aprotic solvents; and an antioxidant.

Disclosed herein are adhesive remover compositions, methods of making such compositions, and methods of using such compositions. In one aspect, an adhesive remover composition comprises cyclopentasiloxane, dimethicone, and a blend or mixture of dimethicone and dimethiconol.

A sensor array includes a plurality of sensors. A sensor of the plurality of sensors has a sensor pad exposed at a surface of the sensor array. A method of treating the sensor array includes exposing at least the sensor pad to a wash solution including sulfonic acid and an organic solvent and rinsing the wash solution from the sensor pad.

A cleaning composition, which is suitable for cleaning fuel delivery systems, air-intake systems, intake valves, and combustion chambers, includes at least 3 wt. % of a polyether component, at least 5 wt. % of a polar solvent, and at least 5 wt. % a non-polar solvent. The polyether component is selected from polyethers, polyetheramines, and mixtures thereof.

Described herein is a method of using a composition including 0.1 to 3% by weight ammonia and a C.sub.1 to C.sub.4 alkanol. The method includes using the composition for anti-pattern collapse treatment of a substrate including patterned material layers having line-space dimensions with a line width of 50 nm or less, aspect ratios of greater than or equal to 4, or a combination thereof.

The present invention relates to a method for removing a foreign material from the surface of an article comprising the following steps: i) providing an article having a surface covered at least partly with a foreign material; ii) contacting the article provided in step i) with a cleaning medium being an acid having a pKa in the range from −10 to 7 having a minimum concentration of 1 wt.-% and with a carrier medium having a density different from the density of the cleaning medium to obtain a mixture comprising the foreign material solved and/or dispersed in the cleaning medium, the carrier medium and the article free from the foreign material; iii) allowing the mixture obtained in step ii) to separate to obtain a heterophasic emulsion comprising at least a first phase comprising the carrier medium and the article free from the foreign material and a second phase comprising the cleaning medium and the foreign material solved and/or dispersed therein; iv) separating the phases obtained in step iii); and v) separating the article free from the foreign material from the carrier medium. Furthermore, the present invention relates to an installation for carrying out the inventive process.

The present application provides compositions comprising 1,2-dichloro-1,2-difluoroethylene (i.e., CFO-1112) and, optionally, an additional component. The present application further provides use of the compositions provided herein in cleaning, solvent, carrier fluid, and deposition applications.

Disclosed herein is a decontaminant aqueous solution for decontaminating diisocyanate drum, including 20-97 wt % of at least one alcohol or derivative thereof, based on the total weight of decontaminant aqueous solution, and an alkaline source in an amount effective to provide the solution a pH of at least 8. Further disclosed herein is a method for decontaminating diisocyanate residues in an emptied drum with the decontaminant aqueous solution.

An object of the present invention is to provide a treatment liquid for a semiconductor device, which is excellent in removal performance for residues present on a substrate, and to provide a substrate washing method using the treatment liquid.

The treatment liquid of the present invention is a treatment liquid for a semiconductor device, which includes water, a basic compound, hexylene glycol, and a compound A that is at least one kind selected from the group consisting of isobutene, (E)-2-methyl-1,3-pentadiene, 4-methyl-1,3-pentadiene, 2,2,4-trimethyloxetane, 4-methyl-3-penten-2-ol, and 2,4,4,6-tetramethyl-1,3-dioxane.