There is provided a process for treating particulate scrap material. The process includes emplacing the particulate scrap material and a reagent material within a calcining zone with effect that a reactive process is effected such that a calcined metal material product is obtained, and carbonylating a carbonylation precusor material with effect that a carbonylated product is obtained, wherein the carbonylation precursor material is derived from the calcined metal material product.

There is provided a process for treating particulate scrap material. The process includes emplacing the particulate scrap material and a reagent material within a calcining zone with effect that a reactive process is effected such that a calcined metal material product is obtained, and carbonylating a carbonylation precusor material with effect that a carbonylated product is obtained, wherein the carbonylation precursor material is derived from the calcined metal material product.

According to an embodiment, a method of forming a porous layer includes forming a porous layer containing a noble metal on a surface made of a semiconductor by displacement plating. The plating solution used in the displacement plating contains a noble metal source, hydrogen fluoride, and an adjusting agent adjusting a pH value or zeta potential. The noble metal source produces an ion containing the noble metal in water. The plating solution has a pH value in a range of 1 to 6.