Dynamic pattern transfer printing systems and method are provided, which decouple the design of the trench patterns on a source substrate for pattern transfer printing, from the resulting metallic paste lines patterns transferred to a receiving substrate, such as PV cells. The receiving substrate may be moved forward (along the scanning direction of the laser illumination used to transfer the paste from the trenches onto the receiving substrate) to reduce the pattern pitch with respect to the source substrate, and/or the receiving substrate may be moved backward (against the scanning direction) to increase the pattern pitch with respect to the source substrate. For example, dynamic pattern transfer printing may be used to accommodate different widths of the substrates for more effective pattern transfer, and/or to enable one-to-many pattern transfer technologies with high wafer throughput. Also, pattern transfer sheet with separate multiple groups of trenches are provided.

An optical device as described herein includes a host substrate fabricated from a dielectric material transparent in the Infrared range. Additionally, the optical device as discussed herein includes multiple elements disposed on the host substrate. The multiple elements are spaced apart from each other on the host substrate in accordance with a desired pattern. Each of the multiple elements disposed in the host substrate is fabricated from a second material having a refractive index of greater than 4.5. Such an optical device provides an improvement over conventional optical devices that operate in the Infrared range.

A method for the transfer of components from a sender substrate to a receiver substrate includes provision and/or production of the components on the sender substrate, transfer of the components of the sender substrate to the transfer substrate, and transfer of the components from the transfer substrate to the receiver substrate.The components can be transferred selectively by means of bonding means and/or debonding means.

A method may include providing a set of features in a mask layer, wherein a given feature comprises a first dimension along a first direction, second dimension along a second direction, orthogonal to the first direction, and directing an angled ion beam to a first side region of the set of features in a first exposure, wherein the first side region is etched a first amount along the first direction. The method may include directing an angled deposition beam to a second side region of the set of features in a second exposure, wherein a protective layer is formed on the second side region, the second side region being oriented perpendicularly with respect to the first side region. The method may include directing the angled ion beam to the first side region in a third exposure, wherein the first side region is etched a second amount along the first direction.

A method for printing uses at least one ink. The method includes: a step of focusing a laser beam so as to generate a cavity in an ink film; a step of forming at least one ink droplet from a free surface of the ink film; and a step of depositing the droplet onto a depositing surface of a receiving substrate positioned at a given distance from the film. The laser beam is oriented in the direction opposite the gravitational force. The free surface of the film is oriented upwards towards the depositing surface placed above the ink film.

A method for 3D printing includes printing a first metallic material on a substrate as a support structure (48). A second metallic material, which is less anodic than the first metallic material, is printed on the substrate as a target structure (46), in contact with the support structure. The support structure is chemically removed from the target structure by applying a galvanic effect to selectively corrode the first metallic material.

The present disclosure relates to a method for producing an exchangeable electrode assembly, with at least one sensor body and at least a first electrode, for an electrochemical sensor for determining the concentration of an analyte in a gaseous or liquid measurement medium, a corresponding electrode assembly, and an electrochemical sensor with an electrode assembly according to the present disclosure. In order to produce the electrode assembly, the following method steps are performed: providing a sensor body, and applying at least a first electrically-conductive material to a first sub-region of the sensor body for producing a first electrode of the electrode assembly.

A doped diamond semiconductor and method of production using a laser is disclosed herein. As disclosed, a dopant and/or a diamond or sapphire seed material may be added to a graphite based ablative layer positioned below a confinement layer, the ablative layer also being graphite based and positioned above a backing layer, to promote formation of diamond particles having desirable semiconductor properties via the action of a laser beam upon the ablative layer. Dopants may be incorporated into the process to activate the reaction sought to produce a material useful in production of a doped semiconductor or a doped conductor suitable for the purpose of modulating the electrical, thermal or quantum properties of the material produced. As disclosed, the diamond particles formed by either the machine or method of confined pulsed laser deposition disclosed may be arranged as semiconductors, electrical components, thermal components, quantum components and/or integrated circuits.

A deposition mask includes a resin film defining a plurality of opening portions. Each opening portions extends through the resin film. The resin film includes a first surface and a second surface opposite to the first surface. The second surface is a surface faced to a vapor deposition source during vapor deposition. The resin film defines dents comprising laser marks on the first surface. A mask member for a deposition mask is also provided.

A method of fabricating an electrochemical device in an apparatus may comprise: providing an electrochemical device substrate; depositing a device layer over the substrate; applying electromagnetic radiation to the device layer in situ to effect one or more of surface restructuring, recrystallization and densification of the device layer; repeating the depositing and the applying until a desired device layer thickness is achieved. Furthermore, the applying may be during the depositing. A thin film battery may comprise: a substrate; a current collector on the substrate; a cathode layer on the current collector; an electrolyte layer on the cathode layer; and a lithium anode layer on the electrolyte layer; wherein the LLZO electrolyte layer has a crystalline phase, no shorts due to cracks in the LLZO electrolyte layer, and no highly resistive interlayer at the interface between the electrolyte layer and the cathode layer.